KR102230098B1 - 에폭시 수지 조성물 및 그 경화물 - Google Patents

에폭시 수지 조성물 및 그 경화물 Download PDF

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Publication number
KR102230098B1
KR102230098B1 KR1020140124301A KR20140124301A KR102230098B1 KR 102230098 B1 KR102230098 B1 KR 102230098B1 KR 1020140124301 A KR1020140124301 A KR 1020140124301A KR 20140124301 A KR20140124301 A KR 20140124301A KR 102230098 B1 KR102230098 B1 KR 102230098B1
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KR
South Korea
Prior art keywords
epoxy resin
group
resin composition
formula
parts
Prior art date
Application number
KR1020140124301A
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English (en)
Korean (ko)
Other versions
KR20150037537A (ko
Inventor
히로시 사토
나오키 사세
Original Assignee
닛테츠 케미컬 앤드 머티리얼 가부시키가이샤
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Application filed by 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 filed Critical 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤
Publication of KR20150037537A publication Critical patent/KR20150037537A/ko
Application granted granted Critical
Publication of KR102230098B1 publication Critical patent/KR102230098B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020140124301A 2013-09-30 2014-09-18 에폭시 수지 조성물 및 그 경화물 KR102230098B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-203406 2013-09-30
JP2013203406A JP6228799B2 (ja) 2013-09-30 2013-09-30 エポキシ樹脂組成物及びその硬化物

Publications (2)

Publication Number Publication Date
KR20150037537A KR20150037537A (ko) 2015-04-08
KR102230098B1 true KR102230098B1 (ko) 2021-03-18

Family

ID=52789252

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140124301A KR102230098B1 (ko) 2013-09-30 2014-09-18 에폭시 수지 조성물 및 그 경화물

Country Status (4)

Country Link
JP (1) JP6228799B2 (ja)
KR (1) KR102230098B1 (ja)
CN (1) CN104513359B (ja)
TW (1) TWI623562B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019123943A1 (ja) * 2017-12-18 2019-06-27 Dic株式会社 ヒドロキシ化合物、組成物、硬化物及び積層体
WO2019142735A1 (ja) 2018-01-16 2019-07-25 三菱ケミカル株式会社 プリプレグおよび繊維強化複合材料
WO2020080292A1 (ja) * 2018-10-15 2020-04-23 三菱ケミカル株式会社 硬化性樹脂組成物、硬化物及びシート状成形体
CN111518504B (zh) * 2020-03-27 2021-12-24 顺德职业技术学院 光通讯器件专用高折射高透明光路胶

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005146142A (ja) * 2003-11-17 2005-06-09 Nippon Kayaku Co Ltd エポキシ樹脂組成物
US20110136664A1 (en) 2008-07-28 2011-06-09 Nicca Chemical Co., Ltd. Diphenylsulfone bridged compound, color forming substance for thermal recording and thermal recording material
JP2013067685A (ja) 2011-09-21 2013-04-18 Panasonic Corp プリプレグ及び多層板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4225691A (en) * 1979-07-17 1980-09-30 General Electric Company Low temperature curable organic resin compositions
JPS5674125A (en) * 1979-10-29 1981-06-19 Kanegafuchi Chem Ind Co Ltd Novel polyether resin and its preparation
JP2710299B2 (ja) 1993-02-26 1998-02-10 住友ベークライト株式会社 低誘電率熱硬化性樹脂組成物
JP3570148B2 (ja) 1997-03-31 2004-09-29 松下電工株式会社 エポキシ樹脂組成物、プリプレグ及び積層板
JP4872612B2 (ja) * 2005-11-11 2012-02-08 三菱化学株式会社 電子写真感光体、電子写真用カートリッジ、および画像形成装置
JP5299279B2 (ja) * 2007-12-20 2013-09-25 日立化成株式会社 封止充てん用フィルム状樹脂組成物、それを用いた半導体パッケージ及び半導体装置の製造方法、並びに半導体装置
JP5708160B2 (ja) 2011-04-04 2015-04-30 Jsr株式会社 高周波回路基板用樹脂基板および高周波回路基板
JP5917098B2 (ja) * 2011-11-11 2016-05-11 新日鉄住金化学株式会社 リン含有フェノール樹脂の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005146142A (ja) * 2003-11-17 2005-06-09 Nippon Kayaku Co Ltd エポキシ樹脂組成物
US20110136664A1 (en) 2008-07-28 2011-06-09 Nicca Chemical Co., Ltd. Diphenylsulfone bridged compound, color forming substance for thermal recording and thermal recording material
JP2013067685A (ja) 2011-09-21 2013-04-18 Panasonic Corp プリプレグ及び多層板

Also Published As

Publication number Publication date
CN104513359A (zh) 2015-04-15
JP6228799B2 (ja) 2017-11-08
TW201516070A (zh) 2015-05-01
JP2015067729A (ja) 2015-04-13
TWI623562B (zh) 2018-05-11
KR20150037537A (ko) 2015-04-08
CN104513359B (zh) 2018-08-10

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