KR102198324B1 - 실온경화성 오가노폴리실록산 조성물, 이 조성물의 경화물을 이용한 건축용 실란트, 전기전자부품, 및 자동차용 오일씰 - Google Patents
실온경화성 오가노폴리실록산 조성물, 이 조성물의 경화물을 이용한 건축용 실란트, 전기전자부품, 및 자동차용 오일씰 Download PDFInfo
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- KR102198324B1 KR102198324B1 KR1020167007582A KR20167007582A KR102198324B1 KR 102198324 B1 KR102198324 B1 KR 102198324B1 KR 1020167007582 A KR1020167007582 A KR 1020167007582A KR 20167007582 A KR20167007582 A KR 20167007582A KR 102198324 B1 KR102198324 B1 KR 102198324B1
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- curable organopolysiloxane
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- 239000000203 mixture Substances 0.000 title claims abstract description 88
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 65
- 238000010276 construction Methods 0.000 title claims description 11
- 239000000565 sealant Substances 0.000 title claims description 10
- 150000001875 compounds Chemical class 0.000 claims abstract description 34
- 150000001622 bismuth compounds Chemical class 0.000 claims abstract description 20
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 17
- 239000007788 liquid Substances 0.000 claims abstract description 9
- 239000000945 filler Substances 0.000 claims abstract description 7
- 150000001412 amines Chemical group 0.000 claims abstract description 5
- 150000002466 imines Chemical group 0.000 claims abstract description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 31
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 12
- 125000000217 alkyl group Chemical group 0.000 claims description 11
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 11
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 8
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 7
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 7
- 125000002947 alkylene group Chemical group 0.000 claims description 6
- NUMHJBONQMZPBW-UHFFFAOYSA-K bis(2-ethylhexanoyloxy)bismuthanyl 2-ethylhexanoate Chemical compound [Bi+3].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O NUMHJBONQMZPBW-UHFFFAOYSA-K 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- NSPSPMKCKIPQBH-UHFFFAOYSA-K bismuth;7,7-dimethyloctanoate Chemical compound [Bi+3].CC(C)(C)CCCCCC([O-])=O.CC(C)(C)CCCCCC([O-])=O.CC(C)(C)CCCCCC([O-])=O NSPSPMKCKIPQBH-UHFFFAOYSA-K 0.000 claims description 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 4
- 229920001971 elastomer Polymers 0.000 abstract description 22
- 238000003860 storage Methods 0.000 abstract description 17
- 231100000419 toxicity Toxicity 0.000 abstract description 6
- 230000001988 toxicity Effects 0.000 abstract description 6
- 150000003609 titanium compounds Chemical class 0.000 abstract description 5
- 238000001723 curing Methods 0.000 description 33
- 238000002156 mixing Methods 0.000 description 21
- 239000000047 product Substances 0.000 description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 18
- 239000003054 catalyst Substances 0.000 description 16
- -1 bismuth carboxylic acid salt Chemical class 0.000 description 14
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 150000002430 hydrocarbons Chemical group 0.000 description 11
- 239000003921 oil Substances 0.000 description 11
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 9
- 239000000377 silicon dioxide Substances 0.000 description 9
- 229910052797 bismuth Inorganic materials 0.000 description 8
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 7
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 6
- 239000000443 aerosol Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000007983 Tris buffer Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000007809 chemical reaction catalyst Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000006482 condensation reaction Methods 0.000 description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 description 4
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 4
- 239000004615 ingredient Substances 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 4
- 150000003606 tin compounds Chemical class 0.000 description 4
