KR102103428B1 - 박막 트랜지스터를 제조하는 방법, 박막 트랜지스터 및 디스플레이 장치 - Google Patents

박막 트랜지스터를 제조하는 방법, 박막 트랜지스터 및 디스플레이 장치 Download PDF

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KR102103428B1
KR102103428B1 KR1020187002481A KR20187002481A KR102103428B1 KR 102103428 B1 KR102103428 B1 KR 102103428B1 KR 1020187002481 A KR1020187002481 A KR 1020187002481A KR 20187002481 A KR20187002481 A KR 20187002481A KR 102103428 B1 KR102103428 B1 KR 102103428B1
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gate insulating
insulating layer
base substrate
channel region
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KR20180086405A (ko
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전 쑹
웨이 리
궈잉 왕
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보에 테크놀로지 그룹 컴퍼니 리미티드
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    • H01L29/78696
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6757Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
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    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
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    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0312Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
    • H10D30/0314Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral top-gate TFTs comprising only a single gate
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    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
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    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0321Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
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    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6704Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • H10D30/6713Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
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    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
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    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
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    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6731Top-gate only TFTs
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    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/6737Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
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    • H10D30/60Insulated-gate field-effect transistors [IGFET]
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    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/6737Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
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    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741Group IV materials, e.g. germanium or silicon carbide
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    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741Group IV materials, e.g. germanium or silicon carbide
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    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
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    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
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    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/213Channel regions of field-effect devices
    • H10D62/221Channel regions of field-effect devices of FETs
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    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thin Film Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
KR1020187002481A 2016-11-30 2017-06-30 박막 트랜지스터를 제조하는 방법, 박막 트랜지스터 및 디스플레이 장치 Active KR102103428B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201611082799.9A CN108122759B (zh) 2016-11-30 2016-11-30 薄膜晶体管及其制作方法、阵列基板及显示装置
CN201611082799.9 2016-11-30
PCT/CN2017/091081 WO2018099066A1 (en) 2016-11-30 2017-06-30 Method of fabricating thin film transistor, thin film transistor, and display apparatus

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KR20180086405A KR20180086405A (ko) 2018-07-31
KR102103428B1 true KR102103428B1 (ko) 2020-04-23

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US (1) US10431668B2 (enExample)
EP (1) EP3549157A4 (enExample)
JP (1) JP7045983B2 (enExample)
KR (1) KR102103428B1 (enExample)
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CN109860107B (zh) * 2019-01-31 2021-03-16 武汉华星光电半导体显示技术有限公司 阵列基板及其制作方法
CN110265303B (zh) * 2019-06-12 2021-04-02 深圳市华星光电半导体显示技术有限公司 一种显示面板的制作方法
CN110299322B (zh) * 2019-07-03 2022-03-08 京东方科技集团股份有限公司 一种显示基板及其制作方法、显示装置
CN113972236B (zh) * 2020-07-23 2024-12-10 合肥鑫晟光电科技有限公司 显示基板及其制备方法、显示装置

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JP2019536255A (ja) 2019-12-12
JP7045983B2 (ja) 2022-04-01
EP3549157A1 (en) 2019-10-09
WO2018099066A1 (en) 2018-06-07
US20190081159A1 (en) 2019-03-14
US10431668B2 (en) 2019-10-01
EP3549157A4 (en) 2020-06-24
CN108122759B (zh) 2021-01-26
KR20180086405A (ko) 2018-07-31
CN108122759A (zh) 2018-06-05

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