KR102302067B1 - 적층체의 제작 장치 - Google Patents

적층체의 제작 장치 Download PDF

Info

Publication number
KR102302067B1
KR102302067B1 KR1020140123007A KR20140123007A KR102302067B1 KR 102302067 B1 KR102302067 B1 KR 102302067B1 KR 1020140123007 A KR1020140123007 A KR 1020140123007A KR 20140123007 A KR20140123007 A KR 20140123007A KR 102302067 B1 KR102302067 B1 KR 102302067B1
Authority
KR
South Korea
Prior art keywords
unit
adhesive layer
support
layer
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020140123007A
Other languages
English (en)
Korean (ko)
Other versions
KR20150032486A (ko
Inventor
요시하루 히라카타
사토시 세오
Original Assignee
가부시키가이샤 한도오따이 에네루기 켄큐쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 한도오따이 에네루기 켄큐쇼 filed Critical 가부시키가이샤 한도오따이 에네루기 켄큐쇼
Publication of KR20150032486A publication Critical patent/KR20150032486A/ko
Application granted granted Critical
Publication of KR102302067B1 publication Critical patent/KR102302067B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/62—Inert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1858—Handling of layers or the laminate using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1875—Tensioning

Landscapes

  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
KR1020140123007A 2013-09-18 2014-09-16 적층체의 제작 장치 Expired - Fee Related KR102302067B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013193314 2013-09-18
JPJP-P-2013-193314 2013-09-18

Publications (2)

Publication Number Publication Date
KR20150032486A KR20150032486A (ko) 2015-03-26
KR102302067B1 true KR102302067B1 (ko) 2021-09-13

Family

ID=52666884

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140123007A Expired - Fee Related KR102302067B1 (ko) 2013-09-18 2014-09-16 적층체의 제작 장치

Country Status (3)

Country Link
US (1) US9981457B2 (enExample)
JP (3) JP6460689B2 (enExample)
KR (1) KR102302067B1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9229481B2 (en) 2013-12-20 2016-01-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR102358935B1 (ko) * 2014-02-12 2022-02-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 전자 기기
JP6378530B2 (ja) 2014-05-03 2018-08-22 株式会社半導体エネルギー研究所 フィルム吸着機構
CN106415814B (zh) 2014-05-03 2019-10-11 株式会社半导体能源研究所 薄膜状部件支撑设备
JP6548871B2 (ja) 2014-05-03 2019-07-24 株式会社半導体エネルギー研究所 積層体の基板剥離装置
KR102368997B1 (ko) 2014-06-27 2022-02-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치, 모듈, 전자 기기, 발광 장치의 제작 방법
WO2017115484A1 (ja) * 2015-12-28 2017-07-06 鴻海精密工業股▲ふん▼有限公司 有機ｅｌ表示装置の製造方法
US10259207B2 (en) 2016-01-26 2019-04-16 Semiconductor Energy Laboratory Co., Ltd. Method for forming separation starting point and separation method
US10279576B2 (en) 2016-04-26 2019-05-07 Semiconductor Energy Laboratory Co., Ltd. Peeling method and manufacturing method of flexible device
US10804407B2 (en) 2016-05-12 2020-10-13 Semiconductor Energy Laboratory Co., Ltd. Laser processing apparatus and stack processing apparatus
IT201600087263A1 (it) * 2016-08-25 2018-02-25 Automatic Lamination Tech S R L Apparecchiatura per la realizzazione di un pannello composito comprendente una pellicola biadesiva interposta tra due sottili lastre metalliche
CN107120875B (zh) * 2017-05-09 2022-05-20 澳柯玛股份有限公司 一种使内冷凝器贴合箱壳的装置及方法
CN110216975B (zh) * 2019-07-09 2025-03-11 安吉八塔机器人有限公司 一种多功能复合机器人系统
CN110881252B (zh) * 2019-11-26 2021-02-19 南通深南电路有限公司 印制电路板生产设备的控制方法及印制电路板生产设备
CN111683460A (zh) * 2020-05-26 2020-09-18 江西源盛泰电子科技有限公司 一种fpc钢片生产设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008015041A (ja) * 2006-07-03 2008-01-24 Dainippon Printing Co Ltd アライメント貼合装置及びアライメント貼合方法

