KR102101536B1 - 웨이퍼 형상의 물품들을 프로세싱하기 위한 방법 및 장치 - Google Patents

웨이퍼 형상의 물품들을 프로세싱하기 위한 방법 및 장치 Download PDF

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KR102101536B1
KR102101536B1 KR1020170065174A KR20170065174A KR102101536B1 KR 102101536 B1 KR102101536 B1 KR 102101536B1 KR 1020170065174 A KR1020170065174 A KR 1020170065174A KR 20170065174 A KR20170065174 A KR 20170065174A KR 102101536 B1 KR102101536 B1 KR 102101536B1
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South Korea
Prior art keywords
rotating chuck
wafer
shaped article
heating elements
chuck
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KR20170135714A (ko
Inventor
데이비드 무이
부치 버니
알로이스 골러
마이크 라브킨
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램 리서치 아게
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020170065174A 2016-05-31 2017-05-26 웨이퍼 형상의 물품들을 프로세싱하기 위한 방법 및 장치 Active KR102101536B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/169,330 2016-05-31
US15/169,330 US10720343B2 (en) 2016-05-31 2016-05-31 Method and apparatus for processing wafer-shaped articles

Publications (2)

Publication Number Publication Date
KR20170135714A KR20170135714A (ko) 2017-12-08
KR102101536B1 true KR102101536B1 (ko) 2020-04-17

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KR1020170065174A Active KR102101536B1 (ko) 2016-05-31 2017-05-26 웨이퍼 형상의 물품들을 프로세싱하기 위한 방법 및 장치

Country Status (6)

Country Link
US (2) US10720343B2 (enExample)
JP (2) JP7231321B2 (enExample)
KR (1) KR102101536B1 (enExample)
CN (1) CN107452654B (enExample)
SG (1) SG10201704180PA (enExample)
TW (1) TWI734788B (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
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US10861719B2 (en) 2016-05-31 2020-12-08 Lam Research Ag Method and apparatus for processing wafer-shaped articles
KR20250154116A (ko) 2024-04-19 2025-10-28 렉트론디에스피 주식회사 Led 가열부 및 이를 구비하는 led 스핀 척
KR20250157020A (ko) 2024-04-26 2025-11-04 주식회사 에이치에스하이테크 Led 히터 시스템 및 이를 구비하는 반도체 웨이퍼 처리 장치
KR102904929B1 (ko) * 2019-02-06 2025-12-26 램 리서치 아게 웨이퍼를 프로세싱하기 위한 장치 및 이러한 장치를 제어하는 방법

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US10658204B2 (en) 2017-08-08 2020-05-19 Lam Research Ag Spin chuck with concentrated center and radial heating
KR102208753B1 (ko) * 2018-04-06 2021-01-28 세메스 주식회사 기판 지지 유닛 및 이를 갖는 기판 처리 장치
US11043403B2 (en) 2018-04-06 2021-06-22 Semes Co., Ltd. Substrate support unit and substrate processing apparatus having the same including reflective member configured to reflect light toward substrate
KR102078157B1 (ko) 2018-04-16 2020-02-17 세메스 주식회사 기판 가열 유닛 및 이를 갖는 기판 처리 장치
JP7175119B2 (ja) * 2018-07-25 2022-11-18 東京エレクトロン株式会社 基板処理装置、および基板処理方法
KR102244605B1 (ko) 2018-09-20 2021-04-26 주식회사 에이치에스하이테크 웨이퍼를 프로세싱하기 위한 장치
KR102102277B1 (ko) 2018-09-20 2020-04-20 주식회사 에이치에스하이테크 웨이퍼를 프로세싱하기 위한 장치
KR102102202B1 (ko) * 2018-11-07 2020-04-21 세메스 주식회사 기판 처리 장치 및 시스템
GB201900912D0 (en) 2019-01-23 2019-03-13 Lam Res Ag Apparatus for processing a wafer, and method of controlling such an apparatus
GB201901637D0 (en) 2019-02-06 2019-03-27 Lam Res Ag Apparatus for processing a wafer, and method of controlling such an apparatus
KR102232654B1 (ko) * 2019-08-05 2021-03-26 주식회사 에이치에스하이테크 엘이디 스핀척
KR102303593B1 (ko) * 2019-11-05 2021-09-23 세메스 주식회사 기판 처리 장치 및 방법
KR102347145B1 (ko) * 2020-01-29 2022-01-04 무진전자 주식회사 회전 척에 내장된 광원을 이용한 기판 처리 장치
GB202002798D0 (en) 2020-02-27 2020-04-15 Lam Res Ag Apparatus for processing a wafer
CN115699287A (zh) * 2020-04-01 2023-02-03 朗姆研究公司 用于热蚀刻的快速且精确的温度控制
KR102347146B1 (ko) * 2020-06-09 2022-01-04 무진전자 주식회사 광원을 이용한 기판 처리 장치
GB202015527D0 (en) 2020-09-30 2020-11-11 Lam Res Ag Apparatus for processing wafer-shaped articles
GB202016750D0 (en) 2020-10-22 2020-12-09 Lam Res Ag Apparatus for processing a wafer-shaped article
KR102584511B1 (ko) * 2020-12-07 2023-10-06 세메스 주식회사 지지 유닛 및 이를 포함하는 기판 처리 장치
GB202101428D0 (en) 2021-02-02 2021-03-17 Lam Res Ag Apparatus for dispensing a liquid
JP7625458B2 (ja) * 2021-03-22 2025-02-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2025037020A (ja) * 2023-09-05 2025-03-17 ウシオ電機株式会社 光源ユニット
GB202315890D0 (en) 2023-10-17 2023-11-29 Lam Res Ag Apparatus for processing a wafer

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10861719B2 (en) 2016-05-31 2020-12-08 Lam Research Ag Method and apparatus for processing wafer-shaped articles
KR102904929B1 (ko) * 2019-02-06 2025-12-26 램 리서치 아게 웨이퍼를 프로세싱하기 위한 장치 및 이러한 장치를 제어하는 방법
KR20250154116A (ko) 2024-04-19 2025-10-28 렉트론디에스피 주식회사 Led 가열부 및 이를 구비하는 led 스핀 척
KR20250174847A (ko) 2024-04-19 2025-12-15 렉트론디에스피 주식회사 Led 가열부 및 이를 구비하는 led 스핀 척
KR20250157020A (ko) 2024-04-26 2025-11-04 주식회사 에이치에스하이테크 Led 히터 시스템 및 이를 구비하는 반도체 웨이퍼 처리 장치
KR20250160113A (ko) 2024-04-26 2025-11-11 주식회사 에이치에스하이테크 Led 히터 시스템 및 이를 구비하는 반도체 웨이퍼 처리 장치
KR20250160112A (ko) 2024-04-26 2025-11-11 주식회사 에이치에스하이테크 Led 히터 시스템 및 이를 구비하는 반도체 웨이퍼 처리 장치

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Publication number Publication date
KR20170135714A (ko) 2017-12-08
US20200227284A1 (en) 2020-07-16
US10720343B2 (en) 2020-07-21
JP2022058827A (ja) 2022-04-12
CN107452654A (zh) 2017-12-08
CN107452654B (zh) 2020-11-24
TW201806058A (zh) 2018-02-16
US20170345681A1 (en) 2017-11-30
SG10201704180PA (en) 2017-12-28
US10861719B2 (en) 2020-12-08
JP2017224807A (ja) 2017-12-21
TWI734788B (zh) 2021-08-01
JP7324323B2 (ja) 2023-08-09
JP7231321B2 (ja) 2023-03-01

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