KR102076479B1 - 배선 기판의 제조 방법 - Google Patents

배선 기판의 제조 방법 Download PDF

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Publication number
KR102076479B1
KR102076479B1 KR1020157030969A KR20157030969A KR102076479B1 KR 102076479 B1 KR102076479 B1 KR 102076479B1 KR 1020157030969 A KR1020157030969 A KR 1020157030969A KR 20157030969 A KR20157030969 A KR 20157030969A KR 102076479 B1 KR102076479 B1 KR 102076479B1
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KR
South Korea
Prior art keywords
resist layer
soldering resist
connection pad
connection
wiring board
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KR1020157030969A
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English (en)
Korean (ko)
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KR20160013007A (ko
Inventor
유지 도요다
노리히코 고칸
노리유키 가와이
구니히로 나카가와
Original Assignee
미쓰비시 세이시 가부시키가이샤
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Publication of KR20160013007A publication Critical patent/KR20160013007A/ko
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Publication of KR102076479B1 publication Critical patent/KR102076479B1/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/288—Removal of non-metallic coatings, e.g. for repairing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
KR1020157030969A 2013-05-22 2014-05-15 배선 기판의 제조 방법 Active KR102076479B1 (ko)

Applications Claiming Priority (21)

Application Number Priority Date Filing Date Title
JPJP-P-2013-107932 2013-05-22
JP2013107932 2013-05-22
JPJP-P-2013-125178 2013-06-14
JP2013125178 2013-06-14
JP2013131839 2013-06-24
JPJP-P-2013-131839 2013-06-24
JPJP-P-2013-139706 2013-07-03
JP2013139706 2013-07-03
JP2013142482 2013-07-08
JPJP-P-2013-142482 2013-07-08
JPJP-P-2013-147430 2013-07-16
JP2013147430 2013-07-16
JPJP-P-2013-150825 2013-07-19
JP2013150825 2013-07-19
JP2013150824 2013-07-19
JPJP-P-2013-150824 2013-07-19
JP2014086392 2014-04-18
JPJP-P-2014-086392 2014-04-18
JP2014090220 2014-04-24
JPJP-P-2014-090220 2014-04-24
PCT/JP2014/062928 WO2014188945A1 (ja) 2013-05-22 2014-05-15 配線基板の製造方法

Publications (2)

Publication Number Publication Date
KR20160013007A KR20160013007A (ko) 2016-02-03
KR102076479B1 true KR102076479B1 (ko) 2020-02-12

Family

ID=51933504

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Application Number Title Priority Date Filing Date
KR1020157030969A Active KR102076479B1 (ko) 2013-05-22 2014-05-15 배선 기판의 제조 방법

Country Status (5)

Country Link
JP (3) JP6224520B2 (enExample)
KR (1) KR102076479B1 (enExample)
CN (4) CN105210460B (enExample)
TW (1) TWI625996B (enExample)
WO (1) WO2014188945A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022231015A1 (ko) * 2021-04-26 2022-11-03 엘지이노텍 주식회사 회로기판
US12456671B2 (en) 2022-06-27 2025-10-28 Samsung Electronics Co., Ltd. Semiconductor package

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6075643B2 (ja) * 2013-11-28 2017-02-08 京セラ株式会社 配線基板の製造方法
KR200491846Y1 (ko) 2014-12-10 2020-06-17 미쓰비시 세이시 가부시키가이샤 레지스트층의 박막화 장치
TWI675256B (zh) * 2015-03-13 2019-10-21 日商三菱製紙股份有限公司 阻焊劑圖型之形成方法
JP6656027B2 (ja) * 2015-03-13 2020-03-04 三菱製紙株式会社 ソルダーレジストパターンの形成方法
KR102814782B1 (ko) * 2020-03-12 2025-05-30 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
KR102898765B1 (ko) 2020-04-23 2025-12-12 엘지이노텍 주식회사 회로 기판
KR20210154450A (ko) 2020-06-12 2021-12-21 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
KR20210154454A (ko) * 2020-06-12 2021-12-21 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법
US11551939B2 (en) * 2020-09-02 2023-01-10 Qualcomm Incorporated Substrate comprising interconnects embedded in a solder resist layer
CN113517202A (zh) * 2021-05-27 2021-10-19 日月光半导体(上海)有限公司 集成电路装置及其制造方法
CN113950193B (zh) * 2021-09-24 2024-09-10 上海富乐华半导体科技有限公司 Dbc覆铜陶瓷基板上圆形半腐蚀沉孔的设计方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004140089A (ja) 2002-10-16 2004-05-13 Dainippon Printing Co Ltd 多層配線基板およびフリップチップ方式の半導体パッケージ

