JP7228990B2 - 基板処理装置及び基板処理方法 - Google Patents
基板処理装置及び基板処理方法 Download PDFInfo
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Description
先ず、第1の実施形態について説明する。図1は、第1の実施形態に係る基板処理装置を示す図である。図2は、第1の実施形態に係る基板処理装置に含まれる液吐出ノズル移動機構を示す図である。図1に示すように、第1の実施形態に係る基板処理装置1は、例えば、基板保持部10と、回転駆動部20と、液供給ユニット30と、基板昇降部材50と、加熱ユニット70と、制御部90とを有する。基板保持部10及び回転駆動部20が基板保持回転部に含まれる。
図10(b)は、領域R2の処理時の状態を示す図である。図10(c)は、領域R3の処理時の状態を示す図である。図11(a)は、領域R4の処理時の状態を示す図である。図11(b)は、領域R4の処理後の状態を示す図である。図11(c)は、基板2の回転が停止した時の状態を示す図である。
次に、第2の実施形態について説明する。第1の実施形態では、領域R1~R4に一つずつ温度センサが設けられているが、領域R1~R4が円周方向に複数のサブ領域に区画され、各サブ領域に一つずつ温度センサが設けられていてもよい。図13は、第2の実施形態における熱板60を示す平面図である。
2 基板
10 基板保持部
20 回転駆動部
30 液供給ユニット
33 乾燥液吐出ノズル
60 熱板
63 レーザー光線吸収体
64、65 レーザー光線反射体
67 縦溝
68 横溝
69A、69B、69C、69D 加熱領域
70 加熱ユニット
71A、71B、71C、71D 光源
75A、75B、75C、75D レーザー照射ヘッド
76A、76B、76C、76D 温度センサ
79 固定部材
B1、B2、B3、B4 黒体
G1、G2、G3、G4 溝部
R1、R2、R3、R4 領域
Claims (10)
- 基板を載置台上に保持して回転させる基板保持回転部と、
前記載置台の下面に向けてレーザー光線を照射するレーザー照射ヘッドと、
少なくとも前記基板保持回転部の回転及び前記レーザー光線の照射を制御する制御部と、
を有し、
前記載置台の下面に、複数の溝部が同心円状に形成されており、
複数の前記レーザー照射ヘッドが、複数の前記溝部に対向して配置されており、
前記レーザー照射ヘッドは、前記載置台の下方に前記載置台から離間して固定されており、
前記制御部は、前記基板保持回転部により前記載置台を回転させているときに、前記レーザー照射ヘッドに前記レーザー光線を照射させる、基板処理装置。 - 前記載置台の下方に前記載置台から離間して固定された温度センサを有し、
前記制御部は、前記温度センサの出力に応じて前記レーザー光線の出力を制御する、請求項1に記載の基板処理装置。 - 前記載置台の下面に設けられ、前記温度センサにより温度が検出される温度測定対象物を有する、請求項2に記載の基板処理装置。
- 前記溝部内に設けられ、前記レーザー光線を吸収するレーザー光線吸収体を有する、請求項1乃至3のいずれか1項に記載の基板処理装置。
- 前記溝部は、
前記載置台の下面から鉛直上方に延びる第1の溝と、
前記第1の溝の上端から水平方向に延びる第2の溝と、
を有し、
前記レーザー光線吸収体は前記第2の溝の上面に設けられ、
前記第2の溝の下面に設けられ、前記レーザー光線を反射するレーザー光線反射体を有
する、請求項4に記載の基板処理装置。 - 前記載置台に載置されている前記基板の上面に処理液を供給するノズルを有し、
前記制御部は、前記基板保持回転部により前記載置台を回転させているときに、前記ノズルを前記基板の回転中心から外側に向けて移動させると共に、複数の前記レーザー照射ヘッドのうち、径方向で前記処理液が供給されている領域の下方に位置するものに前記レーザー光線を照射させる、請求項1乃至5のいずれか1項に記載の基板処理装置。 - 前記制御部は、前記ノズルが前記基板の回転中心から離間するほど、前記レーザー光線の出力を高める、請求項6に記載の基板処理装置。
- 前記制御部は、前記レーザー光線の出力を、前記レーザー光線のスポット径又はデュー
ティー比の調整により高める、請求項7に記載の基板処理装置。 - 基板を載置台上に保持して回転させる工程と、
前記載置台が回転しているときに、前記載置台の下方に前記載置台から離間して固定されたレーザー照射ヘッドから、前記載置台の下面に向けてレーザー光線を照射し、前記載置台を通じて前記基板を加熱する工程と、
を有し、
前記載置台の下面に、複数の溝部が同心円状に形成されており、
複数の前記溝部に対向して配置された複数の前記レーザー照射ヘッドから、それぞれ複数の前記溝部内に前記レーザー光線を照射する、基板処理方法。 - 前記載置台に載置されている前記基板の上面にノズルから処理液を供給する工程と、
前記載置台を回転させているときに、前記ノズルを前記基板の回転中心から外側に向けて移動させると共に、複数の前記レーザー照射ヘッドのうち、径方向で前記処理液が供給されている領域の下方に位置するものに前記レーザー光線を照射させる工程と、
を有する、請求項9に記載の基板処理方法。
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