KR102180702B1 - 리소그래피 장치, 물품의 제조 방법, 및 계측 장치 - Google Patents
리소그래피 장치, 물품의 제조 방법, 및 계측 장치 Download PDFInfo
- Publication number
- KR102180702B1 KR102180702B1 KR1020170165547A KR20170165547A KR102180702B1 KR 102180702 B1 KR102180702 B1 KR 102180702B1 KR 1020170165547 A KR1020170165547 A KR 1020170165547A KR 20170165547 A KR20170165547 A KR 20170165547A KR 102180702 B1 KR102180702 B1 KR 102180702B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- light
- intensity distribution
- light intensity
- stage
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
- G03F7/70441—Optical proximity correction [OPC]
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016241594A JP6916616B2 (ja) | 2016-12-13 | 2016-12-13 | リソグラフィ装置、物品の製造方法、および計測装置 |
JPJP-P-2016-241594 | 2016-12-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20180068291A KR20180068291A (ko) | 2018-06-21 |
KR102180702B1 true KR102180702B1 (ko) | 2020-11-20 |
Family
ID=62633518
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020170165547A KR102180702B1 (ko) | 2016-12-13 | 2017-12-05 | 리소그래피 장치, 물품의 제조 방법, 및 계측 장치 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6916616B2 (ja) |
KR (1) | KR102180702B1 (ja) |
CN (1) | CN108614392B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7222660B2 (ja) * | 2018-10-30 | 2023-02-15 | キヤノン株式会社 | ステージ装置、リソグラフィ装置、および物品の製造方法 |
CN111750774B (zh) * | 2019-03-29 | 2021-09-24 | 上海微电子装备(集团)股份有限公司 | 光学测量装置及方法 |
JP7469864B2 (ja) * | 2019-10-21 | 2024-04-17 | キヤノン株式会社 | 位置決め装置、露光装置、および物品の製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001241921A (ja) | 2000-03-01 | 2001-09-07 | Nippon Electric Glass Co Ltd | 板ガラスの寸法測定方法 |
WO2004079352A1 (ja) | 2003-03-04 | 2004-09-16 | Mitsuboshi Diamond Industrial Co. Ltd. | 透明基板端面部の検査装置およびその検査方法 |
JP2010117323A (ja) | 2008-11-14 | 2010-05-27 | Nikon Corp | 表面検査装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3590916B2 (ja) * | 1995-12-28 | 2004-11-17 | 株式会社ニコン | 位置決め方法 |
JP4048385B2 (ja) * | 1996-08-19 | 2008-02-20 | 株式会社ニコン | 光学式プリアライメント装置および該プリアライメント装置を備えた露光装置 |
JP2001194320A (ja) * | 2000-01-06 | 2001-07-19 | Advantest Corp | 表面状態測定装置及び方法 |
JP3795820B2 (ja) * | 2002-03-27 | 2006-07-12 | 株式会社東芝 | 基板のアライメント装置 |
KR100516405B1 (ko) * | 2003-02-28 | 2005-09-22 | 삼성전자주식회사 | 웨이퍼의 에지 노광 영역 검사 장치 |
JP4886549B2 (ja) * | 2007-02-26 | 2012-02-29 | 株式会社東芝 | 位置検出装置および位置検出方法 |
DE102009044294A1 (de) * | 2009-10-20 | 2011-05-05 | Kla-Tencor Mie Gmbh | Koordinatenmessmaschine zur Bestimmung der Lage von Strukturen auf einer Maske |
CN102402127B (zh) * | 2010-09-17 | 2014-01-22 | 上海微电子装备有限公司 | 一种硅片预对准装置及方法 |
US9841299B2 (en) * | 2014-11-28 | 2017-12-12 | Canon Kabushiki Kaisha | Position determining device, position determining method, lithographic apparatus, and method for manufacturing object |
-
2016
- 2016-12-13 JP JP2016241594A patent/JP6916616B2/ja active Active
-
2017
- 2017-12-05 KR KR1020170165547A patent/KR102180702B1/ko active IP Right Grant
- 2017-12-08 CN CN201711289563.7A patent/CN108614392B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001241921A (ja) | 2000-03-01 | 2001-09-07 | Nippon Electric Glass Co Ltd | 板ガラスの寸法測定方法 |
WO2004079352A1 (ja) | 2003-03-04 | 2004-09-16 | Mitsuboshi Diamond Industrial Co. Ltd. | 透明基板端面部の検査装置およびその検査方法 |
JP2010117323A (ja) | 2008-11-14 | 2010-05-27 | Nikon Corp | 表面検査装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20180068291A (ko) | 2018-06-21 |
CN108614392B (zh) | 2021-02-05 |
CN108614392A (zh) | 2018-10-02 |
JP2018097151A (ja) | 2018-06-21 |
JP6916616B2 (ja) | 2021-08-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101937009B1 (ko) | 임프린트 장치 및 물품의 제조 방법 | |
KR101788371B1 (ko) | 검출 장치, 임프린트 장치 및 물품의 제조 방법 | |
KR101894167B1 (ko) | 임프린트 장치 및 물품 제조 방법 | |
TWI468880B (zh) | 定位系統、微影裝置及器件製造方法 | |
US20110013188A1 (en) | Object Alignment Measurement Method and Apparatus | |
US9639008B2 (en) | Lithography apparatus, and article manufacturing method | |
KR102180702B1 (ko) | 리소그래피 장치, 물품의 제조 방법, 및 계측 장치 | |
TWI417679B (zh) | 微影裝置及圖案化元件 | |
KR102137986B1 (ko) | 계측 장치, 노광 장치 및 물품의 제조 방법 | |
KR101487060B1 (ko) | 하전 입자 빔 묘화 장치 및 물품 제조 방법 | |
CN109932876B (zh) | 测量装置、平板印刷装置、物品的制造方法以及测量方法 | |
JP6748428B2 (ja) | リソグラフィ装置、物品の製造方法、ステージ装置及び計測装置 | |
KR101785075B1 (ko) | 이송용 기준 미러를 사용한 웨이퍼 형상 변화값을 검출하는 장치 | |
JP2017198793A (ja) | 計測装置、露光装置、デバイス製造方法、及びパターン形成方法 | |
KR102102693B1 (ko) | 리소그래피 장치, 패턴 형성 방법 및 물품의 제조 방법 | |
JP2015106604A (ja) | ビームの傾き計測方法、描画方法、描画装置、及び物品の製造方法 | |
US11982948B2 (en) | Method for determining a center of a radiation spot, sensor and stage apparatus | |
US20230294351A1 (en) | Object alignment method, imprint method, article manufacturing method, detection apparatus, imprint apparatus, mold, and substrate | |
US20220308468A1 (en) | Method for determining a center of a radiation spot, sensor and stage apparatus | |
KR102555768B1 (ko) | 노광 방법, 노광 장치, 물품 제조 방법 및 계측 방법 | |
CN108292111A (zh) | 用于在光刻设备中处理衬底的方法和设备 | |
JP7138479B2 (ja) | 検出装置、検出方法、リソグラフィ装置および物品製造方法 | |
KR20240031051A (ko) | 정보 처리 장치, 정보 처리 방법, 프로그램, 노광 장치, 노광 방법, 및 물품의 제조방법 | |
CN117631467A (zh) | 信息处理装置、信息处理方法、存储介质、曝光装置、曝光方法和物品制造方法 | |
JP2010185807A (ja) | 表面形状計測装置、表面形状計測方法、露光装置及びデバイス製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
E701 | Decision to grant or registration of patent right |