KR102192243B1 - 성형 다이, 수지 성형 장치 및 수지 성형품의 제조 방법 - Google Patents

성형 다이, 수지 성형 장치 및 수지 성형품의 제조 방법 Download PDF

Info

Publication number
KR102192243B1
KR102192243B1 KR1020180148683A KR20180148683A KR102192243B1 KR 102192243 B1 KR102192243 B1 KR 102192243B1 KR 1020180148683 A KR1020180148683 A KR 1020180148683A KR 20180148683 A KR20180148683 A KR 20180148683A KR 102192243 B1 KR102192243 B1 KR 102192243B1
Authority
KR
South Korea
Prior art keywords
resin
lower die
die
molding
molded
Prior art date
Application number
KR1020180148683A
Other languages
English (en)
Korean (ko)
Other versions
KR20190089711A (ko
Inventor
요헤이 오니시
Original Assignee
토와 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20190089711A publication Critical patent/KR20190089711A/ko
Application granted granted Critical
Publication of KR102192243B1 publication Critical patent/KR102192243B1/ko

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B29C33/14—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
    • B29C33/18—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/10—Moulds or cores; Details thereof or accessories therefor with incorporated venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/50—Removing moulded articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/52—Heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould
    • B29C2043/3605—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
    • B29C2791/006—Using vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
KR1020180148683A 2018-01-22 2018-11-27 성형 다이, 수지 성형 장치 및 수지 성형품의 제조 방법 KR102192243B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018008487A JP6876637B2 (ja) 2018-01-22 2018-01-22 成形型、樹脂成形装置及び樹脂成形品の製造方法
JPJP-P-2018-008487 2018-01-22

Publications (2)

Publication Number Publication Date
KR20190089711A KR20190089711A (ko) 2019-07-31
KR102192243B1 true KR102192243B1 (ko) 2020-12-16

Family

ID=67365880

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180148683A KR102192243B1 (ko) 2018-01-22 2018-11-27 성형 다이, 수지 성형 장치 및 수지 성형품의 제조 방법

Country Status (5)

Country Link
JP (1) JP6876637B2 (ja)
KR (1) KR102192243B1 (ja)
CN (1) CN110065191B (ja)
SG (1) SG10201900307RA (ja)
TW (1) TWI718447B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112428501B (zh) * 2020-10-29 2022-09-23 台州耘智科技有限公司 一种节能橡胶成型机

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012081678A (ja) 2010-10-14 2012-04-26 Towa Corp 半導体チップの圧縮成形方法及び圧縮成形型
JP4953619B2 (ja) 2005-11-04 2012-06-13 Ｔｏｗａ株式会社 電子部品の樹脂封止成形装置
JP2012166432A (ja) 2011-02-14 2012-09-06 Apic Yamada Corp 樹脂モールド方法および樹脂モールド装置
JP2012187902A (ja) 2011-03-14 2012-10-04 Apic Yamada Corp 樹脂封止方法および樹脂封止装置
JP2016022672A (ja) 2014-07-22 2016-02-08 アピックヤマダ株式会社 成形金型、成形装置および成形品の製造方法
JP2017024398A (ja) 2015-07-15 2017-02-02 アピックヤマダ株式会社 モールド金型及び樹脂モールド装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3994705B2 (ja) * 2001-09-13 2007-10-24 松下電工株式会社 メモリーカードの製造方法
JP5539814B2 (ja) * 2010-08-30 2014-07-02 Ｔｏｗａ株式会社 基板露出面を備えた樹脂封止成形品の製造方法及び装置
JP5906528B2 (ja) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 モールド金型及びこれを用いた樹脂モールド装置
KR102203781B1 (ko) * 2013-05-29 2021-01-15 아피쿠 야마다 가부시키가이샤 수지 몰드 장치 및 수지 몰드 방법
JP5694486B2 (ja) * 2013-11-12 2015-04-01 アピックヤマダ株式会社 樹脂封止装置
KR102455987B1 (ko) * 2014-07-22 2022-10-18 아피쿠 야마다 가부시키가이샤 성형 금형, 성형 장치, 성형품의 제조 방법 및 수지 몰드 방법
JP6525580B2 (ja) * 2014-12-24 2019-06-05 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
WO2017010319A1 (ja) * 2015-07-15 2017-01-19 アピックヤマダ株式会社 モールド金型及び樹脂モールド装置
JP6506680B2 (ja) * 2015-11-09 2019-04-24 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
JP2017177554A (ja) * 2016-03-30 2017-10-05 株式会社ケーヒン 回路装置、回路装置の製造装置及びその製造方法
JP2017212419A (ja) * 2016-05-27 2017-11-30 Ｔｏｗａ株式会社 樹脂封止品製造方法及び樹脂封止装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4953619B2 (ja) 2005-11-04 2012-06-13 Ｔｏｗａ株式会社 電子部品の樹脂封止成形装置
JP2012081678A (ja) 2010-10-14 2012-04-26 Towa Corp 半導体チップの圧縮成形方法及び圧縮成形型
JP2012166432A (ja) 2011-02-14 2012-09-06 Apic Yamada Corp 樹脂モールド方法および樹脂モールド装置
JP2012187902A (ja) 2011-03-14 2012-10-04 Apic Yamada Corp 樹脂封止方法および樹脂封止装置
JP2016022672A (ja) 2014-07-22 2016-02-08 アピックヤマダ株式会社 成形金型、成形装置および成形品の製造方法
JP2017024398A (ja) 2015-07-15 2017-02-02 アピックヤマダ株式会社 モールド金型及び樹脂モールド装置