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- SHZIWNPUGXLXDT-UHFFFAOYSA-N ethyl hexanoate Chemical compound CCCCCC(=O)OCC SHZIWNPUGXLXDT-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000004606 Fillers/Extenders Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229920005601 base polymer Polymers 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000013522 chelant Substances 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 239000012744 reinforcing agent Substances 0.000 description 2
- 239000005871 repellent Substances 0.000 description 2
- 230000002940 repellent Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 1
- 0 **(*)(*)N[Si](*)(*)* Chemical compound **(*)(*)N[Si](*)(*)* 0.000 description 1
- OFYFURKXMHQOGG-UHFFFAOYSA-J 2-ethylhexanoate;zirconium(4+) Chemical compound [Zr+4].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O OFYFURKXMHQOGG-UHFFFAOYSA-J 0.000 description 1
- 241001674044 Blattodea Species 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229910004298 SiO 2 Chemical group 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- PUVVSMFTBVEMTC-UHFFFAOYSA-N [(diethylsilylamino)-ethylsilyl]ethane Chemical compound CC[SiH](CC)N[SiH](CC)CC PUVVSMFTBVEMTC-UHFFFAOYSA-N 0.000 description 1
- WYUIWUCVZCRTRH-UHFFFAOYSA-N [[[ethenyl(dimethyl)silyl]amino]-dimethylsilyl]ethene Chemical compound C=C[Si](C)(C)N[Si](C)(C)C=C WYUIWUCVZCRTRH-UHFFFAOYSA-N 0.000 description 1
- APDDLLVYBXGBRF-UHFFFAOYSA-N [diethyl-(triethylsilylamino)silyl]ethane Chemical compound CC[Si](CC)(CC)N[Si](CC)(CC)CC APDDLLVYBXGBRF-UHFFFAOYSA-N 0.000 description 1
- DXJAMOFQJRGEMN-UHFFFAOYSA-N [ethenyl-[[ethenyl(diethyl)silyl]amino]-ethylsilyl]ethane Chemical compound C(=C)[Si](N[Si](CC)(CC)C=C)(CC)CC DXJAMOFQJRGEMN-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007844 bleaching agent Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013005 condensation curing Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 239000000645 desinfectant Substances 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000003623 enhancer Substances 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002506 iron compounds Chemical class 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- QFWAHMAYYWUGTI-UHFFFAOYSA-N methyl-tris(prop-1-enoxy)silane Chemical compound CC=CO[Si](C)(OC=CC)OC=CC QFWAHMAYYWUGTI-UHFFFAOYSA-N 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- ZSMNRKGGHXLZEC-UHFFFAOYSA-N n,n-bis(trimethylsilyl)methanamine Chemical compound C[Si](C)(C)N(C)[Si](C)(C)C ZSMNRKGGHXLZEC-UHFFFAOYSA-N 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000012508 resin bead Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- OLTVTFUBQOLTND-UHFFFAOYSA-N tris(2-methoxyethoxy)-methylsilane Chemical compound COCCO[Si](C)(OCCOC)OCCOC OLTVTFUBQOLTND-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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- C08G77/04—Polysiloxanes
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- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
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- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
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- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/098—Metal salts of carboxylic acids
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- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
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- C08K5/544—Silicon-containing compounds containing nitrogen
- C08K5/5445—Silicon-containing compounds containing nitrogen containing at least one Si-N bond
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- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
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- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
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- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2013-204036 | 2013-09-30 | ||
| JP2013204036A JP6018031B2 (ja) | 2013-09-30 | 2013-09-30 | 室温硬化性オルガノポリシロキサン組成物、該組成物の硬化物を用いた建築用シーラント、電気電子部品、及び自動車用オイルシール |
