KR102035923B1 - 기판 반송 장치, 그것을 구비하는 기판 처리 장치 및 기판 반송 방법 - Google Patents

기판 반송 장치, 그것을 구비하는 기판 처리 장치 및 기판 반송 방법 Download PDF

Info

Publication number
KR102035923B1
KR102035923B1 KR1020180011361A KR20180011361A KR102035923B1 KR 102035923 B1 KR102035923 B1 KR 102035923B1 KR 1020180011361 A KR1020180011361 A KR 1020180011361A KR 20180011361 A KR20180011361 A KR 20180011361A KR 102035923 B1 KR102035923 B1 KR 102035923B1
Authority
KR
South Korea
Prior art keywords
substrate
board
unit
holding
virtual
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020180011361A
Other languages
English (en)
Korean (ko)
Inventor
조지 구와하라
Original Assignee
가부시키가이샤 스크린 홀딩스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 스크린 홀딩스 filed Critical 가부시키가이샤 스크린 홀딩스
Application granted granted Critical
Publication of KR102035923B1 publication Critical patent/KR102035923B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H01L21/67742—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/19—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
    • H01L21/67259—
    • H01L21/67715—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3208—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Human Computer Interaction (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Robotics (AREA)
KR1020180011361A 2017-02-14 2018-01-30 기판 반송 장치, 그것을 구비하는 기판 처리 장치 및 기판 반송 방법 Active KR102035923B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2017-025350 2017-02-14
JP2017025350A JP6802726B2 (ja) 2017-02-14 2017-02-14 基板搬送装置、それを備える基板処理装置および基板搬送方法

Publications (1)

Publication Number Publication Date
KR102035923B1 true KR102035923B1 (ko) 2019-10-23

Family

ID=63104593

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180011361A Active KR102035923B1 (ko) 2017-02-14 2018-01-30 기판 반송 장치, 그것을 구비하는 기판 처리 장치 및 기판 반송 방법

Country Status (5)

Country Link
US (1) US10627800B2 (https=)
JP (1) JP6802726B2 (https=)
KR (1) KR102035923B1 (https=)
CN (1) CN108428655B (https=)
TW (1) TWI668788B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220032496A (ko) * 2020-09-07 2022-03-15 가부시키가이샤 스크린 홀딩스 위치 판정 장치, 기판 반송 장치, 위치 판정 방법 및 기판 반송 방법
EP4528794A3 (en) * 2023-09-19 2025-05-14 SCREEN Holdings Co., Ltd. Apparatus for and method of processing substrate

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6923344B2 (ja) 2017-04-13 2021-08-18 株式会社Ｓｃｒｅｅｎホールディングス 周縁処理装置および周縁処理方法
JP7303648B2 (ja) * 2019-03-20 2023-07-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理装置における対象物の搬送方法
KR102763727B1 (ko) * 2019-05-28 2025-02-07 캐논 톡키 가부시키가이샤 기판 반송 시스템, 기판 반송 방법, 기판 처리 시스템 및 기판 처리 방법
US11335578B2 (en) * 2020-02-13 2022-05-17 Kawasaki Jukogyo Kabushiki Kaisha Substrate transfer apparatus and method of measuring positional deviation of substrate
TWI781763B (zh) * 2020-09-18 2022-10-21 日商斯庫林集團股份有限公司 基板洗淨裝置及基板洗淨方法
JP7816869B2 (ja) * 2021-02-26 2026-02-18 東京エレクトロン株式会社 搬送システム、搬送装置及び搬送方法
JP7664063B2 (ja) * 2021-03-19 2025-04-17 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置および基板搬送方法
JP7667035B2 (ja) * 2021-08-27 2025-04-22 キオクシア株式会社 基板処理装置および半導体装置の製造方法
JP7803558B2 (ja) * 2023-11-10 2026-01-21 ヴイエム インコーポレイテッド 搬送された半導体部品の中心位置決め方法及びそのためのシステム
JP2026031071A (ja) * 2024-08-09 2026-02-24 東京エレクトロン株式会社 教示方法、及び半導体製造装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120023517A (ko) * 2010-08-20 2012-03-13 도쿄엘렉트론가부시키가이샤 기판 반송 장치, 기판 반송 방법 및 그 기판 반송 방법을 실행시키기 위한 프로그램을 기록한 기록 매체
KR20120115938A (ko) * 2011-04-11 2012-10-19 도쿄엘렉트론가부시키가이샤 기판 반송 방법, 기판 반송 장치, 및 도포 현상 장치
KR20130090346A (ko) * 2012-02-03 2013-08-13 도쿄엘렉트론가부시키가이샤 기판 반송 장치, 기판 반송 방법 및 기억 매체
KR20160078243A (ko) * 2014-12-24 2016-07-04 도쿄엘렉트론가부시키가이샤 기판 반송 장치 및 기판 반송 방법

