JP2012186446A5 - - Google Patents

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Publication number
JP2012186446A5
JP2012186446A5 JP2012000142A JP2012000142A JP2012186446A5 JP 2012186446 A5 JP2012186446 A5 JP 2012186446A5 JP 2012000142 A JP2012000142 A JP 2012000142A JP 2012000142 A JP2012000142 A JP 2012000142A JP 2012186446 A5 JP2012186446 A5 JP 2012186446A5
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JP
Japan
Prior art keywords
dicing tape
workpiece
semiconductor wafer
expanding
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012000142A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012186446A (ja
JP5854215B2 (ja
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Publication date
Priority claimed from JP2012000142A external-priority patent/JP5854215B2/ja
Priority to JP2012000142A priority Critical patent/JP5854215B2/ja
Application filed filed Critical
Priority to KR1020120013859A priority patent/KR101843794B1/ko
Publication of JP2012186446A publication Critical patent/JP2012186446A/ja
Publication of JP2012186446A5 publication Critical patent/JP2012186446A5/ja
Publication of JP5854215B2 publication Critical patent/JP5854215B2/ja
Application granted granted Critical
Priority to KR1020170062855A priority patent/KR102063450B1/ko
Priority to KR1020180033136A priority patent/KR102102596B1/ko
Priority to KR1020190179457A priority patent/KR102105280B1/ko
Priority to KR1020200047391A priority patent/KR102225430B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012000142A 2011-02-16 2012-01-04 ワーク分割装置及びワーク分割方法 Active JP5854215B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2012000142A JP5854215B2 (ja) 2011-02-16 2012-01-04 ワーク分割装置及びワーク分割方法
KR1020120013859A KR101843794B1 (ko) 2011-02-16 2012-02-10 워크 분할장치 및 워크 분할방법
KR1020170062855A KR102063450B1 (ko) 2011-02-16 2017-05-22 워크 분할장치 및 워크 분할방법
KR1020180033136A KR102102596B1 (ko) 2011-02-16 2018-03-22 워크 분할장치 및 워크 분할방법
KR1020190179457A KR102105280B1 (ko) 2011-02-16 2019-12-31 워크 분할장치 및 워크 분할방법
KR1020200047391A KR102225430B1 (ko) 2011-02-16 2020-04-20 워크 분할장치 및 워크 분할방법

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011031292 2011-02-16
JP2011031292 2011-02-16
JP2012000142A JP5854215B2 (ja) 2011-02-16 2012-01-04 ワーク分割装置及びワーク分割方法

Publications (3)

Publication Number Publication Date
JP2012186446A JP2012186446A (ja) 2012-09-27
JP2012186446A5 true JP2012186446A5 (enrdf_load_stackoverflow) 2015-03-19
JP5854215B2 JP5854215B2 (ja) 2016-02-09

Family

ID=47016199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012000142A Active JP5854215B2 (ja) 2011-02-16 2012-01-04 ワーク分割装置及びワーク分割方法

Country Status (2)

Country Link
JP (1) JP5854215B2 (enrdf_load_stackoverflow)
KR (4) KR102063450B1 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101658815B1 (ko) * 2015-04-16 2016-09-22 디에이치케이솔루션(주) 웨이퍼 확장 방법
CN110838462B (zh) * 2018-08-15 2022-12-13 北科天绘(合肥)激光技术有限公司 一种器件阵列的巨量转移方法及系统
JP7313219B2 (ja) * 2019-07-22 2023-07-24 株式会社ディスコ エキスパンド方法及びエキスパンド装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07321070A (ja) * 1994-05-26 1995-12-08 Rohm Co Ltd ウェハのエキスパンド方法
JP4288392B2 (ja) * 2003-09-29 2009-07-01 株式会社東京精密 エキスパンド方法
JP4306359B2 (ja) * 2003-07-25 2009-07-29 株式会社東京精密 エキスパンド方法
EP1575081A1 (en) * 2002-10-28 2005-09-14 Tokyo Seimitsu Co.,Ltd. Expansion method and device
JP2004200381A (ja) * 2002-12-18 2004-07-15 Renesas Technology Corp 半導体装置の製造方法および半導体製造装置
JP4471627B2 (ja) 2003-11-06 2010-06-02 株式会社ディスコ ウエーハの分割方法
JP2005317732A (ja) 2004-04-28 2005-11-10 Dainippon Printing Co Ltd 支持シート付ウエハ
JP2007123658A (ja) * 2005-10-31 2007-05-17 Disco Abrasive Syst Ltd 粘着テープの拡張装置
JP4777761B2 (ja) 2005-12-02 2011-09-21 株式会社ディスコ ウエーハの分割方法
JP4841944B2 (ja) 2005-12-07 2011-12-21 株式会社ディスコ 加工装置
JP2007226911A (ja) * 2006-02-24 2007-09-06 Ricoh Co Ltd 光情報記録媒体の製造方法、製造装置、及び光情報記録媒体
JP2010147316A (ja) * 2008-12-19 2010-07-01 Disco Abrasive Syst Ltd テープ拡張方法およびテープ拡張装置
JP5378780B2 (ja) 2008-12-19 2013-12-25 株式会社ディスコ テープ拡張方法およびテープ拡張装置
JP5791866B2 (ja) * 2009-03-06 2015-10-07 株式会社ディスコ ワーク分割装置

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