KR102088628B1 - 지지체 부착 수지 시트 - Google Patents

지지체 부착 수지 시트 Download PDF

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Publication number
KR102088628B1
KR102088628B1 KR1020130076868A KR20130076868A KR102088628B1 KR 102088628 B1 KR102088628 B1 KR 102088628B1 KR 1020130076868 A KR1020130076868 A KR 1020130076868A KR 20130076868 A KR20130076868 A KR 20130076868A KR 102088628 B1 KR102088628 B1 KR 102088628B1
Authority
KR
South Korea
Prior art keywords
resin sheet
layer
support
insulating layer
resin
Prior art date
Application number
KR1020130076868A
Other languages
English (en)
Korean (ko)
Other versions
KR20140005782A (ko
Inventor
요시오 니시무라
겐지 가와이
시게오 나카무라
Original Assignee
아지노모토 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20140005782A publication Critical patent/KR20140005782A/ko
Application granted granted Critical
Publication of KR102088628B1 publication Critical patent/KR102088628B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020130076868A 2012-07-05 2013-07-02 지지체 부착 수지 시트 KR102088628B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-151151 2012-07-05
JP2012151151A JP6011079B2 (ja) 2012-07-05 2012-07-05 支持体付き樹脂シート

Publications (2)

Publication Number Publication Date
KR20140005782A KR20140005782A (ko) 2014-01-15
KR102088628B1 true KR102088628B1 (ko) 2020-03-16

Family

ID=50109364

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130076868A KR102088628B1 (ko) 2012-07-05 2013-07-02 지지체 부착 수지 시트

Country Status (3)

Country Link
JP (1) JP6011079B2 (ja)
KR (1) KR102088628B1 (ja)
TW (1) TWI616333B (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6098988B2 (ja) * 2012-09-28 2017-03-22 味の素株式会社 支持体含有プレポリマーシート
JP6164113B2 (ja) * 2014-02-19 2017-07-19 味の素株式会社 支持体付き樹脂シート
JP6413654B2 (ja) * 2014-11-04 2018-10-31 味の素株式会社 回路基板及びその製造方法
WO2016117243A1 (ja) * 2015-01-21 2016-07-28 味の素株式会社 樹脂シートの製造方法
JP6413831B2 (ja) * 2015-02-24 2018-10-31 味の素株式会社 回路基板及びその製造方法
JP2016219478A (ja) * 2015-05-15 2016-12-22 イビデン株式会社 配線基板及びその製造方法
JP6623632B2 (ja) * 2015-09-11 2019-12-25 日立化成株式会社 絶縁樹脂フィルム及び多層プリント配線板
CN105357872A (zh) * 2015-10-22 2016-02-24 重庆方正高密电子有限公司 一种pcb板孔壁上胶渣的检测方法
JP6728760B2 (ja) * 2016-02-25 2020-07-22 味の素株式会社 支持体付き樹脂シート
JP6627575B2 (ja) * 2016-03-02 2020-01-08 味の素株式会社 支持体付き樹脂シート
JP6676593B2 (ja) * 2017-09-08 2020-04-08 リンテック株式会社 樹脂シートおよび半導体装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009202517A (ja) * 2008-02-29 2009-09-10 Sekisui Chem Co Ltd 多層絶縁フィルムと多層プリント配線板の製造方法
JP2010267712A (ja) * 2009-05-13 2010-11-25 Sekisui Chem Co Ltd 多層回路基板の製造方法
JP2011089038A (ja) * 2009-10-22 2011-05-06 Ajinomoto Co Inc 樹脂組成物
JP2011256300A (ja) * 2010-06-10 2011-12-22 Ajinomoto Co Inc 樹脂組成物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008090835A1 (ja) * 2007-01-23 2008-07-31 Ajinomoto Co., Inc. 多層プリント配線板の製造方法
JP5181769B2 (ja) * 2008-03-26 2013-04-10 Ｄｉｃ株式会社 エポキシ樹脂組成物、及びその硬化物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009202517A (ja) * 2008-02-29 2009-09-10 Sekisui Chem Co Ltd 多層絶縁フィルムと多層プリント配線板の製造方法
JP2010267712A (ja) * 2009-05-13 2010-11-25 Sekisui Chem Co Ltd 多層回路基板の製造方法
JP2011089038A (ja) * 2009-10-22 2011-05-06 Ajinomoto Co Inc 樹脂組成物
JP2011256300A (ja) * 2010-06-10 2011-12-22 Ajinomoto Co Inc 樹脂組成物

Also Published As

Publication number Publication date
TWI616333B (zh) 2018-03-01
TW201414606A (zh) 2014-04-16
JP6011079B2 (ja) 2016-10-19
JP2014013854A (ja) 2014-01-23
KR20140005782A (ko) 2014-01-15

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