KR102264482B1 - 열전도성 함불소 접착제 조성물 및 전기·전자 부품 - Google Patents

열전도성 함불소 접착제 조성물 및 전기·전자 부품 Download PDF

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Publication number
KR102264482B1
KR102264482B1 KR1020170045310A KR20170045310A KR102264482B1 KR 102264482 B1 KR102264482 B1 KR 102264482B1 KR 1020170045310 A KR1020170045310 A KR 1020170045310A KR 20170045310 A KR20170045310 A KR 20170045310A KR 102264482 B1 KR102264482 B1 KR 102264482B1
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KR
South Korea
Prior art keywords
group
component
thermally conductive
integer
adhesive composition
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KR1020170045310A
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English (en)
Korean (ko)
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KR20170117323A (ko
Inventor
히데노리 코시카와
마사시 미조로키
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신에쓰 가가꾸 고교 가부시끼가이샤
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Publication of KR20170117323A publication Critical patent/KR20170117323A/ko
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Publication of KR102264482B1 publication Critical patent/KR102264482B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J127/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers
    • C09J127/02—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J127/12—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
KR1020170045310A 2016-04-13 2017-04-07 열전도성 함불소 접착제 조성물 및 전기·전자 부품 KR102264482B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016080013A JP6515860B2 (ja) 2016-04-13 2016-04-13 熱伝導性含フッ素接着剤組成物及び電気・電子部品
JPJP-P-2016-080013 2016-04-13

Publications (2)

Publication Number Publication Date
KR20170117323A KR20170117323A (ko) 2017-10-23
KR102264482B1 true KR102264482B1 (ko) 2021-06-15

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KR1020170045310A KR102264482B1 (ko) 2016-04-13 2017-04-07 열전도성 함불소 접착제 조성물 및 전기·전자 부품

Country Status (3)

Country Link
JP (1) JP6515860B2 (ja)
KR (1) KR102264482B1 (ja)
CN (1) CN107286891B (ja)

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JP6801638B2 (ja) * 2017-12-12 2020-12-16 信越化学工業株式会社 熱硬化性フルオロポリエーテル系接着剤組成物及び電気・電子部品
JP2023525142A (ja) * 2020-05-14 2023-06-14 ダイキン アメリカ インコーポレイティッド 高温低アウトガスフッ素化サーマルインターフェース材料
US20230106881A1 (en) 2021-01-25 2023-04-06 Fuji Polymer Industries Co., Ltd. Thermally conductive silicone grease composition and method for producing the same
WO2022158029A1 (ja) 2021-01-25 2022-07-28 富士高分子工業株式会社 熱伝導性シリコーングリース組成物及びその製造方法
WO2022215292A1 (ja) 2021-04-08 2022-10-13 富士高分子工業株式会社 熱伝導性グリース組成物
US20240018405A1 (en) 2021-04-08 2024-01-18 Fuji Polymer Industries Co., Ltd. Thermally conductive grease composition
CN113604202B (zh) * 2021-06-25 2023-07-04 浙江巨化技术中心有限公司 一种组合物、浸没式液冷剂及其应用以及浸没式液冷系统

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Publication number Publication date
CN107286891A (zh) 2017-10-24
CN107286891B (zh) 2021-12-28
KR20170117323A (ko) 2017-10-23
JP6515860B2 (ja) 2019-05-22
JP2017190389A (ja) 2017-10-19

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