KR102063450B1 - 워크 분할장치 및 워크 분할방법 - Google Patents

워크 분할장치 및 워크 분할방법 Download PDF

Info

Publication number
KR102063450B1
KR102063450B1 KR1020170062855A KR20170062855A KR102063450B1 KR 102063450 B1 KR102063450 B1 KR 102063450B1 KR 1020170062855 A KR1020170062855 A KR 1020170062855A KR 20170062855 A KR20170062855 A KR 20170062855A KR 102063450 B1 KR102063450 B1 KR 102063450B1
Authority
KR
South Korea
Prior art keywords
dicing tape
work
heating
optical heating
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020170062855A
Other languages
English (en)
Korean (ko)
Other versions
KR20170063475A (ko
Inventor
다스쿠 시미즈
다카시 후지타
노부오 고지마
Original Assignee
가부시키가이샤 토쿄 세이미쯔
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 토쿄 세이미쯔 filed Critical 가부시키가이샤 토쿄 세이미쯔
Publication of KR20170063475A publication Critical patent/KR20170063475A/ko
Application granted granted Critical
Publication of KR102063450B1 publication Critical patent/KR102063450B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Dicing (AREA)
KR1020170062855A 2011-02-16 2017-05-22 워크 분할장치 및 워크 분할방법 Active KR102063450B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2011031292 2011-02-16
JPJP-P-2011-031292 2011-02-16
JPJP-P-2012-000142 2012-01-04
JP2012000142A JP5854215B2 (ja) 2011-02-16 2012-01-04 ワーク分割装置及びワーク分割方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020120013859A Division KR101843794B1 (ko) 2011-02-16 2012-02-10 워크 분할장치 및 워크 분할방법

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020190179457A Division KR102105280B1 (ko) 2011-02-16 2019-12-31 워크 분할장치 및 워크 분할방법

Publications (2)

Publication Number Publication Date
KR20170063475A KR20170063475A (ko) 2017-06-08
KR102063450B1 true KR102063450B1 (ko) 2020-01-08

Family

ID=47016199

Family Applications (4)

Application Number Title Priority Date Filing Date
KR1020170062855A Active KR102063450B1 (ko) 2011-02-16 2017-05-22 워크 분할장치 및 워크 분할방법
KR1020180033136A Active KR102102596B1 (ko) 2011-02-16 2018-03-22 워크 분할장치 및 워크 분할방법
KR1020190179457A Active KR102105280B1 (ko) 2011-02-16 2019-12-31 워크 분할장치 및 워크 분할방법
KR1020200047391A Active KR102225430B1 (ko) 2011-02-16 2020-04-20 워크 분할장치 및 워크 분할방법

Family Applications After (3)

Application Number Title Priority Date Filing Date
KR1020180033136A Active KR102102596B1 (ko) 2011-02-16 2018-03-22 워크 분할장치 및 워크 분할방법
KR1020190179457A Active KR102105280B1 (ko) 2011-02-16 2019-12-31 워크 분할장치 및 워크 분할방법
KR1020200047391A Active KR102225430B1 (ko) 2011-02-16 2020-04-20 워크 분할장치 및 워크 분할방법

Country Status (2)

Country Link
JP (1) JP5854215B2 (enrdf_load_stackoverflow)
KR (4) KR102063450B1 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101658815B1 (ko) * 2015-04-16 2016-09-22 디에이치케이솔루션(주) 웨이퍼 확장 방법
CN110838462B (zh) * 2018-08-15 2022-12-13 北科天绘(合肥)激光技术有限公司 一种器件阵列的巨量转移方法及系统
JP7313219B2 (ja) * 2019-07-22 2023-07-24 株式会社ディスコ エキスパンド方法及びエキスパンド装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005045149A (ja) 2003-07-25 2005-02-17 Tokyo Seimitsu Co Ltd エキスパンド方法
JP2005142365A (ja) 2003-11-06 2005-06-02 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2005317732A (ja) 2004-04-28 2005-11-10 Dainippon Printing Co Ltd 支持シート付ウエハ
JP2007157887A (ja) 2005-12-02 2007-06-21 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2007226911A (ja) 2006-02-24 2007-09-06 Ricoh Co Ltd 光情報記録媒体の製造方法、製造装置、及び光情報記録媒体
JP2010147317A (ja) 2008-12-19 2010-07-01 Disco Abrasive Syst Ltd テープ拡張方法およびテープ拡張装置
JP2010206136A (ja) * 2009-03-06 2010-09-16 Disco Abrasive Syst Ltd ワーク分割装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07321070A (ja) * 1994-05-26 1995-12-08 Rohm Co Ltd ウェハのエキスパンド方法
JP4288392B2 (ja) * 2003-09-29 2009-07-01 株式会社東京精密 エキスパンド方法
EP1575081A1 (en) * 2002-10-28 2005-09-14 Tokyo Seimitsu Co.,Ltd. Expansion method and device
JP2004200381A (ja) * 2002-12-18 2004-07-15 Renesas Technology Corp 半導体装置の製造方法および半導体製造装置
JP2007123658A (ja) * 2005-10-31 2007-05-17 Disco Abrasive Syst Ltd 粘着テープの拡張装置
JP4841944B2 (ja) 2005-12-07 2011-12-21 株式会社ディスコ 加工装置
JP2010147316A (ja) * 2008-12-19 2010-07-01 Disco Abrasive Syst Ltd テープ拡張方法およびテープ拡張装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005045149A (ja) 2003-07-25 2005-02-17 Tokyo Seimitsu Co Ltd エキスパンド方法
JP2005142365A (ja) 2003-11-06 2005-06-02 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2005317732A (ja) 2004-04-28 2005-11-10 Dainippon Printing Co Ltd 支持シート付ウエハ
JP2007157887A (ja) 2005-12-02 2007-06-21 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2007226911A (ja) 2006-02-24 2007-09-06 Ricoh Co Ltd 光情報記録媒体の製造方法、製造装置、及び光情報記録媒体
JP2010147317A (ja) 2008-12-19 2010-07-01 Disco Abrasive Syst Ltd テープ拡張方法およびテープ拡張装置
JP2010206136A (ja) * 2009-03-06 2010-09-16 Disco Abrasive Syst Ltd ワーク分割装置

