KR102136149B1 - 플렉시블 유기 el 디스플레이의 제조 방법 - Google Patents

플렉시블 유기 el 디스플레이의 제조 방법 Download PDF

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Publication number
KR102136149B1
KR102136149B1 KR1020190072004A KR20190072004A KR102136149B1 KR 102136149 B1 KR102136149 B1 KR 102136149B1 KR 1020190072004 A KR1020190072004 A KR 1020190072004A KR 20190072004 A KR20190072004 A KR 20190072004A KR 102136149 B1 KR102136149 B1 KR 102136149B1
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KR
South Korea
Prior art keywords
resin layer
layer
glass layer
laser
cut
Prior art date
Application number
KR1020190072004A
Other languages
English (en)
Korean (ko)
Other versions
KR20200049472A (ko
Inventor
타케시 이케다
이쿠요시 다카마츠
코우지 야마모토
최동광
Original Assignee
한국미쯔보시다이아몬드공업(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 한국미쯔보시다이아몬드공업(주) filed Critical 한국미쯔보시다이아몬드공업(주)
Publication of KR20200049472A publication Critical patent/KR20200049472A/ko
Application granted granted Critical
Publication of KR102136149B1 publication Critical patent/KR102136149B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H01L51/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • H01L51/0097—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • H01L2251/5338—
    • H01L2251/566—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020190072004A 2018-10-30 2019-06-18 플렉시블 유기 el 디스플레이의 제조 방법 KR102136149B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018204450A JP2020071967A (ja) 2018-10-30 2018-10-30 フレキシブル有機ｅｌディスプレイの製造方法
JPJP-P-2018-204450 2018-10-30

Publications (2)

Publication Number Publication Date
KR20200049472A KR20200049472A (ko) 2020-05-08
KR102136149B1 true KR102136149B1 (ko) 2020-07-21

Family

ID=70547955

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190072004A KR102136149B1 (ko) 2018-10-30 2019-06-18 플렉시블 유기 el 디스플레이의 제조 방법

Country Status (4)

Country Link
JP (1) JP2020071967A (ja)
KR (1) KR102136149B1 (ja)
CN (1) CN111195780A (ja)
TW (1) TW202025851A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220090662A (ko) * 2020-12-22 2022-06-30 삼성디스플레이 주식회사 표시 장치의 제조 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009294362A (ja) 2008-06-04 2009-12-17 Toshiba Mobile Display Co Ltd 基板装置およびその製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3968519B2 (ja) * 2002-12-03 2007-08-29 ソニー株式会社 表示装置の製造方法
KR101211426B1 (ko) * 2005-07-06 2012-12-12 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료용 스크라이빙 휠, 및 이를 이용한 스크라이브 방법, 스크라이브 장치 및 스크라이브 공구
JP4755002B2 (ja) * 2006-03-23 2011-08-24 パイオニア株式会社 光デバイス用の封止部材の製造方法、光デバイスの製造方法、光デバイス、および光デバイス用の封止部材
JP2010135163A (ja) * 2008-12-04 2010-06-17 Hitachi Displays Ltd 表示装置の製造方法、製造装置及び表示装置
JP5723776B2 (ja) 2009-09-08 2015-05-27 旭硝子株式会社 ガラス／樹脂積層体の製造方法
CA2939574C (en) * 2014-03-04 2019-08-20 Saint-Gobain Glass France Method for cutting a laminated, ultrathin glass layer
JP2015195106A (ja) * 2014-03-31 2015-11-05 株式会社ジャパンディスプレイ 有機ｅｌ表示装置及びその製造方法
JP6474337B2 (ja) * 2015-08-27 2019-02-27 株式会社ジャパンディスプレイ 表示装置及びその製造方法
JP2017095295A (ja) * 2015-11-20 2017-06-01 旭硝子株式会社 ガラス積層体の切断方法
JP6352957B2 (ja) * 2015-12-21 2018-07-04 株式会社ジャパンディスプレイ 表示装置の製造方法
KR102511040B1 (ko) * 2015-12-28 2023-03-16 엘지디스플레이 주식회사 플렉서블 표시 장치 및 이의 제조 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009294362A (ja) 2008-06-04 2009-12-17 Toshiba Mobile Display Co Ltd 基板装置およびその製造方法

Also Published As

Publication number Publication date
JP2020071967A (ja) 2020-05-07
CN111195780A (zh) 2020-05-26
TW202025851A (zh) 2020-07-01
KR20200049472A (ko) 2020-05-08

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