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6052822A (ja) * 1983-09-02 1985-03-26 Tokyo Erekutoron Kk レーザｃｖｄ装置
JPH0793485B2 (ja) * 1988-05-16 1995-10-09 カシオ計算機株式会社 Ｉｃユニットの接続方法
JPH02308126A (ja) * 1989-05-23 1990-12-21 Idemitsu Kosan Co Ltd 液晶光学素子の製造方法及びその装置
JP2810532B2 (ja) 1990-11-29 1998-10-15 キヤノン株式会社 堆積膜形成方法及び堆積膜形成装置
JP2975151B2 (ja) 1991-03-28 1999-11-10 キヤノン株式会社 半導体素子の連続的製造装置
JP3118037B2 (ja) 1991-10-28 2000-12-18 キヤノン株式会社 堆積膜形成方法および堆積膜形成装置
US6183816B1 (en) 1993-07-20 2001-02-06 Semiconductor Energy Laboratory Co., Ltd. Method of fabricating the coating
US5457299A (en) * 1993-10-29 1995-10-10 International Business Machines Corporation Semiconductor chip packaging method which heat cures an encapsulant deposited on a chip using a laser beam to heat the back side of the chip
JP3175894B2 (ja) 1994-03-25 2001-06-11 株式会社半導体エネルギー研究所 プラズマ処理装置及びプラズマ処理方法
JPH08153759A (ja) * 1994-11-29 1996-06-11 Nec Yamagata Ltd シングルポイントボンダーおよび半導体装置の製造方法
JP3698749B2 (ja) 1995-01-11 2005-09-21 株式会社半導体エネルギー研究所 液晶セルの作製方法およびその作製装置、液晶セルの生産システム
US5736431A (en) 1995-02-28 1998-04-07 Semiconductor Energy Laboratory Co., Ltd. Method for producing thin film solar battery
US6273955B1 (en) 1995-08-28 2001-08-14 Canon Kabushiki Kaisha Film forming apparatus
JPH10328612A (ja) * 1997-05-29 1998-12-15 Idemitsu Kosan Co Ltd 液晶光学素子の製造方法
JPH11204548A (ja) * 1998-01-09 1999-07-30 Hitachi Cable Ltd 半導体チップの貼付方法および貼付装置
JP4293385B2 (ja) 1998-01-27 2009-07-08 株式会社半導体エネルギー研究所 光電変換装置の作製方法
US20030009876A1 (en) * 2000-01-14 2003-01-16 Akira Yamauchi Method and device for chip mounting
JP2001316818A (ja) 2000-02-29 2001-11-16 Canon Inc 膜形成方法及び形成装置、並びにシリコン系膜、起電力素子及びそれを用いた太陽電池、センサー及び撮像素子
JP4316767B2 (ja) 2000-03-22 2009-08-19 株式会社半導体エネルギー研究所 基板処理装置
JP2001274179A (ja) * 2000-03-28 2001-10-05 Hitachi Ltd チップマウンタおよび半導体装置の製造方法
US6680724B2 (en) * 2001-05-31 2004-01-20 Hewlett-Packard Development Company, L.P. Flexible electronic viewing device
JP4027740B2 (ja) 2001-07-16 2007-12-26 株式会社半導体エネルギー研究所 半導体装置の作製方法
TW564471B (en) 2001-07-16 2003-12-01 Semiconductor Energy Lab Semiconductor device and peeling off method and method of manufacturing semiconductor device
TW558743B (en) * 2001-08-22 2003-10-21 Semiconductor Energy Lab Peeling method and method of manufacturing semiconductor device
US6885146B2 (en) 2002-03-14 2005-04-26 Semiconductor Energy Laboratory Co., Ltd. Display device comprising substrates, contrast medium and barrier layers between contrast medium and each of substrates
EP1376658B1 (en) * 2002-06-25 2011-07-06 Kabushiki Kaisha Toshiba Method and apparatus for manufacturing semiconductor device
EP1592049A1 (en) 2003-02-05 2005-11-02 Sel Semiconductor Energy Laboratory Co., Ltd. Process for manufacturing display
US7554121B2 (en) 2003-12-26 2009-06-30 Semiconductor Energy Laboratory Co., Ltd. Organic semiconductor device
JP4505721B2 (ja) * 2004-02-02 2010-07-21 セイコーエプソン株式会社 電気光学装置およびこれを備えた電子機器
CN101527270B (zh) 2004-06-02 2012-07-04 株式会社半导体能源研究所 一种半导体设备
US7591863B2 (en) 2004-07-16 2009-09-22 Semiconductor Energy Laboratory Co., Ltd. Laminating system, IC sheet, roll of IC sheet, and method for manufacturing IC chip
