KR102262348B1 - 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 처리 장치 및 기판 처리 방법 Download PDF

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Publication number
KR102262348B1
KR102262348B1 KR1020217001696A KR20217001696A KR102262348B1 KR 102262348 B1 KR102262348 B1 KR 102262348B1 KR 1020217001696 A KR1020217001696 A KR 1020217001696A KR 20217001696 A KR20217001696 A KR 20217001696A KR 102262348 B1 KR102262348 B1 KR 102262348B1
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KR
South Korea
Prior art keywords
substrate
guard
unit
disposed
nozzle
Prior art date
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KR1020217001696A
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English (en)
Korean (ko)
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KR20210010641A (ko
Inventor
마사유키 하야시
게이지 이와타
Original Assignee
가부시키가이샤 스크린 홀딩스
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Publication of KR20210010641A publication Critical patent/KR20210010641A/ko
Application granted granted Critical
Publication of KR102262348B1 publication Critical patent/KR102262348B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020217001696A 2016-08-24 2017-08-16 기판 처리 장치 및 기판 처리 방법 KR102262348B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2016-163744 2016-08-24
JP2016163744A JP6817748B2 (ja) 2016-08-24 2016-08-24 基板処理装置および基板処理方法
KR1020197002420A KR102208292B1 (ko) 2016-08-24 2017-08-16 기판 처리 장치 및 기판 처리 방법
PCT/JP2017/029466 WO2018037982A1 (ja) 2016-08-24 2017-08-16 基板処理装置および基板処理方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020197002420A Division KR102208292B1 (ko) 2016-08-24 2017-08-16 기판 처리 장치 및 기판 처리 방법

Publications (2)

Publication Number Publication Date
KR20210010641A KR20210010641A (ko) 2021-01-27
KR102262348B1 true KR102262348B1 (ko) 2021-06-07

Family

ID=61246668

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020217001696A KR102262348B1 (ko) 2016-08-24 2017-08-16 기판 처리 장치 및 기판 처리 방법
KR1020197002420A KR102208292B1 (ko) 2016-08-24 2017-08-16 기판 처리 장치 및 기판 처리 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020197002420A KR102208292B1 (ko) 2016-08-24 2017-08-16 기판 처리 장치 및 기판 처리 방법

Country Status (5)

Country Link
JP (1) JP6817748B2 (zh)
KR (2) KR102262348B1 (zh)
CN (1) CN109564862B (zh)
TW (2) TWI661467B (zh)
WO (1) WO2018037982A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6642597B2 (ja) * 2018-02-02 2020-02-05 信越半導体株式会社 ウェーハ洗浄処理装置及びウェーハ洗浄方法
JP7149087B2 (ja) * 2018-03-26 2022-10-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7068044B2 (ja) * 2018-05-30 2022-05-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7197376B2 (ja) * 2019-01-17 2022-12-27 東京エレクトロン株式会社 基板処理方法及び基板処理装置
KR102271566B1 (ko) * 2019-10-28 2021-07-01 세메스 주식회사 기판 처리 장치
CN111890218B (zh) * 2020-07-04 2021-09-03 林燕 一种旋转升降的化学机械研磨防溅罩
JP2023018993A (ja) * 2021-07-28 2023-02-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001087725A (ja) 1999-09-22 2001-04-03 Dainippon Screen Mfg Co Ltd 基板洗浄装置および基板洗浄方法
JP2008080288A (ja) 2006-09-28 2008-04-10 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2013077595A (ja) 2011-09-29 2013-04-25 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3398532B2 (ja) 1995-09-28 2003-04-21 大日本スクリーン製造株式会社 基板回転式現像装置
JP2009135396A (ja) * 2007-11-06 2009-06-18 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
US8501025B2 (en) * 2010-03-31 2013-08-06 Dainippon Screen Mfg. Co., Ltd. Substrate treatment apparatus and substrate treatment method
JP5220839B2 (ja) * 2010-12-28 2013-06-26 東京エレクトロン株式会社 液処理装置および液処理方法
JP6282904B2 (ja) * 2014-03-14 2018-02-21 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6502037B2 (ja) * 2014-08-15 2019-04-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001087725A (ja) 1999-09-22 2001-04-03 Dainippon Screen Mfg Co Ltd 基板洗浄装置および基板洗浄方法
JP2008080288A (ja) 2006-09-28 2008-04-10 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2013077595A (ja) 2011-09-29 2013-04-25 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
CN109564862B (zh) 2023-06-13
TWI728346B (zh) 2021-05-21
CN109564862A (zh) 2019-04-02
TW201937552A (zh) 2019-09-16
KR20190021418A (ko) 2019-03-05
TWI661467B (zh) 2019-06-01
JP6817748B2 (ja) 2021-01-20
JP2018032728A (ja) 2018-03-01
KR20210010641A (ko) 2021-01-27
WO2018037982A1 (ja) 2018-03-01
TW201816841A (zh) 2018-05-01
KR102208292B1 (ko) 2021-01-26

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