Also Published As

Publication number Publication date
KR20190089711A (ko) 2019-07-31
JP2019126927A (ja) 2019-08-01
CN110065191A (zh) 2019-07-30
CN110065191B (zh) 2021-12-03
TW201932273A (zh) 2019-08-16
TWI718447B (zh) 2021-02-11
SG10201900307RA (en) 2019-08-27
JP6876637B2 (ja) 2021-05-26

Similar Documents

Publication Publication Date Title
CN105269744B (zh) 树脂封装装置及树脂封装方法
KR102192732B1 (ko) 수지 밀봉 장치 및 수지 밀봉 방법
KR101959624B1 (ko) 압축 성형 장치, 수지 밀봉품 제조 장치, 압축 성형 방법 및 수지 밀봉품의 제조 방법
KR102059738B1 (ko) 성형 다이, 수지 성형 장치, 수지 성형 방법 및 수지 성형품의 제조 방법
EP2006896A1 (en) Resin sealing/molding apparatus
KR102192241B1 (ko) 반송 기구, 수지 성형 장치, 성형 대상물의 성형 다이로의 전달 방법, 및 수지 성형품의 제조 방법
TWI647085B (zh) 樹脂成形裝置及樹脂成形方法
KR102119992B1 (ko) 수지 밀봉 장치 및 수지 밀봉 방법
JP6180206B2 (ja) 樹脂封止方法および圧縮成形装置
CN109383047B (zh) 树脂成型装置以及树脂成型品的制造方法
CN107685412B (zh) 成型模、树脂成型装置及树脂成型品的制造方法
KR102086889B1 (ko) 수지 밀봉 장치 및 수지 밀봉 방법
TW201910088A (zh) 樹脂成型品的搬運機構、樹脂成型裝置以及樹脂成型品的製造方法
KR102192243B1 (ko) 성형 다이, 수지 성형 장치 및 수지 성형품의 제조 방법
KR102148022B1 (ko) 수지 성형 장치, 수지 성형 방법 및 수지 성형품의 제조 방법
CN109689330B (zh) 压缩成型装置、压缩成型方法、及压缩成型品的制造方法
CN113211686B (zh) 树脂成型装置及树脂成型品的制造方法
JP7240339B2 (ja) 樹脂成形品の製造方法及び樹脂成形装置
KR102511575B1 (ko) 수지 누설 방지용 부재, 수지 누설 방지용 부재 공급 기구, 수지 성형 장치 및 수지 성형품의 제조 방법
WO2022172592A1 (ja) 搬送機構、樹脂成形装置及び樹脂成形品の製造方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant