SG11201609530VA - Dicing tape thermal management by wafer frame support ring cooling during plasma dicing - Google Patents
Dicing tape thermal management by wafer frame support ring cooling during plasma dicingInfo
- Publication number
- SG11201609530VA SG11201609530VA SG11201609530VA SG11201609530VA SG11201609530VA SG 11201609530V A SG11201609530V A SG 11201609530VA SG 11201609530V A SG11201609530V A SG 11201609530VA SG 11201609530V A SG11201609530V A SG 11201609530VA SG 11201609530V A SG11201609530V A SG 11201609530VA
- Authority
- SG
- Singapore
- Prior art keywords
- dicing
- support ring
- thermal management
- frame support
- during plasma
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Drying Of Semiconductors (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/276,683 US9112050B1 (en) | 2014-05-13 | 2014-05-13 | Dicing tape thermal management by wafer frame support ring cooling during plasma dicing |
PCT/US2015/029259 WO2015175267A1 (en) | 2014-05-13 | 2015-05-05 | Dicing tape thermal management by wafer frame support ring cooling during plasma dicing |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201609530VA true SG11201609530VA (en) | 2016-12-29 |
Family
ID=53786106
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201609530VA SG11201609530VA (en) | 2014-05-13 | 2015-05-05 | Dicing tape thermal management by wafer frame support ring cooling during plasma dicing |
Country Status (7)
Country | Link |
---|---|
US (1) | US9112050B1 (en) |
JP (1) | JP6556759B2 (en) |
KR (1) | KR102469595B1 (en) |
CN (1) | CN106716602B (en) |
SG (1) | SG11201609530VA (en) |
TW (1) | TWI658538B (en) |
WO (1) | WO2015175267A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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US8946058B2 (en) * | 2011-03-14 | 2015-02-03 | Plasma-Therm Llc | Method and apparatus for plasma dicing a semi-conductor wafer |
JP6590164B2 (en) * | 2014-12-29 | 2019-10-16 | 株式会社ディスコ | Protective sheet, protective sheet configuration, handling system, and semiconductor size wafer processing method for use in processing semiconductor size wafers |
JP6555656B2 (en) * | 2015-02-17 | 2019-08-07 | パナソニックIpマネジメント株式会社 | Plasma processing apparatus and electronic component manufacturing method |
US10090177B1 (en) * | 2017-08-25 | 2018-10-02 | Micron Technology, Inc. | Cold fluid semiconductor device release during pick and place operations, and associated systems and methods |
JP7045635B2 (en) * | 2017-08-30 | 2022-04-01 | パナソニックIpマネジメント株式会社 | Plasma processing equipment and method |
TWI741262B (en) * | 2018-06-04 | 2021-10-01 | 美商帕斯馬舍門有限責任公司 | Method for dicing die attach film |
KR102158832B1 (en) * | 2018-11-20 | 2020-09-22 | 한화정밀기계 주식회사 | Wafer dicing method and apparatus |
JP7301477B2 (en) * | 2019-08-09 | 2023-07-03 | 株式会社ディスコ | Plasma etching equipment |
JP7281741B2 (en) * | 2019-08-23 | 2023-05-26 | パナソニックIpマネジメント株式会社 | Element chip smoothing method and element chip manufacturing method |
CN113851402A (en) * | 2021-05-31 | 2021-12-28 | 华灿光电(苏州)有限公司 | Tray for plasma etcher and plasma etcher |
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-
2014
- 2014-05-13 US US14/276,683 patent/US9112050B1/en active Active
-
2015
- 2015-05-05 WO PCT/US2015/029259 patent/WO2015175267A1/en active Application Filing
- 2015-05-05 SG SG11201609530VA patent/SG11201609530VA/en unknown
- 2015-05-05 KR KR1020167034878A patent/KR102469595B1/en active IP Right Grant
- 2015-05-05 JP JP2016567806A patent/JP6556759B2/en active Active
- 2015-05-05 CN CN201580031646.9A patent/CN106716602B/en active Active
- 2015-05-12 TW TW104115065A patent/TWI658538B/en active
Also Published As
Publication number | Publication date |
---|---|
KR20170003682A (en) | 2017-01-09 |
JP2017518637A (en) | 2017-07-06 |
CN106716602A (en) | 2017-05-24 |
WO2015175267A1 (en) | 2015-11-19 |
TWI658538B (en) | 2019-05-01 |
US9112050B1 (en) | 2015-08-18 |
KR102469595B1 (en) | 2022-11-22 |
CN106716602B (en) | 2020-06-16 |
JP6556759B2 (en) | 2019-08-07 |
TW201603196A (en) | 2016-01-16 |
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