KR102089097B1 - 반도체 패키지 배치 장치, 제조 장치, 반도체 패키지의 배치 방법 및 전자 부품의 제조 방법 - Google Patents

반도체 패키지 배치 장치, 제조 장치, 반도체 패키지의 배치 방법 및 전자 부품의 제조 방법 Download PDF

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KR102089097B1
KR102089097B1 KR1020180024115A KR20180024115A KR102089097B1 KR 102089097 B1 KR102089097 B1 KR 102089097B1 KR 1020180024115 A KR1020180024115 A KR 1020180024115A KR 20180024115 A KR20180024115 A KR 20180024115A KR 102089097 B1 KR102089097 B1 KR 102089097B1
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semiconductor package
imaging element
imaging
adsorption
placement member
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KR20180106876A (ko
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이치로 이마이
모토키 후카이
쇼이치 카타오카
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토와 가부시기가이샤
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    • H01L21/67121—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H01L21/67092—
    • H01L21/67242—
    • H01L21/68—
    • H01L21/78—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Dicing (AREA)
KR1020180024115A 2017-03-16 2018-02-28 반도체 패키지 배치 장치, 제조 장치, 반도체 패키지의 배치 방법 및 전자 부품의 제조 방법 Active KR102089097B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2017-051101 2017-03-16
JP2017051101A JP6626027B2 (ja) 2017-03-16 2017-03-16 製造装置および電子部品の製造方法

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Publication Number Publication Date
KR20180106876A KR20180106876A (ko) 2018-10-01
KR102089097B1 true KR102089097B1 (ko) 2020-03-13

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JP (1) JP6626027B2 (https=)
KR (1) KR102089097B1 (https=)
CN (1) CN108630579B (https=)
TW (1) TWI707444B (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102143715B1 (ko) * 2019-01-31 2020-08-11 한미반도체 주식회사 테이핑 시스템 및 테이핑 방법
JP7498674B2 (ja) * 2021-01-18 2024-06-12 Ｔｏｗａ株式会社 搬送機構、切断装置及び切断品の製造方法
JP7645142B2 (ja) 2021-07-15 2025-03-13 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010135574A (ja) 2008-12-05 2010-06-17 Alpha- Design Kk 移載装置
KR101360007B1 (ko) * 2012-09-27 2014-02-07 한미반도체 주식회사 플립칩 본딩장치
JP2015026789A (ja) 2013-07-29 2015-02-05 Ｔｏｗａ株式会社 個片化された電子部品の搬送装置及び搬送方法
KR101590593B1 (ko) * 2015-12-03 2016-02-02 제너셈(주) 반도체패키지의 스퍼터링 방법
JP2016092427A (ja) 2014-10-31 2016-05-23 アキム株式会社 搬送装置、組立装置および組立方法

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JPS6412637A (en) * 1987-07-06 1989-01-17 Yamatake Honeywell Co Ltd Automatic restoration system of loopback type
JPH0494600A (ja) * 1990-08-11 1992-03-26 Tdk Corp 電子部品装着方法及び装置
JPH0758495A (ja) * 1993-08-20 1995-03-03 Toshiba Corp 電子部品装着装置および電子部品装着位置補正方法
JP2770817B2 (ja) * 1996-06-19 1998-07-02 日本電気株式会社 チップマウント装置及び方法
KR100434832B1 (ko) * 2001-05-29 2004-06-07 주식회사 탑 엔지니어링 플립칩본더장치 및 그 작동방법
AU2003249592A1 (en) * 2002-07-17 2004-02-02 Matsushita Electric Industrial Co., Ltd Method and apparatus for picking up semiconductor chip and suction and exfoliation tool up therefor
JP2007281503A (ja) * 2007-06-01 2007-10-25 Renesas Technology Corp チップ移載装置、およびチップ移載方法
AT512859B1 (de) * 2012-05-11 2018-06-15 Hanmi Semiconductor Co Ltd Halbleiterchip Wende- und Befestigungseinrichtung
JP6000902B2 (ja) * 2013-06-24 2016-10-05 Ｔｏｗａ株式会社 電子部品用の収容治具、その製造方法及び個片化装置
CN106133893B (zh) * 2014-03-24 2018-11-06 株式会社富士 裸片安装系统及裸片安装方法
JP6382039B2 (ja) * 2014-09-04 2018-08-29 Ｔｏｗａ株式会社 切断装置並びに吸着機構及びこれを用いる装置
US20160111375A1 (en) * 2014-10-17 2016-04-21 Tango Systems, Inc. Temporary bonding of packages to carrier for depositing metal layer for shielding
JP6320323B2 (ja) * 2015-03-04 2018-05-09 Ｔｏｗａ株式会社 製造装置、搬送方法、搬送プログラム、および搬送プログラムを格納した記録媒体
KR102247600B1 (ko) * 2015-03-16 2021-05-03 한화정밀기계 주식회사 본딩 장치 및 본딩 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010135574A (ja) 2008-12-05 2010-06-17 Alpha- Design Kk 移載装置
KR101360007B1 (ko) * 2012-09-27 2014-02-07 한미반도체 주식회사 플립칩 본딩장치
JP2015026789A (ja) 2013-07-29 2015-02-05 Ｔｏｗａ株式会社 個片化された電子部品の搬送装置及び搬送方法
JP2016092427A (ja) 2014-10-31 2016-05-23 アキム株式会社 搬送装置、組立装置および組立方法
KR101590593B1 (ko) * 2015-12-03 2016-02-02 제너셈(주) 반도체패키지의 스퍼터링 방법

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Publication number Publication date
CN108630579B (zh) 2022-05-10
CN108630579A (zh) 2018-10-09
JP6626027B2 (ja) 2019-12-25
TW201843799A (zh) 2018-12-16
KR20180106876A (ko) 2018-10-01
TWI707444B (zh) 2020-10-11
JP2018157010A (ja) 2018-10-04

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