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8203318A (nl) * 1982-08-24 1984-03-16 Integrated Automation Inrichting voor processing van substraten.
JP2626582B2 (ja) * 1994-10-27 1997-07-02 日本電気株式会社 ウエハ位置の計測ユニットならびにウエハアライメントユニットおよび方法
US5831851A (en) * 1995-03-21 1998-11-03 Seagate Technology, Inc. Apparatus and method for controlling high throughput sputtering
US5882413A (en) * 1997-07-11 1999-03-16 Brooks Automation, Inc. Substrate processing apparatus having a substrate transport with a front end extension and an internal substrate buffer
US20070269297A1 (en) * 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
JP2005209954A (ja) * 2004-01-23 2005-08-04 Kawasaki Heavy Ind Ltd 基板保持装置
JP5336184B2 (ja) 2005-07-11 2013-11-06 ブルックス オートメーション インコーポレイテッド 自動位置合わせ基板搬送装置
JP2007335613A (ja) * 2006-06-15 2007-12-27 Nikon Corp 基板位置検出装置、基板搬送装置、露光装置、基板位置検出方法及びマイクロデバイスの製造方法
JP2008124194A (ja) * 2006-11-10 2008-05-29 Canon Inc 液浸露光方法および液浸露光装置
JP4697192B2 (ja) 2007-06-12 2011-06-08 東京エレクトロン株式会社 位置ずれ検出装置及びこれを用いた処理システム
US8224607B2 (en) * 2007-08-30 2012-07-17 Applied Materials, Inc. Method and apparatus for robot calibrations with a calibrating device
JP2009071008A (ja) 2007-09-13 2009-04-02 Sokudo:Kk 基板処理装置
JP5490741B2 (ja) 2011-03-02 2014-05-14 東京エレクトロン株式会社 基板搬送装置の位置調整方法、及び基板処理装置
JPWO2012169374A1 (ja) * 2011-06-08 2015-02-23 村田機械株式会社 ワーク処理システム
TWI719331B (zh) * 2011-10-26 2021-02-21 美商布魯克斯自動機械公司 基板處理系統
JP6118044B2 (ja) 2012-07-19 2017-04-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6001961B2 (ja) * 2012-08-29 2016-10-05 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置および基板処理方法
US9488975B2 (en) * 2013-12-18 2016-11-08 Globalfoundries Singapore Pte. Ltd. Methods and media for lot dispatch priority
JP6422695B2 (ja) * 2014-07-18 2018-11-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6880364B2 (ja) * 2015-08-18 2021-06-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6697984B2 (ja) * 2016-08-31 2020-05-27 東京エレクトロン株式会社 基板処理方法及び基板処理システム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120023517A (ko) * 2010-08-20 2012-03-13 도쿄엘렉트론가부시키가이샤 기판 반송 장치, 기판 반송 방법 및 그 기판 반송 방법을 실행시키기 위한 프로그램을 기록한 기록 매체
KR20120115938A (ko) * 2011-04-11 2012-10-19 도쿄엘렉트론가부시키가이샤 기판 반송 방법, 기판 반송 장치, 및 도포 현상 장치
KR20130090346A (ko) * 2012-02-03 2013-08-13 도쿄엘렉트론가부시키가이샤 기판 반송 장치, 기판 반송 방법 및 기억 매체
KR20160078243A (ko) * 2014-12-24 2016-07-04 도쿄엘렉트론가부시키가이샤 기판 반송 장치 및 기판 반송 방법

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220032496A (ko) * 2020-09-07 2022-03-15 가부시키가이샤 스크린 홀딩스 위치 판정 장치, 기판 반송 장치, 위치 판정 방법 및 기판 반송 방법
KR102587482B1 (ko) * 2020-09-07 2023-10-11 가부시키가이샤 스크린 홀딩스 위치 판정 장치, 기판 반송 장치, 위치 판정 방법 및 기판 반송 방법
EP4528794A3 (en) * 2023-09-19 2025-05-14 SCREEN Holdings Co., Ltd. Apparatus for and method of processing substrate

Also Published As

Publication number Publication date
JP2018133415A (ja) 2018-08-23
US10627800B2 (en) 2020-04-21
CN108428655A (zh) 2018-08-21
TWI668788B (zh) 2019-08-11
CN108428655B (zh) 2022-07-22
TW201842615A (zh) 2018-12-01
JP6802726B2 (ja) 2020-12-16
US20180231952A1 (en) 2018-08-16

Similar Documents

Publication Publication Date Title
KR102035923B1 (ko) 기판 반송 장치, 그것을 구비하는 기판 처리 장치 및 기판 반송 방법
KR102045127B1 (ko) 기판 반송 장치, 검출 위치 교정 방법 및 기판 처리 장치
CN106716616B (zh) 基板处理装置以及基板处理方法
US12074048B2 (en) Substrate processing apparatus and substrate processing method
JP6118044B2 (ja) 基板処理装置および基板処理方法
KR102363201B1 (ko) 기판 처리 장치 및 기판 처리 방법
CN103247560B (zh) 基板处理装置和基板处理方法
CN115116889B (zh) 衬底搬送装置及衬底搬送方法
WO2000024551A1 (en) Carrier system positioning method
TWI744956B (zh) 基板搬運裝置以及基板搬運裝置的手部的位置修正方法
TWI763611B (zh) 基板處理裝置以及基板處理方法
JP2015211206A (ja) 基板処理装置および基板処理方法
JP3172900B2 (ja) 基板搬送装置及び基板処理装置及び基板搬送方法及び基板処理方法
US20040261550A1 (en) Substrate detecting apparatus and method, substrate transporting apparatus and method, and substrate processing apparatus and method
US20190049865A1 (en) Substrate processing apparatus, alignment device, substrate processing method and alignment method
KR20060065627A (ko) 박판 형상물의 변위량 검출 방법 및 변위량 수정 방법
TWI803964B (zh) 位置判定裝置、基板搬送裝置、位置判定方法及基板搬送方法
JP2004241484A (ja) 基板の搬送装置及び搬送装置の位置ずれ検出方法
JP2021068804A (ja) 基板処理装置および基板処理方法

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000