JP5854215B2 - ワーク分割装置及びワーク分割方法 - Google Patents

ワーク分割装置及びワーク分割方法 Download PDF

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Publication number
JP5854215B2
JP5854215B2 JP2012000142A JP2012000142A JP5854215B2 JP 5854215 B2 JP5854215 B2 JP 5854215B2 JP 2012000142 A JP2012000142 A JP 2012000142A JP 2012000142 A JP2012000142 A JP 2012000142A JP 5854215 B2 JP5854215 B2 JP 5854215B2
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Japan
Prior art keywords
dicing tape
heating device
light heating
light
workpiece
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JP2012000142A
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English (en)
Japanese (ja)
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JP2012186446A (ja
JP2012186446A5 (enrdf_load_stackoverflow
Inventor
翼 清水
翼 清水
藤田　隆
隆 藤田
恒郎 小島
恒郎 小島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
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Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Priority to JP2012000142A priority Critical patent/JP5854215B2/ja
Priority to KR1020120013859A priority patent/KR101843794B1/ko
Publication of JP2012186446A publication Critical patent/JP2012186446A/ja
Publication of JP2012186446A5 publication Critical patent/JP2012186446A5/ja
Application granted granted Critical
Publication of JP5854215B2 publication Critical patent/JP5854215B2/ja
Priority to KR1020170062855A priority patent/KR102063450B1/ko
Priority to KR1020180033136A priority patent/KR102102596B1/ko
Priority to KR1020190179457A priority patent/KR102105280B1/ko
Priority to KR1020200047391A priority patent/KR102225430B1/ko
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Dicing (AREA)
JP2012000142A 2011-02-16 2012-01-04 ワーク分割装置及びワーク分割方法 Active JP5854215B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2012000142A JP5854215B2 (ja) 2011-02-16 2012-01-04 ワーク分割装置及びワーク分割方法
KR1020120013859A KR101843794B1 (ko) 2011-02-16 2012-02-10 워크 분할장치 및 워크 분할방법
KR1020170062855A KR102063450B1 (ko) 2011-02-16 2017-05-22 워크 분할장치 및 워크 분할방법
KR1020180033136A KR102102596B1 (ko) 2011-02-16 2018-03-22 워크 분할장치 및 워크 분할방법
KR1020190179457A KR102105280B1 (ko) 2011-02-16 2019-12-31 워크 분할장치 및 워크 분할방법
KR1020200047391A KR102225430B1 (ko) 2011-02-16 2020-04-20 워크 분할장치 및 워크 분할방법

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011031292 2011-02-16
JP2011031292 2011-02-16
JP2012000142A JP5854215B2 (ja) 2011-02-16 2012-01-04 ワーク分割装置及びワーク分割方法

Publications (3)

Publication Number Publication Date
JP2012186446A JP2012186446A (ja) 2012-09-27
JP2012186446A5 JP2012186446A5 (enrdf_load_stackoverflow) 2015-03-19
JP5854215B2 true JP5854215B2 (ja) 2016-02-09

Family

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Family Applications (1)

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JP2012000142A Active JP5854215B2 (ja) 2011-02-16 2012-01-04 ワーク分割装置及びワーク分割方法

Country Status (2)

Country Link
JP (1) JP5854215B2 (enrdf_load_stackoverflow)
KR (4) KR102063450B1 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101658815B1 (ko) * 2015-04-16 2016-09-22 디에이치케이솔루션(주) 웨이퍼 확장 방법
CN110838462B (zh) * 2018-08-15 2022-12-13 北科天绘(合肥)激光技术有限公司 一种器件阵列的巨量转移方法及系统
JP7313219B2 (ja) * 2019-07-22 2023-07-24 株式会社ディスコ エキスパンド方法及びエキスパンド装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07321070A (ja) * 1994-05-26 1995-12-08 Rohm Co Ltd ウェハのエキスパンド方法
JP4288392B2 (ja) * 2003-09-29 2009-07-01 株式会社東京精密 エキスパンド方法
JP4306359B2 (ja) * 2003-07-25 2009-07-29 株式会社東京精密 エキスパンド方法
EP1575081A1 (en) * 2002-10-28 2005-09-14 Tokyo Seimitsu Co.,Ltd. Expansion method and device
JP2004200381A (ja) * 2002-12-18 2004-07-15 Renesas Technology Corp 半導体装置の製造方法および半導体製造装置
JP4471627B2 (ja) 2003-11-06 2010-06-02 株式会社ディスコ ウエーハの分割方法
JP2005317732A (ja) 2004-04-28 2005-11-10 Dainippon Printing Co Ltd 支持シート付ウエハ
JP2007123658A (ja) * 2005-10-31 2007-05-17 Disco Abrasive Syst Ltd 粘着テープの拡張装置
JP4777761B2 (ja) 2005-12-02 2011-09-21 株式会社ディスコ ウエーハの分割方法
JP4841944B2 (ja) 2005-12-07 2011-12-21 株式会社ディスコ 加工装置
JP2007226911A (ja) * 2006-02-24 2007-09-06 Ricoh Co Ltd 光情報記録媒体の製造方法、製造装置、及び光情報記録媒体
JP2010147316A (ja) * 2008-12-19 2010-07-01 Disco Abrasive Syst Ltd テープ拡張方法およびテープ拡張装置
JP5378780B2 (ja) 2008-12-19 2013-12-25 株式会社ディスコ テープ拡張方法およびテープ拡張装置
JP5791866B2 (ja) * 2009-03-06 2015-10-07 株式会社ディスコ ワーク分割装置

Also Published As

Publication number Publication date
KR102225430B1 (ko) 2021-03-08
KR102105280B1 (ko) 2020-04-27
JP2012186446A (ja) 2012-09-27
KR20180036661A (ko) 2018-04-09
KR102063450B1 (ko) 2020-01-08
KR20170063475A (ko) 2017-06-08
KR20200003773A (ko) 2020-01-10
KR102102596B1 (ko) 2020-04-21
KR20200045456A (ko) 2020-05-04

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