KR102264352B1 - 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 처리 장치 및 기판 처리 방법 Download PDF

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Publication number
KR102264352B1
KR102264352B1 KR1020197018515A KR20197018515A KR102264352B1 KR 102264352 B1 KR102264352 B1 KR 102264352B1 KR 1020197018515 A KR1020197018515 A KR 1020197018515A KR 20197018515 A KR20197018515 A KR 20197018515A KR 102264352 B1 KR102264352 B1 KR 102264352B1
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KR
South Korea
Prior art keywords
liquid
substrate
processing liquid
processing
liquid column
Prior art date
Application number
KR1020197018515A
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English (en)
Korean (ko)
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KR20190085129A (ko
Inventor
유타 니시무라
겐지 고바야시
세이 네고로
Original Assignee
가부시키가이샤 스크린 홀딩스
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Publication of KR20190085129A publication Critical patent/KR20190085129A/ko
Application granted granted Critical
Publication of KR102264352B1 publication Critical patent/KR102264352B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
    • H01L21/02343—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
KR1020197018515A 2017-01-16 2017-12-22 기판 처리 장치 및 기판 처리 방법 KR102264352B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017005292A JP6940281B2 (ja) 2017-01-16 2017-01-16 基板処理装置および基板処理方法
JPJP-P-2017-005292 2017-01-16
PCT/JP2017/046095 WO2018131428A1 (ja) 2017-01-16 2017-12-22 基板処理装置および基板処理方法

Publications (2)

Publication Number Publication Date
KR20190085129A KR20190085129A (ko) 2019-07-17
KR102264352B1 true KR102264352B1 (ko) 2021-06-11

Family

ID=62839486

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197018515A KR102264352B1 (ko) 2017-01-16 2017-12-22 기판 처리 장치 및 기판 처리 방법

Country Status (5)

Country Link
JP (1) JP6940281B2 (ja)
KR (1) KR102264352B1 (ja)
CN (1) CN110140198B (ja)
TW (1) TWI666070B (ja)
WO (1) WO2018131428A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11219930B2 (en) 2018-05-28 2022-01-11 Nagase Filter Co, Ltd. Filter cleaning method and filter cleaning apparatus
GB201815163D0 (en) 2018-09-18 2018-10-31 Lam Res Ag Wafer washing method and apparatus
TWI691358B (zh) * 2019-03-04 2020-04-21 日商長瀨過濾器股份有限公司 過濾器洗淨方法及過濾器洗淨裝置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001162239A (ja) * 1999-12-09 2001-06-19 Matsushita Electronics Industry Corp 超音波洗浄装置
JP2016136599A (ja) * 2015-01-23 2016-07-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

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JP2000000533A (ja) * 1998-06-15 2000-01-07 Dainippon Screen Mfg Co Ltd 基板洗浄方法及び基板洗浄ノズル並びに基板洗浄装置
JP2000021834A (ja) * 1998-06-26 2000-01-21 Sony Corp 高速ジェット超純水洗浄方法及びその装置
JP2000061362A (ja) * 1998-08-18 2000-02-29 Dainippon Screen Mfg Co Ltd 基板処理装置の処理液吐出ノズル
TW472296B (en) * 1999-05-25 2002-01-11 Ebara Corp Substrate treating apparatus and method of operating the same
JP4638402B2 (ja) * 2006-10-30 2011-02-23 大日本スクリーン製造株式会社 二流体ノズル、ならびにそれを用いた基板処理装置および基板処理方法
EP2270838B1 (en) * 2009-07-02 2019-06-12 IMEC vzw Method and apparatus for controlling optimal operation of acoustic cleaning
JP2011121009A (ja) * 2009-12-11 2011-06-23 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP5852898B2 (ja) 2011-03-28 2016-02-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2014110404A (ja) * 2012-12-04 2014-06-12 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP5980704B2 (ja) * 2013-03-15 2016-08-31 東京エレクトロン株式会社 基板処理方法および基板処理装置
US20140261572A1 (en) * 2013-03-15 2014-09-18 Dainippon Screen Mfg.Co., Ltd. Substrate treatment apparatus and substrate treatment method
JP6320762B2 (ja) * 2014-01-15 2018-05-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN110060925B (zh) * 2014-03-28 2023-02-17 株式会社斯库林集团 基板处理方法
JP6509577B2 (ja) * 2015-02-16 2019-05-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN106252258B (zh) * 2015-06-15 2018-12-07 株式会社思可林集团 基板处理装置
JP6402071B2 (ja) * 2015-06-15 2018-10-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001162239A (ja) * 1999-12-09 2001-06-19 Matsushita Electronics Industry Corp 超音波洗浄装置
JP2016136599A (ja) * 2015-01-23 2016-07-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Also Published As

Publication number Publication date
WO2018131428A1 (ja) 2018-07-19
KR20190085129A (ko) 2019-07-17
CN110140198A (zh) 2019-08-16
TWI666070B (zh) 2019-07-21
JP2018116977A (ja) 2018-07-26
TW201831237A (zh) 2018-09-01
CN110140198B (zh) 2023-03-21
JP6940281B2 (ja) 2021-09-22

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