KR102190676B1 - 구동 장치, 리소그래피 장치, 냉각 방법 및 물품의 제조 방법 - Google Patents

구동 장치, 리소그래피 장치, 냉각 방법 및 물품의 제조 방법 Download PDF

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KR102190676B1
KR102190676B1 KR1020187026795A KR20187026795A KR102190676B1 KR 102190676 B1 KR102190676 B1 KR 102190676B1 KR 1020187026795 A KR1020187026795 A KR 1020187026795A KR 20187026795 A KR20187026795 A KR 20187026795A KR 102190676 B1 KR102190676 B1 KR 102190676B1
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refrigerant
coil
pressure
condensation
change
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KR20180115292A (ko
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마코토 노모토
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캐논 가부시끼가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H01L21/0274—
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
    • H02K41/02—Linear motors; Sectional motors
    • H02K41/03—Synchronous motors; Motors moving step by step; Reluctance motors
    • H02K41/031—Synchronous motors; Motors moving step by step; Reluctance motors of the permanent magnet type
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K9/00—Arrangements for cooling or ventilating
    • H02K9/19—Arrangements for cooling or ventilating for machines with closed casing and closed-circuit cooling using a liquid cooling medium, e.g. oil
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K9/00—Arrangements for cooling or ventilating
    • H02K9/19—Arrangements for cooling or ventilating for machines with closed casing and closed-circuit cooling using a liquid cooling medium, e.g. oil
    • H02K9/20—Arrangements for cooling or ventilating for machines with closed casing and closed-circuit cooling using a liquid cooling medium, e.g. oil wherein the cooling medium vaporises within the machine casing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Combustion & Propulsion (AREA)
  • Chemical & Material Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Motor Or Generator Cooling System (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020187026795A 2016-02-29 2017-02-20 구동 장치, 리소그래피 장치, 냉각 방법 및 물품의 제조 방법 Active KR102190676B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2016-038128 2016-02-29
JP2016038128A JP2017156465A (ja) 2016-02-29 2016-02-29 駆動装置、リソグラフィ装置、冷却方法、および物品の製造方法
PCT/JP2017/006096 WO2017150243A1 (ja) 2016-02-29 2017-02-20 駆動装置、リソグラフィ装置、冷却方法、および物品の製造方法

Publications (2)

Publication Number Publication Date
KR20180115292A KR20180115292A (ko) 2018-10-22
KR102190676B1 true KR102190676B1 (ko) 2020-12-14

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KR1020187026795A Active KR102190676B1 (ko) 2016-02-29 2017-02-20 구동 장치, 리소그래피 장치, 냉각 방법 및 물품의 제조 방법

Country Status (7)

Country Link
US (1) US20180364593A1 (https=)
EP (1) EP3425452A4 (https=)
JP (1) JP2017156465A (https=)
KR (1) KR102190676B1 (https=)
CN (1) CN108700831B (https=)
TW (1) TWI635694B (https=)
WO (1) WO2017150243A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7025256B2 (ja) * 2018-03-16 2022-02-24 キヤノン株式会社 ステージ装置、リソグラフィ装置、および物品の製造方法
CN108390511B (zh) * 2018-04-26 2023-07-28 北京建筑大学 一种开关磁阻电机及其控制方法、装置和系统
JP7202142B2 (ja) * 2018-10-30 2023-01-11 キヤノン株式会社 冷却装置、光源装置、露光装置及び物品の製造方法
JP7280152B2 (ja) * 2019-09-03 2023-05-23 富士フイルム株式会社 電子カセッテ
JP7483397B2 (ja) 2020-02-07 2024-05-15 キヤノン株式会社 搬送システム

Citations (5)

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Publication number Priority date Publication date Assignee Title
JP2002291219A (ja) * 2001-03-29 2002-10-04 Canon Inc 電磁アクチュエータ、リニアモータ、露光装置、半導体デバイス製造方法、半導体製造工場および露光装置の保守方法
JP2003133211A (ja) 2001-10-26 2003-05-09 Canon Inc デバイス製造装置およびその温調制御方法
JP2004031673A (ja) 2002-06-26 2004-01-29 Nikon Corp リニアモータ装置及びステージ装置並びに露光装置
JP2005142283A (ja) 2003-11-05 2005-06-02 Nikon Corp 温調装置及び温調方法、露光装置、並びにデバイス製造方法
JP2013105815A (ja) * 2011-11-11 2013-05-30 Nikon Corp 移動体装置及び露光装置

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JPS5619414Y2 (https=) * 1975-05-07 1981-05-08
JPS58145855A (ja) * 1982-02-23 1983-08-31 株式会社鷺宮製作所 冷媒流量制御装置
JPS63173716A (ja) * 1987-01-10 1988-07-18 Sanden Corp 冷房装置
JPH05243438A (ja) * 1992-02-15 1993-09-21 Fuji Electric Co Ltd 電子機器の冷却装置
JP2001168564A (ja) * 1999-12-13 2001-06-22 Yaskawa Electric Corp 電子機器筐体の熱交換器
JP2002078314A (ja) * 2000-08-24 2002-03-15 Nikon Corp 電機子ユニット、電磁アクチュエータ、ステージ装置、露光装置及びこれを用いたデバイスの製造方法
JP3719215B2 (ja) * 2002-01-25 2005-11-24 ダイキン工業株式会社 冷凍装置
US20040244963A1 (en) * 2003-06-05 2004-12-09 Nikon Corporation Heat pipe with temperature control
JP4262031B2 (ja) * 2003-08-19 2009-05-13 キヤノン株式会社 露光装置及びデバイスの製造方法
JP2006006050A (ja) 2004-06-18 2006-01-05 Nikon Corp 電機子ユニット、電磁アクチュエータ、ステージ装置、及び露光装置
JP2009060773A (ja) * 2007-09-04 2009-03-19 Canon Inc 駆動装置およびそれを用いた平面モータおよびそれを用いた露光装置
JP2011096983A (ja) * 2009-11-02 2011-05-12 Furukawa Electric Co Ltd:The 冷却装置
JP6412325B2 (ja) * 2014-03-27 2018-10-24 日立ジョンソンコントロールズ空調株式会社 冷却装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002291219A (ja) * 2001-03-29 2002-10-04 Canon Inc 電磁アクチュエータ、リニアモータ、露光装置、半導体デバイス製造方法、半導体製造工場および露光装置の保守方法
JP2003133211A (ja) 2001-10-26 2003-05-09 Canon Inc デバイス製造装置およびその温調制御方法
JP2004031673A (ja) 2002-06-26 2004-01-29 Nikon Corp リニアモータ装置及びステージ装置並びに露光装置
JP2005142283A (ja) 2003-11-05 2005-06-02 Nikon Corp 温調装置及び温調方法、露光装置、並びにデバイス製造方法
JP2013105815A (ja) * 2011-11-11 2013-05-30 Nikon Corp 移動体装置及び露光装置

Also Published As

Publication number Publication date
EP3425452A1 (en) 2019-01-09
KR20180115292A (ko) 2018-10-22
TW201735508A (zh) 2017-10-01
WO2017150243A1 (ja) 2017-09-08
EP3425452A4 (en) 2019-10-23
US20180364593A1 (en) 2018-12-20
CN108700831A (zh) 2018-10-23
CN108700831B (zh) 2021-08-10
JP2017156465A (ja) 2017-09-07
TWI635694B (zh) 2018-09-11

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