CN105593303B - 室温固化性有机聚硅氧烷组合物、使用该组合物的固化物的建筑用密封胶、电气电子零件及汽车用油封 - Google Patents

室温固化性有机聚硅氧烷组合物、使用该组合物的固化物的建筑用密封胶、电气电子零件及汽车用油封 Download PDF

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CN105593303B
CN105593303B CN201480053910.4A CN201480053910A CN105593303B CN 105593303 B CN105593303 B CN 105593303B CN 201480053910 A CN201480053910 A CN 201480053910A CN 105593303 B CN105593303 B CN 105593303B
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CN105593303A (zh
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荒木正
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Shin Etsu Chemical Co Ltd
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    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
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    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
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    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
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    • C08K5/54—Silicon-containing compounds
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
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    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
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    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages

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  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
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CN201480053910.4A 2013-09-30 2014-06-13 室温固化性有机聚硅氧烷组合物、使用该组合物的固化物的建筑用密封胶、电气电子零件及汽车用油封 Active CN105593303B (zh)

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JP2013-204036 2013-09-30
JP2013204036A JP6018031B2 (ja) 2013-09-30 2013-09-30 室温硬化性オルガノポリシロキサン組成物、該組成物の硬化物を用いた建築用シーラント、電気電子部品、及び自動車用オイルシール
PCT/JP2014/003155 WO2015045221A1 (ja) 2013-09-30 2014-06-13 室温硬化性オルガノポリシロキサン組成物、該組成物の硬化物を用いた建築用シーラント、電気電子部品、及び自動車用オイルシール

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CN105593303B true CN105593303B (zh) 2019-05-28

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US (1) US9718926B2 (enExample)
EP (1) EP3053965B1 (enExample)
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KR (1) KR102198324B1 (enExample)
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WO (1) WO2015045221A1 (enExample)

Families Citing this family (4)

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JP6683573B2 (ja) * 2016-08-19 2020-04-22 信越化学工業株式会社 縮合硬化性シリコーン樹脂組成物
CN109642079B (zh) * 2016-08-26 2022-04-05 信越化学工业株式会社 脱醇型室温固化性有机聚硅氧烷组合物和用该组合物的固化物密封的物品
JP2020023722A (ja) * 2019-11-22 2020-02-13 信越化学工業株式会社 縮合硬化性シリコーン樹脂組成物
JP7514794B2 (ja) * 2021-05-07 2024-07-11 信越化学工業株式会社 常温硬化型ハードコート組成物

Citations (3)

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JP2000017175A (ja) * 1998-07-01 2000-01-18 Ge Toshiba Silicones Co Ltd 低比重化ポリオルガノシロキサン組成物
TWI237051B (en) * 2001-10-10 2005-08-01 Shinetsu Chemical Co Room temperature curing organopolysiloxane composition
CN103328576A (zh) * 2011-05-13 2013-09-25 迈图高新材料日本合同公司 室温固化性聚有机硅氧烷组合物

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AU1147783A (en) * 1982-02-17 1983-08-25 General Electric Company Rtv-organdpolysiloxane composition
US4417042A (en) 1982-02-17 1983-11-22 General Electric Company Scavengers for one-component alkoxy-functional RTV compositions and processes
US4513115A (en) 1982-02-17 1985-04-23 General Electric Company Low modulus one component RTV compositions processes
JPH073160A (ja) * 1993-06-15 1995-01-06 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物
JP2000129126A (ja) 1998-10-22 2000-05-09 Asahi Glass Co Ltd 室温硬化性組成物
JP3477120B2 (ja) * 1999-09-20 2003-12-10 サンスター技研株式会社 ２成分形硬化性組成物
JP3768072B2 (ja) * 2000-06-02 2006-04-19 日東化成株式会社 湿気硬化型組成物
JP2002088267A (ja) 2000-09-14 2002-03-27 Sunstar Eng Inc 硬化性組成物
JP4676726B2 (ja) 2004-08-11 2011-04-27 コニシ株式会社 硬化性樹脂組成物及び湿気硬化型接着剤組成物
JP2007106944A (ja) * 2005-10-17 2007-04-26 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物
JP5053814B2 (ja) * 2007-11-30 2012-10-24 東レ・ダウコーニング株式会社 多成分型室温硬化性シリコーンゴム組成物
FR2925513A1 (fr) 2007-12-20 2009-06-26 Bluestar Silicones France Soc Composition organopolysiloxanique vulcanisable a temperature ambiante en elastomere et nouveaux catalyseurs de polycondensation d'organopolysiloxanes.
JP5260332B2 (ja) 2009-01-16 2013-08-14 株式会社カネカ 透明な硬化性組成物および、その硬化物
JP5447284B2 (ja) 2009-08-19 2014-03-19 旭硝子株式会社 硬化性組成物、粘着体、粘着積層体および粘着体の製造方法
JP5679352B2 (ja) 2012-05-23 2015-03-04 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性ケイ素基含有ポリマー組成物
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JP2000017175A (ja) * 1998-07-01 2000-01-18 Ge Toshiba Silicones Co Ltd 低比重化ポリオルガノシロキサン組成物
TWI237051B (en) * 2001-10-10 2005-08-01 Shinetsu Chemical Co Room temperature curing organopolysiloxane composition
CN103328576A (zh) * 2011-05-13 2013-09-25 迈图高新材料日本合同公司 室温固化性聚有机硅氧烷组合物

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KR20160065827A (ko) 2016-06-09
JP2015067748A (ja) 2015-04-13
JP6018031B2 (ja) 2016-11-02
EP3053965B1 (en) 2023-12-20
CN105593303A (zh) 2016-05-18
EP3053965A4 (en) 2017-05-24
EP3053965A1 (en) 2016-08-10
US9718926B2 (en) 2017-08-01
US20160208152A1 (en) 2016-07-21
KR102198324B1 (ko) 2021-01-05
WO2015045221A1 (ja) 2015-04-02

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