KR102111537B1 - 칩형 전자부품의 제조방법 - Google Patents

칩형 전자부품의 제조방법 Download PDF

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Publication number
KR102111537B1
KR102111537B1 KR1020170164006A KR20170164006A KR102111537B1 KR 102111537 B1 KR102111537 B1 KR 102111537B1 KR 1020170164006 A KR1020170164006 A KR 1020170164006A KR 20170164006 A KR20170164006 A KR 20170164006A KR 102111537 B1 KR102111537 B1 KR 102111537B1
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KR
South Korea
Prior art keywords
conductive paste
electronic component
cross
section
component body
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KR1020170164006A
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English (en)
Korean (ko)
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KR20180066847A (ko
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카즈히로 니시바야시
Original Assignee
가부시키가이샤 무라타 세이사쿠쇼
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Publication of KR20180066847A publication Critical patent/KR20180066847A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Thermistors And Varistors (AREA)
KR1020170164006A 2016-12-09 2017-12-01 칩형 전자부품의 제조방법 KR102111537B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2016-239614 2016-12-09
JP2016239614A JP6658485B2 (ja) 2016-12-09 2016-12-09 チップ型電子部品の製造方法

Publications (2)

Publication Number Publication Date
KR20180066847A KR20180066847A (ko) 2018-06-19
KR102111537B1 true KR102111537B1 (ko) 2020-05-15

Family

ID=62633094

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170164006A KR102111537B1 (ko) 2016-12-09 2017-12-01 칩형 전자부품의 제조방법

Country Status (2)

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JP (1) JP6658485B2 (ja)
KR (1) KR102111537B1 (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003347153A (ja) * 2002-05-22 2003-12-05 Murata Mfg Co Ltd 電子部品の製造方法
JP2005019921A (ja) * 2003-06-30 2005-01-20 Tdk Corp 外部電極形成方法及び電子部品
JP2009239204A (ja) * 2008-03-28 2009-10-15 Tdk Corp 電子部品の製造方法
KR101681358B1 (ko) * 2013-04-08 2016-11-30 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005064282A (ja) 2003-08-14 2005-03-10 Tdk Corp チップ状電子部品の外部電極形成方法およびチップ状電子部品
JP5136389B2 (ja) * 2008-12-19 2013-02-06 Ｔｄｋ株式会社 電子部品の製造方法
KR101187939B1 (ko) * 2011-03-09 2012-10-08 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003347153A (ja) * 2002-05-22 2003-12-05 Murata Mfg Co Ltd 電子部品の製造方法
JP2005019921A (ja) * 2003-06-30 2005-01-20 Tdk Corp 外部電極形成方法及び電子部品
JP2009239204A (ja) * 2008-03-28 2009-10-15 Tdk Corp 電子部品の製造方法
KR101681358B1 (ko) * 2013-04-08 2016-11-30 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조방법

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Publication number Publication date
JP2018098297A (ja) 2018-06-21
KR20180066847A (ko) 2018-06-19
JP6658485B2 (ja) 2020-03-04

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