JP7025256B2 - ステージ装置、リソグラフィ装置、および物品の製造方法 - Google Patents
ステージ装置、リソグラフィ装置、および物品の製造方法 Download PDFInfo
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- H—ELECTRICITY
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- H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
- H02P29/00—Arrangements for regulating or controlling electric motors, appropriate for both AC and DC motors
- H02P29/60—Controlling or determining the temperature of the motor or of the drive
- H02P29/62—Controlling or determining the temperature of the motor or of the drive for raising the temperature of the motor
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- B23Q5/00—Driving or feeding mechanisms; Control arrangements therefor
- B23Q5/22—Feeding members carrying tools or work
- B23Q5/34—Feeding other members supporting tools or work, e.g. saddles, tool-slides, through mechanical transmission
- B23Q5/36—Feeding other members supporting tools or work, e.g. saddles, tool-slides, through mechanical transmission in which a servomotor forms an essential element
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- B23Q5/00—Driving or feeding mechanisms; Control arrangements therefor
- B23Q5/22—Feeding members carrying tools or work
- B23Q5/34—Feeding other members supporting tools or work, e.g. saddles, tool-slides, through mechanical transmission
- B23Q5/50—Feeding other members supporting tools or work, e.g. saddles, tool-slides, through mechanical transmission feeding step-by-step
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- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
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- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- G03F7/70725—Stages control
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- G—PHYSICS
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- G03F7/70—Microphotolithographic exposure; Apparatus therefor
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- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H01L21/67063—Apparatus for fluid treatment for etching
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K15/00—Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
- H02K15/12—Impregnating, heating or drying of windings, stators, rotors or machines
- H02K15/125—Heating or drying of machines in operational state, e.g. standstill heating
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
- H02K41/02—Linear motors; Sectional motors
- H02K41/03—Synchronous motors; Motors moving step by step; Reluctance motors
- H02K41/031—Synchronous motors; Motors moving step by step; Reluctance motors of the permanent magnet type
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- H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
- H02P25/00—Arrangements or methods for the control of AC motors characterised by the kind of AC motor or by structural details
- H02P25/02—Arrangements or methods for the control of AC motors characterised by the kind of AC motor or by structural details characterised by the kind of motor
