KR102252945B1 - 워크의 평면 연삭 방법 - Google Patents

워크의 평면 연삭 방법 Download PDF

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Publication number
KR102252945B1
KR102252945B1 KR1020150026470A KR20150026470A KR102252945B1 KR 102252945 B1 KR102252945 B1 KR 102252945B1 KR 1020150026470 A KR1020150026470 A KR 1020150026470A KR 20150026470 A KR20150026470 A KR 20150026470A KR 102252945 B1 KR102252945 B1 KR 102252945B1
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KR
South Korea
Prior art keywords
work
grindstone
grinding
slurry
circumferential speed
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KR1020150026470A
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English (en)
Korean (ko)
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KR20150100577A (ko
Inventor
하루유키 히라야마
가즈히로 유소우
Original Assignee
고요 기카이 고교 가부시키가이샤
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Publication of KR20150100577A publication Critical patent/KR20150100577A/ko
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Publication of KR102252945B1 publication Critical patent/KR102252945B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/013—Application of loose grinding agent as auxiliary tool during truing operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/03—Manufacturing methods
    • H01L2224/036—Manufacturing methods by patterning a pre-deposited material
    • H01L2224/03602—Mechanical treatment, e.g. polishing, grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
KR1020150026470A 2014-02-25 2015-02-25 워크의 평면 연삭 방법 KR102252945B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014034659A JP6243255B2 (ja) 2014-02-25 2014-02-25 ワークの平面研削方法
JPJP-P-2014-034659 2014-02-25

Publications (2)

Publication Number Publication Date
KR20150100577A KR20150100577A (ko) 2015-09-02
KR102252945B1 true KR102252945B1 (ko) 2021-05-18

Family

ID=53782699

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150026470A KR102252945B1 (ko) 2014-02-25 2015-02-25 워크의 평면 연삭 방법

Country Status (7)

Country Link
US (1) US9669511B2 (zh)
JP (1) JP6243255B2 (zh)
KR (1) KR102252945B1 (zh)
CN (1) CN104858737B (zh)
DE (1) DE102015203109A1 (zh)
RU (1) RU2686974C2 (zh)
TW (1) TWI642517B (zh)

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* Cited by examiner, † Cited by third party
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US9855637B2 (en) * 2014-04-10 2018-01-02 Apple Inc. Thermographic characterization for surface finishing process development
WO2016039057A1 (ja) 2014-09-10 2016-03-17 株式会社村田製作所 金属間化合物の生成方法
KR102465703B1 (ko) * 2017-11-22 2022-11-11 주식회사 케이씨텍 화학 기계적 연마 장치 및 화학 기계적 연마 방법
JP7108450B2 (ja) * 2018-04-13 2022-07-28 株式会社ディスコ 研磨装置
JP7301512B2 (ja) * 2018-09-13 2023-07-03 株式会社岡本工作機械製作所 基板研削装置及び基板研削方法
CN110270891B (zh) * 2019-07-17 2020-06-19 浙江台佳电子信息科技有限公司 Vr投显用晶圆级玻璃基片生产工艺
JP2022074517A (ja) * 2020-11-04 2022-05-18 株式会社ディスコ 被加工物の研削方法
CN113770823A (zh) * 2021-09-28 2021-12-10 湖南圣高机械科技有限公司 一种平面研磨机
CN115781494A (zh) * 2022-12-01 2023-03-14 中国科学院西安光学精密机械研究所 一种往复式研磨抛光加工装置及光学元件加工方法

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JP2000117616A (ja) * 1998-08-11 2000-04-25 Hitachi Ltd 半導体装置の製造方法及び加工装置
US20080220698A1 (en) * 2007-03-07 2008-09-11 Stanley Monroe Smith Systems and methods for efficient slurry application for chemical mechanical polishing
JP2011142201A (ja) * 2010-01-07 2011-07-21 Okamoto Machine Tool Works Ltd 半導体基板の平坦化加工装置および平坦化加工方法

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Publication number Priority date Publication date Assignee Title
JP2000117616A (ja) * 1998-08-11 2000-04-25 Hitachi Ltd 半導体装置の製造方法及び加工装置
US20080220698A1 (en) * 2007-03-07 2008-09-11 Stanley Monroe Smith Systems and methods for efficient slurry application for chemical mechanical polishing
JP2011142201A (ja) * 2010-01-07 2011-07-21 Okamoto Machine Tool Works Ltd 半導体基板の平坦化加工装置および平坦化加工方法

Also Published As

Publication number Publication date
RU2015106005A (ru) 2016-09-10
TW201544255A (zh) 2015-12-01
RU2686974C2 (ru) 2019-05-06
JP6243255B2 (ja) 2017-12-06
KR20150100577A (ko) 2015-09-02
CN104858737B (zh) 2020-12-25
TWI642517B (zh) 2018-12-01
US9669511B2 (en) 2017-06-06
RU2015106005A3 (zh) 2018-10-01
DE102015203109A1 (de) 2015-08-27
CN104858737A (zh) 2015-08-26
JP2015160249A (ja) 2015-09-07
US20150239089A1 (en) 2015-08-27

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