KR102051697B1 - 알루미늄 부재와 구리 부재의 접합 구조 - Google Patents

알루미늄 부재와 구리 부재의 접합 구조 Download PDF

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Publication number
KR102051697B1
KR102051697B1 KR1020157004288A KR20157004288A KR102051697B1 KR 102051697 B1 KR102051697 B1 KR 102051697B1 KR 1020157004288 A KR1020157004288 A KR 1020157004288A KR 20157004288 A KR20157004288 A KR 20157004288A KR 102051697 B1 KR102051697 B1 KR 102051697B1
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South Korea
Prior art keywords
copper
aluminum
plate
intermetallic compound
interface
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Expired - Fee Related
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KR1020157004288A
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English (en)
Korean (ko)
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KR20150056534A (ko
Inventor
노부유키 데라사키
요시유키 나가토모
Original Assignee
미쓰비시 마테리알 가부시키가이샤
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Publication of KR20150056534A publication Critical patent/KR20150056534A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/017—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of aluminium or an aluminium alloy, another layer being formed of an alloy based on a non ferrous metal other than aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
    • B23K20/2333—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer one layer being aluminium, magnesium or beryllium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/1266—O, S, or organic compound in metal component
    • Y10T428/12667—Oxide of transition metal or Al

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020157004288A 2012-09-21 2013-09-18 알루미늄 부재와 구리 부재의 접합 구조 Expired - Fee Related KR102051697B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2012-208578 2012-09-21
JP2012208578 2012-09-21
PCT/JP2013/075158 WO2014046130A1 (ja) 2012-09-21 2013-09-18 アルミニウム部材と銅部材との接合構造

Publications (2)

Publication Number Publication Date
KR20150056534A KR20150056534A (ko) 2015-05-26
KR102051697B1 true KR102051697B1 (ko) 2019-12-03

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KR1020157004288A Expired - Fee Related KR102051697B1 (ko) 2012-09-21 2013-09-18 알루미늄 부재와 구리 부재의 접합 구조

Country Status (8)

Country Link
US (1) US10011093B2 (enExample)
EP (1) EP2898979B1 (enExample)
JP (1) JP5549958B2 (enExample)
KR (1) KR102051697B1 (enExample)
CN (1) CN104661785B (enExample)
IN (1) IN2015DN02361A (enExample)
TW (1) TWI589382B (enExample)
WO (1) WO2014046130A1 (enExample)

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WO2014046130A1 (ja) * 2012-09-21 2014-03-27 三菱マテリアル株式会社 アルミニウム部材と銅部材との接合構造
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JP6428327B2 (ja) * 2015-02-04 2018-11-28 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板、パワーモジュール、及び、ヒートシンク付パワーモジュール用基板の製造方法
JP6572810B2 (ja) * 2016-03-15 2019-09-11 三菱マテリアル株式会社 接合体の製造方法、及び、パワーモジュール用基板の製造方法
US9875933B2 (en) 2016-06-24 2018-01-23 Infineon Technologies Ag Substrate and method including forming a via comprising a conductive liner layer and conductive plug having different microstructures
US9960229B2 (en) 2016-06-24 2018-05-01 Infineon Technologies Ag Semiconductor device including a LDMOS transistor
CN106077937B (zh) * 2016-06-24 2018-08-03 西安理工大学 一种铝-铜双金属复合材料的制备方法
US10622284B2 (en) * 2016-06-24 2020-04-14 Infineon Technologies Ag LDMOS transistor and method
US10242932B2 (en) 2016-06-24 2019-03-26 Infineon Technologies Ag LDMOS transistor and method
US10050139B2 (en) 2016-06-24 2018-08-14 Infineon Technologies Ag Semiconductor device including a LDMOS transistor and method
CN106475679B (zh) * 2016-11-30 2018-07-27 山东大学 一种铜与铝合金的无中间层非连续加压真空扩散连接工艺
KR101925119B1 (ko) * 2016-12-23 2019-02-27 저지앙 캉성 컴퍼니 리미티드 구리 알루미늄 연결부재의 면-면 삼투용접 공정 및 제조방법
CN106583914B (zh) * 2016-12-23 2019-03-05 浙江康盛股份有限公司 一种铜铝连接件面-面渗溶接工艺
JP6819385B2 (ja) * 2017-03-17 2021-01-27 三菱マテリアル株式会社 半導体装置の製造方法
CN110366777B (zh) * 2017-03-29 2024-04-26 三菱综合材料株式会社 带散热片的绝缘电路基板的制造方法
JP6972627B2 (ja) * 2017-04-05 2021-11-24 株式会社アイシン カーボンナノチューブ複合体の製造方法及び積層体
KR20200138302A (ko) * 2018-03-28 2020-12-09 미쓰비시 마테리알 가부시키가이샤 히트 싱크가 부착된 절연 회로 기판
JP7342371B2 (ja) * 2019-02-14 2023-09-12 三菱マテリアル株式会社 絶縁回路基板、及び、絶縁回路基板の製造方法
JP7546663B2 (ja) 2020-04-13 2024-09-06 エルジー エナジー ソリューション リミテッド 電池モジュールおよびその製造方法
JP7643163B2 (ja) * 2021-04-27 2025-03-11 三菱マテリアル株式会社 ヒートシンク、および、ヒートシンク一体型絶縁回路基板
TWI800244B (zh) * 2022-01-28 2023-04-21 奇鋐科技股份有限公司 具有熱管之散熱器總成
CN117066669A (zh) * 2023-09-15 2023-11-17 深圳市泰瑞琦五金电子有限公司 一种铜铝高分子扩散焊接工艺

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WO2011155379A1 (ja) * 2010-06-08 2011-12-15 株式会社Ｎｅｏｍａｘマテリアル アルミニウム銅クラッド材

Also Published As

Publication number Publication date
TWI589382B (zh) 2017-07-01
CN104661785A (zh) 2015-05-27
TW201433392A (zh) 2014-09-01
CN104661785B (zh) 2017-05-03
WO2014046130A1 (ja) 2014-03-27
US20150251382A1 (en) 2015-09-10
JP5549958B2 (ja) 2014-07-16
JP2014076486A (ja) 2014-05-01
US10011093B2 (en) 2018-07-03
EP2898979A4 (en) 2016-06-08
EP2898979B1 (en) 2019-03-06
IN2015DN02361A (enExample) 2015-09-04
KR20150056534A (ko) 2015-05-26
EP2898979A1 (en) 2015-07-29

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