TWI623562B - 環氧樹脂組成物及其硬化物 - Google Patents

環氧樹脂組成物及其硬化物 Download PDF

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Publication number
TWI623562B
TWI623562B TW103131714A TW103131714A TWI623562B TW I623562 B TWI623562 B TW I623562B TW 103131714 A TW103131714 A TW 103131714A TW 103131714 A TW103131714 A TW 103131714A TW I623562 B TWI623562 B TW I623562B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
group
resin composition
formula
parts
Prior art date
Application number
TW103131714A
Other languages
English (en)
Chinese (zh)
Other versions
TW201516070A (zh
Inventor
佐藤洋
佐瀬奈央樹
Original Assignee
新日鐵住金化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 新日鐵住金化學股份有限公司 filed Critical 新日鐵住金化學股份有限公司
Publication of TW201516070A publication Critical patent/TW201516070A/zh
Application granted granted Critical
Publication of TWI623562B publication Critical patent/TWI623562B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW103131714A 2013-09-30 2014-09-15 環氧樹脂組成物及其硬化物 TWI623562B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-203406 2013-09-30
JP2013203406A JP6228799B2 (ja) 2013-09-30 2013-09-30 エポキシ樹脂組成物及びその硬化物

Publications (2)

Publication Number Publication Date
TW201516070A TW201516070A (zh) 2015-05-01
TWI623562B true TWI623562B (zh) 2018-05-11

Family

ID=52789252

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103131714A TWI623562B (zh) 2013-09-30 2014-09-15 環氧樹脂組成物及其硬化物

Country Status (4)

Country Link
JP (1) JP6228799B2 (ja)
KR (1) KR102230098B1 (ja)
CN (1) CN104513359B (ja)
TW (1) TWI623562B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102627148B1 (ko) * 2017-12-18 2024-01-23 디아이씨 가부시끼가이샤 히드록시 화합물, 조성물, 경화물 및 적층체
JP6806234B2 (ja) 2018-01-16 2021-01-06 三菱ケミカル株式会社 プリプレグおよび繊維強化複合材料
CN112823175B (zh) * 2018-10-15 2024-10-18 三菱化学株式会社 固化性树脂组成物、固化物及片状成形体
CN111518504B (zh) * 2020-03-27 2021-12-24 顺德职业技术学院 光通讯器件专用高折射高透明光路胶

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009081874A1 (ja) * 2007-12-20 2009-07-02 Hitachi Chemical Company, Ltd. 封止充てん用フィルム状樹脂組成物、それを用いた半導体パッケージ及び半導体装置の製造方法、並びに半導体装置
JP2013103975A (ja) * 2011-11-11 2013-05-30 Nippon Steel & Sumikin Chemical Co Ltd リン含有フェノール樹脂とその製造方法、該樹脂組成物、硬化物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4225691A (en) * 1979-07-17 1980-09-30 General Electric Company Low temperature curable organic resin compositions
JPS5674125A (en) * 1979-10-29 1981-06-19 Kanegafuchi Chem Ind Co Ltd Novel polyether resin and its preparation
JP2710299B2 (ja) 1993-02-26 1998-02-10 住友ベークライト株式会社 低誘電率熱硬化性樹脂組成物
JP3570148B2 (ja) 1997-03-31 2004-09-29 松下電工株式会社 エポキシ樹脂組成物、プリプレグ及び積層板
JP4509539B2 (ja) * 2003-11-17 2010-07-21 日本化薬株式会社 エポキシ樹脂組成物シート
JP4872612B2 (ja) * 2005-11-11 2012-02-08 三菱化学株式会社 電子写真感光体、電子写真用カートリッジ、および画像形成装置
US8497227B2 (en) * 2008-07-28 2013-07-30 Nicca Chemical Co., Ltd. Diphenylsulfone bridged compound, color forming substance for thermal recording and thermal recording material
JP5708160B2 (ja) 2011-04-04 2015-04-30 Jsr株式会社 高周波回路基板用樹脂基板および高周波回路基板
JP5891371B2 (ja) * 2011-09-21 2016-03-23 パナソニックＩｐマネジメント株式会社 フレックスリジッドプリント配線板用プリプレグ及びフレックスリジッドプリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009081874A1 (ja) * 2007-12-20 2009-07-02 Hitachi Chemical Company, Ltd. 封止充てん用フィルム状樹脂組成物、それを用いた半導体パッケージ及び半導体装置の製造方法、並びに半導体装置
JP2013103975A (ja) * 2011-11-11 2013-05-30 Nippon Steel & Sumikin Chemical Co Ltd リン含有フェノール樹脂とその製造方法、該樹脂組成物、硬化物

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JPs39-4345B; *

Also Published As

Publication number Publication date
CN104513359B (zh) 2018-08-10
KR102230098B1 (ko) 2021-03-18
KR20150037537A (ko) 2015-04-08
TW201516070A (zh) 2015-05-01
JP2015067729A (ja) 2015-04-13
JP6228799B2 (ja) 2017-11-08
CN104513359A (zh) 2015-04-15

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