KR102262967B1 - 양이온성 계면 활성제를 갖는 랩핑 슬러리 - Google Patents

양이온성 계면 활성제를 갖는 랩핑 슬러리 Download PDF

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KR102262967B1
KR102262967B1 KR1020167007365A KR20167007365A KR102262967B1 KR 102262967 B1 KR102262967 B1 KR 102262967B1 KR 1020167007365 A KR1020167007365 A KR 1020167007365A KR 20167007365 A KR20167007365 A KR 20167007365A KR 102262967 B1 KR102262967 B1 KR 102262967B1
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chloride
quaternium
cationic surfactant
salt
diamond
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Korean (ko)
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KR20160047504A (ko
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슈앙 지
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다이아몬드 이노베이션즈, 인크.
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1472—Non-aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H01L21/304—
    • H01L21/30625—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020167007365A 2013-08-23 2014-07-24 양이온성 계면 활성제를 갖는 랩핑 슬러리 Active KR102262967B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/974,588 2013-08-23
US13/974,588 US9388328B2 (en) 2013-08-23 2013-08-23 Lapping slurry having a cationic surfactant
PCT/US2014/047980 WO2015026477A1 (en) 2013-08-23 2014-07-24 Lapping slurry having a cationic surfactant

Publications (2)

Publication Number Publication Date
KR20160047504A KR20160047504A (ko) 2016-05-02
KR102262967B1 true KR102262967B1 (ko) 2021-06-08

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KR1020167007365A Active KR102262967B1 (ko) 2013-08-23 2014-07-24 양이온성 계면 활성제를 갖는 랩핑 슬러리

Country Status (13)

Country Link
US (1) US9388328B2 (https=)
EP (2) EP3036299B1 (https=)
JP (1) JP6491208B2 (https=)
KR (1) KR102262967B1 (https=)
CN (1) CN105579548A (https=)
BR (1) BR112016003781B1 (https=)
CA (1) CA2920837C (https=)
DK (1) DK3036299T3 (https=)
ES (1) ES2874899T3 (https=)
MY (1) MY179920A (https=)
SG (1) SG11201601038WA (https=)
TW (1) TWI662115B (https=)
WO (1) WO2015026477A1 (https=)

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US9633831B2 (en) * 2013-08-26 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition for polishing a sapphire surface and methods of using same
CN106147617A (zh) * 2015-04-28 2016-11-23 天津诺邦科技有限公司 一种多晶金刚石水基抛光液及其制备方法
EP3456624B1 (en) 2017-09-14 2020-01-01 AIRBUS HELICOPTERS DEUTSCHLAND GmbH A composite sandwich panel with a sandwich area
TWI640434B (zh) * 2017-12-14 2018-11-11 明志科技大學 Composite separator and preparation method thereof
CN108892509A (zh) * 2018-08-03 2018-11-27 宁波哈泰雷碳化物有限公司 一种用于陶瓷浇注成型的纳米碳化硅浆料的制备方法
CN114958302B (zh) * 2022-05-26 2024-06-18 珠海戴蒙斯科技有限公司 一种高效的研磨液及其制备方法和应用
TWI899712B (zh) * 2023-03-30 2025-10-01 美商戴蒙創新公司 具有改善的碳化矽移除率之鑽石基拋光組成物
CN121022350B (zh) * 2025-08-12 2026-03-03 惠州达诚微电子材料有限公司 一种高稳定性研磨膏、制备方法与应用

Citations (3)

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JP2010028086A (ja) * 2008-06-16 2010-02-04 Hitachi Chem Co Ltd Ｃｍｐ研磨剤、このｃｍｐ研磨剤を用いた研磨方法
JP2011098396A (ja) 2009-11-04 2011-05-19 Showa Denko Kk ラップ定盤及びラップ加工方法
CN103254799A (zh) * 2013-05-29 2013-08-21 陈玉祥 一种亲水金刚石悬浮研磨抛光液及其制备方法

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US4867757A (en) 1988-09-09 1989-09-19 Nalco Chemical Company Lapping slurry compositions with improved lap rate
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US5456735A (en) 1991-07-12 1995-10-10 Norton Company Method of abrading with boron suboxide (BxO) and the boron suboxide (BxO) articles and composition used
JP3576261B2 (ja) * 1995-03-29 2004-10-13 東京磁気印刷株式会社 分散／凝集状態を制御した遊離砥粒スラリー、その製造法及びその分散方法
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JP2010028086A (ja) * 2008-06-16 2010-02-04 Hitachi Chem Co Ltd Ｃｍｐ研磨剤、このｃｍｐ研磨剤を用いた研磨方法
JP2011098396A (ja) 2009-11-04 2011-05-19 Showa Denko Kk ラップ定盤及びラップ加工方法
CN103254799A (zh) * 2013-05-29 2013-08-21 陈玉祥 一种亲水金刚石悬浮研磨抛光液及其制备方法

Also Published As

Publication number Publication date
CA2920837C (en) 2021-07-27
JP2016532757A (ja) 2016-10-20
EP3036299B1 (en) 2021-04-21
TW201510201A (zh) 2015-03-16
WO2015026477A1 (en) 2015-02-26
EP3036299A1 (en) 2016-06-29
KR20160047504A (ko) 2016-05-02
JP6491208B2 (ja) 2019-03-27
US9388328B2 (en) 2016-07-12
US20150052822A1 (en) 2015-02-26
BR112016003781B1 (pt) 2022-05-17
MY179920A (en) 2020-11-19
TWI662115B (zh) 2019-06-11
EP3653683A1 (en) 2020-05-20
BR112016003781A2 (https=) 2017-08-01
ES2874899T3 (es) 2021-11-05
CA2920837A1 (en) 2015-02-26
DK3036299T3 (da) 2021-06-28
CN105579548A (zh) 2016-05-11
SG11201601038WA (en) 2016-03-30

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