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS346263B1 (enExample) 1957-01-18 1959-07-18
EP0377872A2 (de) * 1989-01-09 1990-07-18 Siemens Aktiengesellschaft Verfahren zum Aufbringen einer Lötstoppabdeckung auf Leiterplatten
JPH05226505A (ja) 1992-02-18 1993-09-03 Ibiden Co Ltd プリント配線板
JPH0659449A (ja) * 1992-08-06 1994-03-04 Tamura Kaken Kk 感光性樹脂組成物
JPH0661647A (ja) * 1992-08-07 1994-03-04 Fujitsu Ltd 薄膜回路基板の製造方法
JP3395222B2 (ja) * 1992-12-10 2003-04-07 松下電器産業株式会社 プリント配線板の製造方法
WO1997025839A1 (en) * 1996-01-11 1997-07-17 Ibiden Co., Ltd. Printed wiring board and method for manufacturing the same
JP3856414B2 (ja) * 1997-12-25 2006-12-13 日本ビクター株式会社 プリント配線基板の製造方法及びプリント配線基板
JP2001135919A (ja) * 1999-11-08 2001-05-18 Sumitomo Metal Electronics Devices Inc プラスチックパッケージの製造方法
JP3767676B2 (ja) * 2000-09-12 2006-04-19 信越化学工業株式会社 オルガノシロキサン系高分子化合物及び光硬化性樹脂組成物並びにパターン形成方法及び基板保護用皮膜
KR100389314B1 (ko) * 2001-07-18 2003-06-25 엘지전자 주식회사 도금인입선 없는 인쇄회로기판의 제조방법
TWI312166B (en) * 2001-09-28 2009-07-11 Toppan Printing Co Ltd Multi-layer circuit board, integrated circuit package, and manufacturing method for multi-layer circuit board
WO2004073370A1 (ja) * 2003-02-13 2004-08-26 Fujikura Ltd. 多層基板およびその製造方法
CN1926930B (zh) * 2004-03-03 2011-06-15 新光电气工业株式会社 电路板制造方法与电路板
CN100459077C (zh) * 2006-03-15 2009-02-04 日月光半导体制造股份有限公司 基板的制造方法
JP4660826B2 (ja) * 2006-08-18 2011-03-30 山栄化学株式会社 レジストパターンの形成方法
CN100555619C (zh) * 2007-04-11 2009-10-28 全懋精密科技股份有限公司 基板表面处理结构及其制作方法
KR100850243B1 (ko) * 2007-07-26 2008-08-04 삼성전기주식회사 인쇄회로기판 및 그 제조방법
CN101364586B (zh) * 2007-08-10 2010-06-23 全懋精密科技股份有限公司 封装基板结构
CN101170069A (zh) * 2007-11-21 2008-04-30 健鼎（无锡）电子有限公司 高对准度的防焊层开口方法
TWI355222B (en) * 2008-12-18 2011-12-21 Unimicron Technology Corp Surface plating process for circuit substrate
CN101668390B (zh) * 2009-09-22 2011-06-08 深圳崇达多层线路板有限公司 一种印刷线路板阻焊层的生产工艺
JP5255545B2 (ja) 2009-09-29 2013-08-07 三菱製紙株式会社 ソルダーレジストの形成方法
CN102088822B (zh) * 2009-12-08 2014-12-17 三星半导体(中国)研究开发有限公司 具有焊点自保护功能的pcb基板及其焊盘制作工艺
KR101891840B1 (ko) * 2010-09-28 2018-08-24 미쓰비시 세이시 가부시키가이샤 솔더 레지스트 패턴의 형성 방법
JP5830925B2 (ja) 2011-05-10 2015-12-09 日立化成株式会社 プリント配線板の製造方法
JP2013041958A (ja) * 2011-08-15 2013-02-28 Hitachi Cable Ltd プリント配線基板およびプリント配線基板の製造方法
JP3182371U (ja) * 2012-02-10 2013-03-21 三菱製紙株式会社 レジスト層の薄膜化処理装置
JP2014078551A (ja) * 2012-10-09 2014-05-01 Ngk Spark Plug Co Ltd 配線基板、配線基板の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004140089A (ja) 2002-10-16 2004-05-13 Dainippon Printing Co Ltd 多層配線基板およびフリップチップ方式の半導体パッケージ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022231015A1 (ko) * 2021-04-26 2022-11-03 엘지이노텍 주식회사 회로기판
US12456671B2 (en) 2022-06-27 2025-10-28 Samsung Electronics Co., Ltd. Semiconductor package

Also Published As

Publication number Publication date
CN107969076B (zh) 2020-04-28
CN107969076A (zh) 2018-04-27
WO2014188945A1 (ja) 2014-11-27
TW201509256A (zh) 2015-03-01
CN107969077B (zh) 2020-02-18
JP6416323B2 (ja) 2018-10-31
JP2017183744A (ja) 2017-10-05
JP2018139318A (ja) 2018-09-06
JP2015216332A (ja) 2015-12-03
CN107969077A (zh) 2018-04-27
CN107979919A (zh) 2018-05-01
CN107979919B (zh) 2020-07-10
KR20160013007A (ko) 2016-02-03
CN105210460A (zh) 2015-12-30
CN105210460B (zh) 2019-01-11
TWI625996B (zh) 2018-06-01
JP6224520B2 (ja) 2017-11-01
JP6514807B2 (ja) 2019-05-15

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