KR102063450B1 - 워크 분할장치 및 워크 분할방법 - Google Patents

워크 분할장치 및 워크 분할방법 Download PDF

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Publication number
KR102063450B1
KR102063450B1 KR1020170062855A KR20170062855A KR102063450B1 KR 102063450 B1 KR102063450 B1 KR 102063450B1 KR 1020170062855 A KR1020170062855 A KR 1020170062855A KR 20170062855 A KR20170062855 A KR 20170062855A KR 102063450 B1 KR102063450 B1 KR 102063450B1
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South Korea
Prior art keywords
dicing tape
work
heating
optical heating
wafer
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KR1020170062855A
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English (en)
Korean (ko)
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KR20170063475A (ko
Inventor
다스쿠 시미즈
다카시 후지타
노부오 고지마
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가부시키가이샤 토쿄 세이미쯔
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Publication of KR20170063475A publication Critical patent/KR20170063475A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Dicing (AREA)
KR1020170062855A 2011-02-16 2017-05-22 워크 분할장치 및 워크 분할방법 Active KR102063450B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2011031292 2011-02-16
JPJP-P-2011-031292 2011-02-16
JPJP-P-2012-000142 2012-01-04
JP2012000142A JP5854215B2 (ja) 2011-02-16 2012-01-04 ワーク分割装置及びワーク分割方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020120013859A Division KR101843794B1 (ko) 2011-02-16 2012-02-10 워크 분할장치 및 워크 분할방법

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020190179457A Division KR102105280B1 (ko) 2011-02-16 2019-12-31 워크 분할장치 및 워크 분할방법

Publications (2)

Publication Number Publication Date
KR20170063475A KR20170063475A (ko) 2017-06-08
KR102063450B1 true KR102063450B1 (ko) 2020-01-08

Family

ID=47016199

Family Applications (4)

Application Number Title Priority Date Filing Date
KR1020170062855A Active KR102063450B1 (ko) 2011-02-16 2017-05-22 워크 분할장치 및 워크 분할방법
KR1020180033136A Active KR102102596B1 (ko) 2011-02-16 2018-03-22 워크 분할장치 및 워크 분할방법
KR1020190179457A Active KR102105280B1 (ko) 2011-02-16 2019-12-31 워크 분할장치 및 워크 분할방법
KR1020200047391A Active KR102225430B1 (ko) 2011-02-16 2020-04-20 워크 분할장치 및 워크 분할방법

Family Applications After (3)

Application Number Title Priority Date Filing Date
KR1020180033136A Active KR102102596B1 (ko) 2011-02-16 2018-03-22 워크 분할장치 및 워크 분할방법
KR1020190179457A Active KR102105280B1 (ko) 2011-02-16 2019-12-31 워크 분할장치 및 워크 분할방법
KR1020200047391A Active KR102225430B1 (ko) 2011-02-16 2020-04-20 워크 분할장치 및 워크 분할방법

Country Status (2)

Country Link
JP (1) JP5854215B2 (enExample)
KR (4) KR102063450B1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101658815B1 (ko) * 2015-04-16 2016-09-22 디에이치케이솔루션(주) 웨이퍼 확장 방법
CN110838462B (zh) * 2018-08-15 2022-12-13 北科天绘(合肥)激光技术有限公司 一种器件阵列的巨量转移方法及系统
JP7313219B2 (ja) 2019-07-22 2023-07-24 株式会社ディスコ エキスパンド方法及びエキスパンド装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005045149A (ja) 2003-07-25 2005-02-17 Tokyo Seimitsu Co Ltd エキスパンド方法
JP2005142365A (ja) 2003-11-06 2005-06-02 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2005317732A (ja) 2004-04-28 2005-11-10 Dainippon Printing Co Ltd 支持シート付ウエハ
JP2007157887A (ja) 2005-12-02 2007-06-21 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2007226911A (ja) 2006-02-24 2007-09-06 Ricoh Co Ltd 光情報記録媒体の製造方法、製造装置、及び光情報記録媒体
JP2010147317A (ja) 2008-12-19 2010-07-01 Disco Abrasive Syst Ltd テープ拡張方法およびテープ拡張装置
JP2010206136A (ja) * 2009-03-06 2010-09-16 Disco Abrasive Syst Ltd ワーク分割装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07321070A (ja) * 1994-05-26 1995-12-08 Rohm Co Ltd ウェハのエキスパンド方法
JP4288392B2 (ja) 2003-09-29 2009-07-01 株式会社東京精密 エキスパンド方法
WO2004038779A1 (ja) * 2002-10-28 2004-05-06 Tokyo Seimitsu Co., Ltd. エキスパンド方法及びエキスパンド装置
JP2004200381A (ja) * 2002-12-18 2004-07-15 Renesas Technology Corp 半導体装置の製造方法および半導体製造装置
JP2007123658A (ja) * 2005-10-31 2007-05-17 Disco Abrasive Syst Ltd 粘着テープの拡張装置
JP4841944B2 (ja) 2005-12-07 2011-12-21 株式会社ディスコ 加工装置
JP2010147316A (ja) 2008-12-19 2010-07-01 Disco Abrasive Syst Ltd テープ拡張方法およびテープ拡張装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005045149A (ja) 2003-07-25 2005-02-17 Tokyo Seimitsu Co Ltd エキスパンド方法
JP2005142365A (ja) 2003-11-06 2005-06-02 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2005317732A (ja) 2004-04-28 2005-11-10 Dainippon Printing Co Ltd 支持シート付ウエハ
JP2007157887A (ja) 2005-12-02 2007-06-21 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2007226911A (ja) 2006-02-24 2007-09-06 Ricoh Co Ltd 光情報記録媒体の製造方法、製造装置、及び光情報記録媒体
JP2010147317A (ja) 2008-12-19 2010-07-01 Disco Abrasive Syst Ltd テープ拡張方法およびテープ拡張装置
JP2010206136A (ja) * 2009-03-06 2010-09-16 Disco Abrasive Syst Ltd ワーク分割装置

Also Published As

Publication number Publication date
KR102102596B1 (ko) 2020-04-21
JP2012186446A (ja) 2012-09-27
KR20200045456A (ko) 2020-05-04
KR20170063475A (ko) 2017-06-08
KR102105280B1 (ko) 2020-04-27
JP5854215B2 (ja) 2016-02-09
KR102225430B1 (ko) 2021-03-08
KR20200003773A (ko) 2020-01-10
KR20180036661A (ko) 2018-04-09

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