KR102103321B1 - 기판 세정 장치 및 기판 세정 방법 - Google Patents

기판 세정 장치 및 기판 세정 방법 Download PDF

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Publication number
KR102103321B1
KR102103321B1 KR1020130148922A KR20130148922A KR102103321B1 KR 102103321 B1 KR102103321 B1 KR 102103321B1 KR 1020130148922 A KR1020130148922 A KR 1020130148922A KR 20130148922 A KR20130148922 A KR 20130148922A KR 102103321 B1 KR102103321 B1 KR 102103321B1
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South Korea
Prior art keywords
substrate
cleaning
cleaning member
rotation axis
contact surface
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KR1020130148922A
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English (en)
Korean (ko)
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KR20140073428A (ko
Inventor
도모아츠 이시바시
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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Publication of KR20140073428A publication Critical patent/KR20140073428A/ko
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Publication of KR102103321B1 publication Critical patent/KR102103321B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
KR1020130148922A 2012-12-06 2013-12-03 기판 세정 장치 및 기판 세정 방법 Active KR102103321B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2012-267568 2012-12-06
JP2012267568 2012-12-06
JPJP-P-2013-238224 2013-11-18
JP2013238224A JP6297308B2 (ja) 2012-12-06 2013-11-18 基板洗浄装置及び基板洗浄方法

Publications (2)

Publication Number Publication Date
KR20140073428A KR20140073428A (ko) 2014-06-16
KR102103321B1 true KR102103321B1 (ko) 2020-04-22

Family

ID=50879637

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130148922A Active KR102103321B1 (ko) 2012-12-06 2013-12-03 기판 세정 장치 및 기판 세정 방법

Country Status (4)

Country Link
US (1) US9058977B2 (enExample)
JP (1) JP6297308B2 (enExample)
KR (1) KR102103321B1 (enExample)
TW (1) TWI611848B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10163664B2 (en) * 2014-10-31 2018-12-25 Ebara Corporation Substrate cleaning apparatus and substrate cleaning method
JP6871499B2 (ja) * 2016-06-16 2021-05-12 サミー株式会社 ぱちんこ遊技機
WO2023145431A1 (ja) * 2022-01-31 2023-08-03 Ａｇｃ株式会社 基板洗浄方法、ガラス基板の製造方法、ｅｕｖｌ用マスクブランクの製造方法、および基板洗浄装置
CN118649956B (zh) * 2024-07-30 2025-12-05 宁波礼达先导生物技术有限公司 一种自动化多工位孔板洗板机

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000015189A (ja) 1998-06-29 2000-01-18 Shibaura Mechatronics Corp ブラシ洗浄装置およびブラシ洗浄方法
US20020096191A1 (en) * 2001-01-24 2002-07-25 International Business Machines Corporation Apparatus and method for wafer cleaning
KR100412542B1 (ko) * 1995-09-20 2004-05-31 가부시끼가이샤 도시바 작업물의세정방법및장치
JP2004273961A (ja) 2003-03-12 2004-09-30 Ebara Corp 金属配線形成基板の洗浄処理装置
JP2005012238A (ja) 2004-09-02 2005-01-13 Ebara Corp 基板洗浄方法及び装置
JP2006073788A (ja) 2004-09-02 2006-03-16 Sumco Corp ウェーハの洗浄方法及び洗浄装置
US20110189857A1 (en) 2008-09-24 2011-08-04 Tokyo Electron Limited Chemical mechanical polishing apparatus, chemical mechanical polishing method, and control program

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2628168B2 (ja) 1987-07-14 1997-07-09 住友シチックス株式会社 半導体ウエーハの表面処理装置
JP3302873B2 (ja) 1995-12-05 2002-07-15 東京エレクトロン株式会社 洗浄方法と洗浄装置
JPH09260322A (ja) * 1996-03-26 1997-10-03 Nippon Steel Corp 洗浄装置
JPH10199844A (ja) * 1997-01-10 1998-07-31 Dainippon Screen Mfg Co Ltd 基板洗浄装置
JPH10308374A (ja) 1997-03-06 1998-11-17 Ebara Corp 洗浄方法及び洗浄装置
JPH10312982A (ja) 1997-05-12 1998-11-24 Dainippon Screen Mfg Co Ltd 基板洗浄装置
JPH10312983A (ja) 1997-05-12 1998-11-24 Dainippon Screen Mfg Co Ltd 基板洗浄装置
JP4091187B2 (ja) 1998-12-08 2008-05-28 株式会社荏原製作所 洗浄具、基板洗浄装置及び基板洗浄方法
JP2002018368A (ja) 2000-07-05 2002-01-22 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2003031536A (ja) 2001-07-12 2003-01-31 Nec Corp ウエハの洗浄方法
JP2007273608A (ja) * 2006-03-30 2007-10-18 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100412542B1 (ko) * 1995-09-20 2004-05-31 가부시끼가이샤 도시바 작업물의세정방법및장치
JP2000015189A (ja) 1998-06-29 2000-01-18 Shibaura Mechatronics Corp ブラシ洗浄装置およびブラシ洗浄方法
US20020096191A1 (en) * 2001-01-24 2002-07-25 International Business Machines Corporation Apparatus and method for wafer cleaning
JP2004273961A (ja) 2003-03-12 2004-09-30 Ebara Corp 金属配線形成基板の洗浄処理装置
JP2005012238A (ja) 2004-09-02 2005-01-13 Ebara Corp 基板洗浄方法及び装置
JP2006073788A (ja) 2004-09-02 2006-03-16 Sumco Corp ウェーハの洗浄方法及び洗浄装置
US20110189857A1 (en) 2008-09-24 2011-08-04 Tokyo Electron Limited Chemical mechanical polishing apparatus, chemical mechanical polishing method, and control program

Also Published As

Publication number Publication date
US20140158160A1 (en) 2014-06-12
TWI611848B (zh) 2018-01-21
US9058977B2 (en) 2015-06-16
KR20140073428A (ko) 2014-06-16
TW201429567A (zh) 2014-08-01
JP2014132639A (ja) 2014-07-17
JP6297308B2 (ja) 2018-03-20

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