KR102250506B1 - 기판 처리 장치 및 기판 유지 부재 - Google Patents

기판 처리 장치 및 기판 유지 부재 Download PDF

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Publication number
KR102250506B1
KR102250506B1 KR1020140095721A KR20140095721A KR102250506B1 KR 102250506 B1 KR102250506 B1 KR 102250506B1 KR 1020140095721 A KR1020140095721 A KR 1020140095721A KR 20140095721 A KR20140095721 A KR 20140095721A KR 102250506 B1 KR102250506 B1 KR 102250506B1
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South Korea
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substrate
holding member
substrate holding
stage
unit
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KR1020140095721A
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English (en)
Korean (ko)
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KR20150117586A (ko
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쓰토무 니시오
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쥬가이로 고교 가부시키가이샤
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  • Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Drying Of Solid Materials (AREA)
KR1020140095721A 2014-04-10 2014-07-28 기판 처리 장치 및 기판 유지 부재 KR102250506B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014081333A JP5767361B1 (ja) 2014-04-10 2014-04-10 基板処理装置
JPJP-P-2014-081333 2014-04-10

Publications (2)

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KR20150117586A KR20150117586A (ko) 2015-10-20
KR102250506B1 true KR102250506B1 (ko) 2021-05-10

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KR1020140095721A KR102250506B1 (ko) 2014-04-10 2014-07-28 기판 처리 장치 및 기판 유지 부재

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JP (1) JP5767361B1 (ja)
KR (1) KR102250506B1 (ja)
CN (1) CN104979239B (ja)
TW (1) TWI605535B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108346598A (zh) * 2018-01-03 2018-07-31 佛山杰致信息科技有限公司 一种用于电子封装固化的加热装置
KR102387088B1 (ko) * 2019-10-31 2022-04-15 세메스 주식회사 기판 처리 장치
JP7289881B2 (ja) * 2021-08-27 2023-06-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003100727A (ja) * 2001-09-20 2003-04-04 Dainippon Screen Mfg Co Ltd シートフィルム保持機構、カセット、搬送機構、薄膜形成装置ならびにシートフィルム搬送方法
JP2007120894A (ja) * 2005-10-31 2007-05-17 Ngk Insulators Ltd 連続式熱処理炉及びそれを用いた基板の熱処理方法
JP2012129228A (ja) * 2010-12-13 2012-07-05 Toppan Printing Co Ltd 基板移載装置並びに基板の取り出し方法および基板の収納方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0555764B1 (de) * 1992-02-12 1997-06-11 Balzers Aktiengesellschaft Vakuumbearbeitungsanlage
JP4502683B2 (ja) * 2003-03-31 2010-07-14 日本タングステン株式会社 多孔質アルミナ焼結体およびその製造方法
JP4312805B2 (ja) * 2007-03-27 2009-08-12 Ｏｋｉセミコンダクタ株式会社 半導体製造装置とそれを用いた半導体ウェハの製造方法およびそのプログラムを記録した記録媒体
JP2010080856A (ja) 2008-09-29 2010-04-08 Dainippon Screen Mfg Co Ltd 基板処理装置
JP5489280B2 (ja) * 2010-04-07 2014-05-14 信越化学工業株式会社 光半導体封止用エポキシ組成物
JP5161335B2 (ja) 2011-04-06 2013-03-13 中外炉工業株式会社 基板の搬送装置及びこれを備えた基板の加工装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003100727A (ja) * 2001-09-20 2003-04-04 Dainippon Screen Mfg Co Ltd シートフィルム保持機構、カセット、搬送機構、薄膜形成装置ならびにシートフィルム搬送方法
JP2007120894A (ja) * 2005-10-31 2007-05-17 Ngk Insulators Ltd 連続式熱処理炉及びそれを用いた基板の熱処理方法
JP2012129228A (ja) * 2010-12-13 2012-07-05 Toppan Printing Co Ltd 基板移載装置並びに基板の取り出し方法および基板の収納方法

Also Published As

Publication number Publication date
JP2015204310A (ja) 2015-11-16
TWI605535B (zh) 2017-11-11
JP5767361B1 (ja) 2015-08-19
CN104979239B (zh) 2020-01-14
CN104979239A (zh) 2015-10-14
KR20150117586A (ko) 2015-10-20
TW201539633A (zh) 2015-10-16

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