Also Published As

Publication number Publication date
KR102225430B1 (ko) 2021-03-08
KR102105280B1 (ko) 2020-04-27
JP2012186446A (ja) 2012-09-27
JP5854215B2 (ja) 2016-02-09
KR20180036661A (ko) 2018-04-09
KR20170063475A (ko) 2017-06-08
KR20200003773A (ko) 2020-01-10
KR102102596B1 (ko) 2020-04-21
KR20200045456A (ko) 2020-05-04

Similar Documents

Publication Publication Date Title
JP6452016B1 (ja) ワーク分割装置及びワーク分割方法
JP6249586B2 (ja) ワーク分割装置及びワーク分割方法
KR102105280B1 (ko) 워크 분할장치 및 워크 분할방법
JP5885033B2 (ja) ワーク分割装置及びワーク分割方法
JP7030469B2 (ja) テープ拡張装置及びテープ拡張方法
JP2018170525A (ja) ワーク分割装置及びワーク分割方法
KR20120094429A (ko) 워크 분할장치 및 워크 분할방법
KR20120094428A (ko) 워크 분할장치 및 워크 분할방법
JP6414995B2 (ja) ワーク分割装置及びワーク分割方法
JP5939416B2 (ja) ワーク分割装置及びワーク分割方法
JP6060475B2 (ja) ワーク分割装置及びワーク分割方法

Legal Events

Date Code Title Description
A107 Divisional application of patent
A201 Request for examination
PA0107 Divisional application

Comment text: Divisional Application of Patent

Patent event date: 20170522

Patent event code: PA01071R01D

Filing date: 20120210

Application number text: 1020120013859

PA0201 Request for examination
PG1501 Laying open of application
A302 Request for accelerated examination
PA0302 Request for accelerated examination

Patent event date: 20170710

Patent event code: PA03022R01D

Comment text: Request for Accelerated Examination

Patent event date: 20170522

Patent event code: PA03021R04I

Comment text: Divisional Application of Patent

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20170720

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20180112

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20170720

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

J201 Request for trial against refusal decision
PJ0201 Trial against decision of rejection

Patent event date: 20180412

Comment text: Request for Trial against Decision on Refusal

Patent event code: PJ02012R01D

Patent event date: 20180112

Comment text: Decision to Refuse Application

Patent event code: PJ02011S01I

Appeal kind category: Appeal against decision to decline refusal

Appeal identifier: 2018101001610

Request date: 20180412

J301 Trial decision

Free format text: TRIAL NUMBER: 2018101001610; TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20180412

Effective date: 20190923

PJ1301 Trial decision

Patent event code: PJ13011S01D

Patent event date: 20190923

Comment text: Trial Decision on Objection to Decision on Refusal

Appeal kind category: Appeal against decision to decline refusal

Request date: 20180412

Decision date: 20190923

Appeal identifier: 2018101001610

PS0901 Examination by remand of revocation
S901 Examination by remand of revocation
GRNO Decision to grant (after opposition)
PS0701 Decision of registration after remand of revocation

Patent event date: 20191001

Patent event code: PS07012S01D

Comment text: Decision to Grant Registration

Patent event date: 20190925

Patent event code: PS07011S01I

Comment text: Notice of Trial Decision (Remand of Revocation)

A107 Divisional application of patent
PA0107 Divisional application

Comment text: Divisional Application of Patent

Patent event date: 20191231

Patent event code: PA01071R01D

Filing date: 20120210

Application number text: 1020120013859

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20200102

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20200102

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20241216

Start annual number: 6

End annual number: 6