KR102294321B1 - 액 처리 장치 - Google Patents

액 처리 장치 Download PDF

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Publication number
KR102294321B1
KR102294321B1 KR1020140147230A KR20140147230A KR102294321B1 KR 102294321 B1 KR102294321 B1 KR 102294321B1 KR 1020140147230 A KR1020140147230 A KR 1020140147230A KR 20140147230 A KR20140147230 A KR 20140147230A KR 102294321 B1 KR102294321 B1 KR 102294321B1
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South Korea
Prior art keywords
substrate
liquid
wafer
processing
guide
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KR1020140147230A
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English (en)
Korean (ko)
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KR20150050416A (ko
Inventor
지로 히가시지마
유이치 도우키
마사미 아키모토
시게히사 이노우에
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도쿄엘렉트론가부시키가이샤
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Publication of KR20150050416A publication Critical patent/KR20150050416A/ko
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Publication of KR102294321B1 publication Critical patent/KR102294321B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020140147230A 2013-10-30 2014-10-28 액 처리 장치 Active KR102294321B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-225380 2013-10-30
JP2013225380A JP6090113B2 (ja) 2013-10-30 2013-10-30 液処理装置

Publications (2)

Publication Number Publication Date
KR20150050416A KR20150050416A (ko) 2015-05-08
KR102294321B1 true KR102294321B1 (ko) 2021-08-25

Family

ID=52994073

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140147230A Active KR102294321B1 (ko) 2013-10-30 2014-10-28 액 처리 장치

Country Status (3)

Country Link
US (1) US9953852B2 (https=)
JP (1) JP6090113B2 (https=)
KR (1) KR102294321B1 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10707099B2 (en) 2013-08-12 2020-07-07 Veeco Instruments Inc. Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle
US9768041B2 (en) 2013-08-12 2017-09-19 Veeco Precision Surface Processing Llc Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle
JP6592529B2 (ja) * 2015-05-14 2019-10-16 エーシーエム リサーチ （シャンハイ） インコーポレーテッド 基板のベベルおよび裏面を保護するための装置
JP6419053B2 (ja) 2015-10-08 2018-11-07 東京エレクトロン株式会社 基板処理方法および基板処理装置
KR102542886B1 (ko) * 2016-04-25 2023-06-12 동우 화인켐 주식회사 코팅용 지그 및 이를 이용한 코팅 방법
WO2018200398A1 (en) 2017-04-25 2018-11-01 Veeco Precision Surface Processing Llc Semiconductor wafer processing chamber
JP6571253B2 (ja) * 2018-08-20 2019-09-04 東京エレクトロン株式会社 基板処理方法および基板処理装置
JP7093703B2 (ja) * 2018-09-07 2022-06-30 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7213648B2 (ja) * 2018-09-27 2023-01-27 東京エレクトロン株式会社 基板処理装置
JP7315389B2 (ja) * 2019-06-28 2023-07-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7372068B2 (ja) * 2019-07-19 2023-10-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
KR102548765B1 (ko) * 2020-12-30 2023-06-29 세메스 주식회사 지지 유닛, 기판 처리 장치 및 방법
US11994801B2 (en) * 2021-05-13 2024-05-28 STATS ChipPAC Pte. Ltd. Semiconductor device and method of coating a semiconductor wafer with high viscosity liquid photoresist using N2 purge
KR102616061B1 (ko) * 2021-08-24 2023-12-20 (주)디바이스이엔지 바울 조립체를 포함하는 기판 처리장치
JP7731250B2 (ja) * 2021-09-22 2025-08-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR102869894B1 (ko) * 2021-10-08 2025-10-10 세메스 주식회사 기판처리장치 및 기판처리방법
CN114130782A (zh) * 2021-11-29 2022-03-04 上海华力微电子有限公司 单片晶圆药液回收装置及方法
KR102685984B1 (ko) * 2022-04-19 2024-07-17 삼성전자주식회사 스핀 코팅 장치 및 이를 이용한 포토레지스트 코팅 방법
JP2025028579A (ja) * 2023-08-18 2025-03-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法及び基板処理装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070240824A1 (en) 2006-04-18 2007-10-18 Tokyo Electron Limited Liquid processing apparatus
US20090253258A1 (en) 2008-04-04 2009-10-08 Tokyo Electron Limited Semiconductor manufacturing apparatus and semiconductor manufacturing method
US20110155177A1 (en) 2008-07-31 2011-06-30 Tokyo Electron Limited Method and device for cleaning a substrate and storage medium
JP2012199408A (ja) * 2011-03-22 2012-10-18 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2013211377A (ja) * 2012-03-30 2013-10-10 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE257277T1 (de) * 2000-10-31 2004-01-15 Sez Ag Vorrichtung zur flüssigkeitsbehandlung von scheibenförmigen gegenständen
ATE445229T1 (de) * 2006-04-18 2009-10-15 Tokyo Electron Ltd Flüssigkeitsverarbeitungsvorrichtung
JP4787103B2 (ja) 2006-07-28 2011-10-05 東京エレクトロン株式会社 液処理装置
JP4816747B2 (ja) * 2009-03-04 2011-11-16 東京エレクトロン株式会社 液処理装置及び液処理方法
JP6022430B2 (ja) * 2012-11-21 2016-11-09 東京エレクトロン株式会社 基板処理装置
JP6287750B2 (ja) * 2013-12-27 2018-03-07 東京エレクトロン株式会社 基板液処理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070240824A1 (en) 2006-04-18 2007-10-18 Tokyo Electron Limited Liquid processing apparatus
US20090253258A1 (en) 2008-04-04 2009-10-08 Tokyo Electron Limited Semiconductor manufacturing apparatus and semiconductor manufacturing method
US20110155177A1 (en) 2008-07-31 2011-06-30 Tokyo Electron Limited Method and device for cleaning a substrate and storage medium
JP2012199408A (ja) * 2011-03-22 2012-10-18 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2013211377A (ja) * 2012-03-30 2013-10-10 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
JP6090113B2 (ja) 2017-03-08
JP2015088598A (ja) 2015-05-07
US20150114561A1 (en) 2015-04-30
US9953852B2 (en) 2018-04-24
KR20150050416A (ko) 2015-05-08

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