KR101254277B1 (ko) 2004-07-30 2013-04-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 라미네이팅 시스템, ｉｃ 시트, ｉｃ 시트 두루마리, 및ｉｃ 칩의 제조방법
US8040469B2 (en) 2004-09-10 2011-10-18 Semiconductor Energy Laboratory Co., Ltd. Display device, method for manufacturing the same and apparatus for manufacturing the same
JP2006323032A (ja) * 2005-05-17 2006-11-30 Sony Corp フラットパネルディスプレイディバイスの欠陥画素リペア装置及びその欠陥画素リペア方法
JP4916680B2 (ja) * 2005-06-30 2012-04-18 株式会社半導体エネルギー研究所 半導体装置の作製方法、剥離方法
US7666766B2 (en) 2005-09-27 2010-02-23 Semiconductor Energy Laboratory Co., Ltd. Film formation apparatus, method for forming film, and method for manufacturing photoelectric conversion device
US20070183184A1 (en) 2006-02-03 2007-08-09 Semiconductor Energy Laboratory Ltd. Apparatus and method for manufacturing semiconductor device
TWI611565B (zh) 2006-09-29 2018-01-11 半導體能源研究所股份有限公司 半導體裝置的製造方法
US8137417B2 (en) 2006-09-29 2012-03-20 Semiconductor Energy Laboratory Co., Ltd. Peeling apparatus and manufacturing apparatus of semiconductor device
KR100781708B1 (ko) * 2006-10-12 2007-12-03 삼성전자주식회사 플렉서블 표시부 및 그를 갖는 휴대 단말기
JP5108293B2 (ja) * 2006-12-20 2012-12-26 富士フイルム株式会社 携帯機器及び撮像装置
US7897482B2 (en) * 2007-05-31 2011-03-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US8387674B2 (en) * 2007-11-30 2013-03-05 Taiwan Semiconductor Manufacturing Comany, Ltd. Chip on wafer bonder
KR20110007134A (ko) * 2008-04-17 2011-01-21 아사히 가라스 가부시키가이샤 유리 적층체, 지지체를 부착한 표시 장치용 패널 및 이들의 제조 방법
JP5151653B2 (ja) * 2008-04-23 2013-02-27 大日本印刷株式会社 貼合装置及び貼合方法
JP2010267420A (ja) * 2009-05-13 2010-11-25 Panasonic Corp 有機ｅｌ素子検査リペア方法および装置
WO2011024690A1 (ja) * 2009-08-27 2011-03-03 旭硝子株式会社 フレキシブル基材－支持体の積層構造体、支持体付き電子デバイス用パネル、および電子デバイス用パネルの製造方法
KR101176474B1 (ko) * 2011-05-12 2012-08-24 주식회사 코윈디에스티 픽셀재생장치 및 이를 이용한 픽셀재생방법
US9487880B2 (en) 2011-11-25 2016-11-08 Semiconductor Energy Laboratory Co., Ltd. Flexible substrate processing apparatus
DE102012101210A1 (de) * 2012-02-15 2013-08-22 Maxim Stührenberg Anzeigevorrichtung mit einem Gehäuse und mit einer flexiblen elektronisch ansteuerbaren Anzeigeeinrichtung

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008015041A (ja) * 2006-07-03 2008-01-24 Dainippon Printing Co Ltd アライメント貼合装置及びアライメント貼合方法

Also Published As

Publication number Publication date
KR20150032486A (ko) 2015-03-26
JP6732002B2 (ja) 2020-07-29
JP6460689B2 (ja) 2019-01-30
JP2020184090A (ja) 2020-11-12
US20150075720A1 (en) 2015-03-19
US9981457B2 (en) 2018-05-29
JP2019091698A (ja) 2019-06-13
JP2015083373A (ja) 2015-04-30

Similar Documents

Publication Publication Date Title
KR102302067B1 (ko) 적층체의 제작 장치
US12464889B2 (en) Light-emitting device and method for manufacturing light-emitting device
JP6870139B2 (ja) 剥離方法
JP6911183B2 (ja) 半導体装置
JP6725720B2 (ja) 剥離方法
US10079353B2 (en) Light-emitting device with flexible substrates
US9770894B2 (en) Peeling apparatus and stack manufacturing apparatus
JP2020004979A (ja) 剥離装置
JP2013175285A (ja) 発光装置の作製方法

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20240909

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20240909