| PCT/JP2014/003155 WO2015045221A1 (ja) | 2013-09-30 | 2014-06-13 | 室温硬化性オルガノポリシロキサン組成物、該組成物の硬化物を用いた建築用シーラント、電気電子部品、及び自動車用オイルシール |
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| KR20160065827A KR20160065827A (ko) | 2016-06-09 |
| KR102198324B1 true KR102198324B1 (ko) | 2021-01-05 |
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| EP (1) | EP3053965B1 (enExample) |
| JP (1) | JP6018031B2 (enExample) |
| KR (1) | KR102198324B1 (enExample) |
| CN (1) | CN105593303B (enExample) |
| WO (1) | WO2015045221A1 (enExample) |
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| JP6683573B2 (ja) * | 2016-08-19 | 2020-04-22 | 信越化学工業株式会社 | 縮合硬化性シリコーン樹脂組成物 |
| EP3505569B1 (en) * | 2016-08-26 | 2025-09-17 | Shin-Etsu Chemical Co., Ltd. | Dealcoholization room-temperature curable organopolysiloxane composition, and article sealed by cured product of same |
| JP2020023722A (ja) * | 2019-11-22 | 2020-02-13 | 信越化学工業株式会社 | 縮合硬化性シリコーン樹脂組成物 |
| JP7514794B2 (ja) * | 2021-05-07 | 2024-07-11 | 信越化学工業株式会社 | 常温硬化型ハードコート組成物 |
Citations (1)
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| JP2000017175A (ja) * | 1998-07-01 | 2000-01-18 | Ge Toshiba Silicones Co Ltd | 低比重化ポリオルガノシロキサン組成物 |
Family Cites Families (18)
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| US4417042A (en) * | 1982-02-17 | 1983-11-22 | General Electric Company | Scavengers for one-component alkoxy-functional RTV compositions and processes |
| US4513115A (en) | 1982-02-17 | 1985-04-23 | General Electric Company | Low modulus one component RTV compositions processes |
| GB2116189A (en) | 1982-02-17 | 1983-09-21 | Gen Electric | Low modulusone-component RTV compositions and processes |
| JPH073160A (ja) * | 1993-06-15 | 1995-01-06 | Shin Etsu Chem Co Ltd | 室温硬化性オルガノポリシロキサン組成物 |
| JP2000129126A (ja) | 1998-10-22 | 2000-05-09 | Asahi Glass Co Ltd | 室温硬化性組成物 |
| JP3477120B2 (ja) * | 1999-09-20 | 2003-12-10 | サンスター技研株式会社 | ２成分形硬化性組成物 |
| JP3768072B2 (ja) * | 2000-06-02 | 2006-04-19 | 日東化成株式会社 | 湿気硬化型組成物 |
| JP2002088267A (ja) | 2000-09-14 | 2002-03-27 | Sunstar Eng Inc | 硬化性組成物 |
| JP2003119387A (ja) * | 2001-10-10 | 2003-04-23 | Shin Etsu Chem Co Ltd | 室温硬化性オルガノポリシロキサン組成物 |
| JP4676726B2 (ja) | 2004-08-11 | 2011-04-27 | コニシ株式会社 | 硬化性樹脂組成物及び湿気硬化型接着剤組成物 |
| JP2007106944A (ja) * | 2005-10-17 | 2007-04-26 | Shin Etsu Chem Co Ltd | 室温硬化性オルガノポリシロキサン組成物 |
| JP5053814B2 (ja) * | 2007-11-30 | 2012-10-24 | 東レ・ダウコーニング株式会社 | 多成分型室温硬化性シリコーンゴム組成物 |
| FR2925513A1 (fr) | 2007-12-20 | 2009-06-26 | Bluestar Silicones France Soc | Composition organopolysiloxanique vulcanisable a temperature ambiante en elastomere et nouveaux catalyseurs de polycondensation d'organopolysiloxanes. |
| JP5260332B2 (ja) | 2009-01-16 | 2013-08-14 | 株式会社カネカ | 透明な硬化性組成物および、その硬化物 |
| JP5447284B2 (ja) | 2009-08-19 | 2014-03-19 | 旭硝子株式会社 | 硬化性組成物、粘着体、粘着積層体および粘着体の製造方法 |
| EP2708579B1 (en) * | 2011-05-13 | 2016-04-27 | Momentive Performance Materials Japan LLC | Room-temperature-curable polyorganosiloxane composition |
| JP5679352B2 (ja) | 2012-05-23 | 2015-03-04 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 室温硬化性ケイ素基含有ポリマー組成物 |
| EP2774673A1 (de) * | 2013-03-04 | 2014-09-10 | Nitrochemie Aschau GmbH | Katalysator für die Vernetzung von Siliconkautschukmassen |
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- 2014-06-13 CN CN201480053910.4A patent/CN105593303B/zh active Active
- 2014-06-13 KR KR1020167007582A patent/KR102198324B1/ko active Active
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000017175A (ja) * | 1998-07-01 | 2000-01-18 | Ge Toshiba Silicones Co Ltd | 低比重化ポリオルガノシロキサン組成物 |
Also Published As
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|---|---|
| CN105593303B (zh) | 2019-05-28 |
| EP3053965B1 (en) | 2023-12-20 |
| US20160208152A1 (en) | 2016-07-21 |
| CN105593303A (zh) | 2016-05-18 |
| JP6018031B2 (ja) | 2016-11-02 |
| JP2015067748A (ja) | 2015-04-13 |
| EP3053965A4 (en) | 2017-05-24 |
| WO2015045221A1 (ja) | 2015-04-02 |
| US9718926B2 (en) | 2017-08-01 |
| KR20160065827A (ko) | 2016-06-09 |
| EP3053965A1 (en) | 2016-08-10 |
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