- H02P25/06—Linear motors
- H02P25/064—Linear motors of the synchronous type
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- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
- H02K11/25—Devices for sensing temperature, or actuated thereby
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Description
第1実施形態の露光装置100について、図1を参照しながら説明する。図1は、本実施形態の露光装置100の構成例を示す概略図である。本実施形態の露光装置100は、例えば、照明光学系11と、マスクMを保持するマスクステージ12と、投影光学系13と、基板Wを保持する基板ステージ14と、基板ステージ14を駆動するリニアモータ20(駆動部)と、制御部30とを含みうる。制御部30は、例えばCPUやメモリなどを含み、露光装置100の各部を制御する(基板Wの露光処理を制御する)。本実施形態では、基板ステージ14を駆動するステージ装置が、リニアモータ20と制御部30とによって構成されうる。
本発明に係る第2実施形態について説明する。第2実施形態は、基本的に第1実施形態を引き継ぐものであるため、以下では第1実施形態と異なる箇所について説明する。
本発明に係る第3実施形態について説明する。第3実施形態は、基本的に第1実施形態を引き継ぐものであるため、以下では第1実施形態と異なる箇所について説明する。図7は、第3実施形態のステージ装置の構成例を示す図である。第3実施形態のステージ装置は、図5に示す第1実施形態のステージ装置と比べ、固定子21の構成、および切換部34a、34bの構成が異なる。本実施形態の固定子21は、複数のA相コイルA1~A5と複数のB相コイルB1~B5とを含み、切換部34a、34bは、A相コイルおよびB相コイルの数に対応するようにそれぞれ構成されている。なお、図7では、図を分かりやすくするため、計測部16、減算器31、位置補償器32、および温度補償器36の図示を省略している。
本発明に係る第4実施形態について説明する。第4実施形態は、基本的に第1実施形態を引き継ぐものである。本実施形態では、停止モードでリニアモータ20を稼働させる所定位置の設定について、図8を参照しながら説明する。
本発明の実施形態にかかる物品の製造方法は、例えば、半導体デバイス等のマイクロデバイスや微細構造を有する素子等の物品を製造するのに好適である。本実施形態の物品の製造方法は、上記のリソグラフィ装置(露光装置)を用いて基板上にパターンを形成する工程と、かかる工程でパターンを形成された基板を加工する工程とを含む。更に、かかる製造方法は、他の周知の工程(酸化、成膜、蒸着、ドーピング、平坦化、エッチング、レジスト剥離、ダイシング、ボンディング、パッケージング等)を含む。本実施形態の物品の製造方法は、従来の方法に比べて、物品の性能・品質・生産性・生産コストの少なくとも1つにおいて有利である。
Claims (12)
- ステージを駆動するステージ装置であって、
第1相コイルと第2相コイルとが交互に配列された複数のコイルを含む固定子と、前記ステージに設けられた可動子とを有するリニアモータと、
前記複数のコイルのうち一対の第1相コイルおよび第2相コイルに選択的に通電することにより、前記リニアモータを制御する制御部と、
を含み、
前記制御部は、前記ステージを所定位置に停止させている停止期間において、第1相コイルに通電することによって前記ステージの位置を前記所定位置に保持するとともに、前記可動子に推力を与えない位置に配置された第2相コイルに通電して発熱させる、ことを特徴とするステージ装置。 - 前記所定位置は、第2相コイルを用いずに、第1相コイルのみによって前記ステージの位置を保持することができる位置である、ことを特徴とする請求項1に記載のステージ装置。
- 前記所定位置は、前記複数のコイルのうち、1つの第1相コイルのみによって前記ステージの位置を保持することができる位置である、ことを特徴とする請求項2に記載のステージ装置。
- 前記所定位置は、前記ステージ上に物品の搬送を行う位置、および前記ステージ上から物品の回収を行う位置のうち少なくとも一方を含む、ことを特徴とする請求項1乃至3のいずれか1項に記載のステージ装置。
- 前記制御部は、前記停止期間において、前記複数のコイルのうち前記可動子から最も離れた第2相コイルを、通電する第2相コイルとして決定する、ことを特徴とする請求項1乃至4のいずれか1項に記載のステージ装置。
- 前記制御部は、前記停止期間において、前記可動子に推力を与えない位置に配置された複数の第2相コイルが存在する場合、通電する第2相コイルを経時的に切り換える、ことを特徴とする請求項1乃至4のいずれか1項に記載のステージ装置。
- 前記制御部は、前記停止期間において第2相コイルに供給する電流値を、前記ステージを移動させている可動期間における前記固定子の発熱に近づくように決定する、ことを特徴とする請求項1乃至6のいずれか1項に記載のステージ装置。
- 前記制御部は、前記リニアモータの制御モードとして、第1モードと第2モードとを含み、
前記第1モードは、前記第1相コイルに通電することによって前記ステージの位置を保持するとともに、前記可動子に推力を与えない位置に配置された第2相コイルに通電して発熱させるモードであり、
前記第2モードは、前記複数のコイルのうち、前記可動子に推力を与えるために通電する一対の第1相コイルおよび第2相コイルを切り換えることにより前記ステージの位置を制御するモードである、ことを特徴とする請求項1乃至7のいずれか1項に記載のステージ装置。 - 前記制御部は、第2相コイルへの通電を中止した状態で、前記第1モードと前記第2モードとの変更を行う、ことを特徴とする請求項8に記載のステージ装置。
- 第1相コイルに供給される電流と、第2相コイルに供給される電流とは、位相角が互いに90度異なる、ことを特徴とする請求項1乃至9のいずれか1項に記載のステージ装置。
- 基板上にパターンを形成するリソグラフィ装置であって、
ステージを駆動する請求項1乃至10のいずれか1項に記載のステージ装置を含み、
前記基板は、前記ステージによって保持されている、ことを特徴とするリソグラフィ装置。 - 請求項11に記載のリソグラフィ装置を用いて基板上にパターンを形成する形成工程と、
前記形成工程でパターンを形成された前記基板を加工する加工工程と、を含み、
前記加工工程で加工された前記基板から物品を製造することを特徴とする物品の製造方法。
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