JP5549958B2 - アルミニウム部材と銅部材との接合構造 - Google Patents

アルミニウム部材と銅部材との接合構造 Download PDF

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Publication number
JP5549958B2
JP5549958B2 JP2013193431A JP2013193431A JP5549958B2 JP 5549958 B2 JP5549958 B2 JP 5549958B2 JP 2013193431 A JP2013193431 A JP 2013193431A JP 2013193431 A JP2013193431 A JP 2013193431A JP 5549958 B2 JP5549958 B2 JP 5549958B2
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Japan
Prior art keywords
copper
aluminum
plate
intermetallic compound
phase
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English (en)
Japanese (ja)
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JP2014076486A (ja
Inventor
伸幸 寺▲崎▼
義幸 長友
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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Priority to JP2013193431A priority Critical patent/JP5549958B2/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/017—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of aluminium or an aluminium alloy, another layer being formed of an alloy based on a non ferrous metal other than aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
    • B23K20/2333—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer one layer being aluminium, magnesium or beryllium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/1266—O, S, or organic compound in metal component
    • Y10T428/12667—Oxide of transition metal or Al

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
JP2013193431A 2012-09-21 2013-09-18 アルミニウム部材と銅部材との接合構造 Active JP5549958B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013193431A JP5549958B2 (ja) 2012-09-21 2013-09-18 アルミニウム部材と銅部材との接合構造

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012208578 2012-09-21
JP2012208578 2012-09-21
JP2013193431A JP5549958B2 (ja) 2012-09-21 2013-09-18 アルミニウム部材と銅部材との接合構造

Publications (2)

Publication Number Publication Date
JP2014076486A JP2014076486A (ja) 2014-05-01
JP5549958B2 true JP5549958B2 (ja) 2014-07-16

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JP2013193431A Active JP5549958B2 (ja) 2012-09-21 2013-09-18 アルミニウム部材と銅部材との接合構造

Country Status (8)

Country Link
US (1) US10011093B2 (enExample)
EP (1) EP2898979B1 (enExample)
JP (1) JP5549958B2 (enExample)
KR (1) KR102051697B1 (enExample)
CN (1) CN104661785B (enExample)
IN (1) IN2015DN02361A (enExample)
TW (1) TWI589382B (enExample)
WO (1) WO2014046130A1 (enExample)

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JP7342371B2 (ja) * 2019-02-14 2023-09-12 三菱マテリアル株式会社 絶縁回路基板、及び、絶縁回路基板の製造方法
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JP7643163B2 (ja) 2021-04-27 2025-03-11 三菱マテリアル株式会社 ヒートシンク、および、ヒートシンク一体型絶縁回路基板
TWI800244B (zh) * 2022-01-28 2023-04-21 奇鋐科技股份有限公司 具有熱管之散熱器總成
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KR20180074201A (ko) * 2016-12-23 2018-07-03 저지앙 캉성 컴퍼니 리미티드 구리 알루미늄 연결부재의 면-면 삼투용접 공정 및 제조방법
KR101925119B1 (ko) * 2016-12-23 2019-02-27 저지앙 캉성 컴퍼니 리미티드 구리 알루미늄 연결부재의 면-면 삼투용접 공정 및 제조방법

Also Published As

Publication number Publication date
US20150251382A1 (en) 2015-09-10
EP2898979A4 (en) 2016-06-08
CN104661785B (zh) 2017-05-03
EP2898979A1 (en) 2015-07-29
TWI589382B (zh) 2017-07-01
WO2014046130A1 (ja) 2014-03-27
CN104661785A (zh) 2015-05-27
IN2015DN02361A (enExample) 2015-09-04
TW201433392A (zh) 2014-09-01
KR20150056534A (ko) 2015-05-26
KR102051697B1 (ko) 2019-12-03
EP2898979B1 (en) 2019-03-06
JP2014076486A (ja) 2014-05-01
US10011093B2 (en) 2018-07-03

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