KR102119430B1 - 노광 묘화 장치, 노광 묘화 시스템, 프로그램 및 노광 묘화 방법 - Google Patents

노광 묘화 장치, 노광 묘화 시스템, 프로그램 및 노광 묘화 방법 Download PDF

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KR102119430B1
KR102119430B1 KR1020157006282A KR20157006282A KR102119430B1 KR 102119430 B1 KR102119430 B1 KR 102119430B1 KR 1020157006282 A KR1020157006282 A KR 1020157006282A KR 20157006282 A KR20157006282 A KR 20157006282A KR 102119430 B1 KR102119430 B1 KR 102119430B1
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South Korea
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job
exposure
job information
image
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KR1020157006282A
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Korean (ko)
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KR20150060693A (ko
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유키히사 오자키
준이치 사토우
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가부시키가이샤 아도테크 엔지니어링
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Publication of KR20150060693A publication Critical patent/KR20150060693A/ko
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Publication of KR102119430B1 publication Critical patent/KR102119430B1/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G03F7/2032—Simultaneous exposure of the front side and the backside
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
KR1020157006282A 2012-09-27 2013-08-23 노광 묘화 장치, 노광 묘화 시스템, 프로그램 및 노광 묘화 방법 KR102119430B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012215121A JP6096453B2 (ja) 2012-09-27 2012-09-27 露光描画装置、露光描画システム、プログラム及び露光描画方法
JPJP-P-2012-215121 2012-09-27
PCT/JP2013/072502 WO2014050384A1 (ja) 2012-09-27 2013-08-23 露光描画装置、露光描画システム、プログラム及び露光描画方法

Publications (2)

Publication Number Publication Date
KR20150060693A KR20150060693A (ko) 2015-06-03
KR102119430B1 true KR102119430B1 (ko) 2020-06-05

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157006282A KR102119430B1 (ko) 2012-09-27 2013-08-23 노광 묘화 장치, 노광 묘화 시스템, 프로그램 및 노광 묘화 방법

Country Status (5)

Country Link
JP (1) JP6096453B2 (ja)
KR (1) KR102119430B1 (ja)
CN (1) CN104641299B (ja)
TW (1) TWI603160B (ja)
WO (1) WO2014050384A1 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004279446A (ja) * 2003-03-12 2004-10-07 Shinko Electric Ind Co Ltd パターン描画装置、パターン描画方法、および検査装置
JP2005014012A (ja) 2003-06-24 2005-01-20 Pentax Corp 描画装置および描画方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11307424A (ja) * 1998-04-22 1999-11-05 Hitachi Ltd 半導体製造方法および製造装置、ならびにそれにより製造された半導体デバイス
JP2001284231A (ja) * 2000-03-31 2001-10-12 Canon Inc 露光装置及びエラー発生時のパターンで処理を振り分ける方法
JP2002341550A (ja) 2001-05-17 2002-11-27 Dainippon Screen Mfg Co Ltd レーザー露光装置
US7244534B2 (en) * 2004-04-23 2007-07-17 Asml Netherlands B.V. Device manufacturing method
JP4606990B2 (ja) * 2005-10-07 2011-01-05 富士フイルム株式会社 デジタル露光装置
JP4922071B2 (ja) * 2007-05-28 2012-04-25 株式会社オーク製作所 露光描画装置
JP2009223262A (ja) * 2008-03-19 2009-10-01 Orc Mfg Co Ltd 露光システムおよび露光方法
JP2010181519A (ja) * 2009-02-04 2010-08-19 Adtec Engineeng Co Ltd 露光装置
JP5961429B2 (ja) * 2012-03-30 2016-08-02 株式会社アドテックエンジニアリング 露光描画装置及び露光描画方法
JP5813556B2 (ja) * 2012-03-30 2015-11-17 株式会社アドテックエンジニアリング 露光描画装置、プログラム及び露光描画方法
JP6198378B2 (ja) * 2012-09-27 2017-09-20 株式会社アドテックエンジニアリング 露光描画装置、露光描画システム、プログラム及び露光描画方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004279446A (ja) * 2003-03-12 2004-10-07 Shinko Electric Ind Co Ltd パターン描画装置、パターン描画方法、および検査装置
JP2005014012A (ja) 2003-06-24 2005-01-20 Pentax Corp 描画装置および描画方法

Also Published As

Publication number Publication date
JP2014071157A (ja) 2014-04-21
TW201413399A (zh) 2014-04-01
JP6096453B2 (ja) 2017-03-15
CN104641299B (zh) 2016-12-14
KR20150060693A (ko) 2015-06-03
TWI603160B (zh) 2017-10-21
CN104641299A (zh) 2015-05-20
WO2014050384A1 (ja) 2014-04-03

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