KR102211998B1 - 상이한 열팽창 계수를 갖는 상하면을 구비한 다층 세라믹 기판 및 그의 제조 방법 - Google Patents

상이한 열팽창 계수를 갖는 상하면을 구비한 다층 세라믹 기판 및 그의 제조 방법 Download PDF

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Publication number
KR102211998B1
KR102211998B1 KR1020190041706A KR20190041706A KR102211998B1 KR 102211998 B1 KR102211998 B1 KR 102211998B1 KR 1020190041706 A KR1020190041706 A KR 1020190041706A KR 20190041706 A KR20190041706 A KR 20190041706A KR 102211998 B1 KR102211998 B1 KR 102211998B1
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KR
South Korea
Prior art keywords
thin plate
ceramic thin
ceramic
multilayer
thermal expansion
Prior art date
Application number
KR1020190041706A
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English (en)
Korean (ko)
Other versions
KR20200119471A (ko
Inventor
노태형
Original Assignee
주식회사 디아이티
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 주식회사 디아이티 filed Critical 주식회사 디아이티
Priority to KR1020190041706A priority Critical patent/KR102211998B1/ko
Priority to TW109112045A priority patent/TWI728775B/zh
Publication of KR20200119471A publication Critical patent/KR20200119471A/ko
Application granted granted Critical
Publication of KR102211998B1 publication Critical patent/KR102211998B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020190041706A 2019-04-10 2019-04-10 상이한 열팽창 계수를 갖는 상하면을 구비한 다층 세라믹 기판 및 그의 제조 방법 KR102211998B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020190041706A KR102211998B1 (ko) 2019-04-10 2019-04-10 상이한 열팽창 계수를 갖는 상하면을 구비한 다층 세라믹 기판 및 그의 제조 방법
TW109112045A TWI728775B (zh) 2019-04-10 2020-04-09 多層陶瓷基板及其製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020190041706A KR102211998B1 (ko) 2019-04-10 2019-04-10 상이한 열팽창 계수를 갖는 상하면을 구비한 다층 세라믹 기판 및 그의 제조 방법

Publications (2)

Publication Number Publication Date
KR20200119471A KR20200119471A (ko) 2020-10-20
KR102211998B1 true KR102211998B1 (ko) 2021-02-04

Family

ID=73025396

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190041706A KR102211998B1 (ko) 2019-04-10 2019-04-10 상이한 열팽창 계수를 갖는 상하면을 구비한 다층 세라믹 기판 및 그의 제조 방법

Country Status (2)

Country Link
KR (1) KR102211998B1 (zh)
TW (1) TWI728775B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220160967A (ko) * 2021-05-28 2022-12-06 (주)티에스이 이종 재질의 다층 회로기판 및 그 제조 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200714163A (en) * 2005-09-16 2007-04-01 Murata Manufacturing Co Ceramic multilayer substrate and process for producing the same
KR20090103002A (ko) 2008-03-27 2009-10-01 윌테크놀러지(주) 기판과 이를 포함하는 프로브 카드
KR20090120931A (ko) 2008-05-21 2009-11-25 윌테크놀러지(주) 인터포져 기판과 이를 포함하는 프로브 카드
JP2014029889A (ja) * 2010-11-17 2014-02-13 Panasonic Corp セラミック多層基板、およびセラミック多層基板の製造方法
KR101439153B1 (ko) * 2013-01-03 2014-09-12 (주)쓰리엘시스템 곡선 기판을 갖는 ｌｅｄ 칩과 이를 이용한 ｌｅｄ 패키지
JP6541530B2 (ja) * 2015-09-24 2019-07-10 三ツ星ベルト株式会社 ビア充填基板並びにその製造方法及び前駆体
JP2018133562A (ja) * 2017-02-13 2018-08-23 デクセリアルズ株式会社 接続構造体、異方性接着材料、および接続構造体の製造方法
KR102019794B1 (ko) * 2017-06-29 2019-09-09 주식회사 디아이티 프로브 핀의 내구성 강화를 위한 스페이스 트랜스포머 및 그의 제조 방법

Also Published As

Publication number Publication date
KR20200119471A (ko) 2020-10-20
TWI728775B (zh) 2021-05-21
TW202038686A (zh) 2020-10-16

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