TWI668788B - 基板搬送裝置、具備其之基板處理裝置及基板搬送方法 - Google Patents

基板搬送裝置、具備其之基板處理裝置及基板搬送方法 Download PDF

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Publication number
TWI668788B
TWI668788B TW106144945A TW106144945A TWI668788B TW I668788 B TWI668788 B TW I668788B TW 106144945 A TW106144945 A TW 106144945A TW 106144945 A TW106144945 A TW 106144945A TW I668788 B TWI668788 B TW I668788B
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TW
Taiwan
Prior art keywords
substrate
hand
positions
imaginary
section
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TW106144945A
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English (en)
Chinese (zh)
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TW201842615A (zh
Inventor
桒原丈二
Joji Kuwahara
Original Assignee
日商斯庫林集團股份有限公司
SCREEN Holdings Co., Ltd.
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Application filed by 日商斯庫林集團股份有限公司, SCREEN Holdings Co., Ltd. filed Critical 日商斯庫林集團股份有限公司
Publication of TW201842615A publication Critical patent/TW201842615A/zh
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Publication of TWI668788B publication Critical patent/TWI668788B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/19—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3208—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Human Computer Interaction (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Robotics (AREA)
TW106144945A 2017-02-14 2017-12-21 基板搬送裝置、具備其之基板處理裝置及基板搬送方法 TWI668788B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017025350A JP6802726B2 (ja) 2017-02-14 2017-02-14 基板搬送装置、それを備える基板処理装置および基板搬送方法
JP2017-025350 2017-02-14

Publications (2)

Publication Number Publication Date
TW201842615A TW201842615A (zh) 2018-12-01
TWI668788B true TWI668788B (zh) 2019-08-11

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TW106144945A TWI668788B (zh) 2017-02-14 2017-12-21 基板搬送裝置、具備其之基板處理裝置及基板搬送方法

Country Status (5)

Country Link
US (1) US10627800B2 (https=)
JP (1) JP6802726B2 (https=)
KR (1) KR102035923B1 (https=)
CN (1) CN108428655B (https=)
TW (1) TWI668788B (https=)

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JP6923344B2 (ja) 2017-04-13 2021-08-18 株式会社Ｓｃｒｅｅｎホールディングス 周縁処理装置および周縁処理方法
JP7303648B2 (ja) * 2019-03-20 2023-07-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理装置における対象物の搬送方法
KR102763727B1 (ko) * 2019-05-28 2025-02-07 캐논 톡키 가부시키가이샤 기판 반송 시스템, 기판 반송 방법, 기판 처리 시스템 및 기판 처리 방법
US11335578B2 (en) * 2020-02-13 2022-05-17 Kawasaki Jukogyo Kabushiki Kaisha Substrate transfer apparatus and method of measuring positional deviation of substrate
JP7579657B2 (ja) * 2020-09-07 2024-11-08 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置および基板搬送方法
TWI781763B (zh) * 2020-09-18 2022-10-21 日商斯庫林集團股份有限公司 基板洗淨裝置及基板洗淨方法
JP7816869B2 (ja) * 2021-02-26 2026-02-18 東京エレクトロン株式会社 搬送システム、搬送装置及び搬送方法
JP7664063B2 (ja) * 2021-03-19 2025-04-17 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置および基板搬送方法
JP7667035B2 (ja) * 2021-08-27 2025-04-22 キオクシア株式会社 基板処理装置および半導体装置の製造方法
JP2025043483A (ja) 2023-09-19 2025-04-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7803558B2 (ja) * 2023-11-10 2026-01-21 ヴイエム インコーポレイテッド 搬送された半導体部品の中心位置決め方法及びそのためのシステム
JP2026031071A (ja) * 2024-08-09 2026-02-24 東京エレクトロン株式会社 教示方法、及び半導体製造装置

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Also Published As

Publication number Publication date
JP2018133415A (ja) 2018-08-23
US10627800B2 (en) 2020-04-21
CN108428655A (zh) 2018-08-21
KR102035923B1 (ko) 2019-10-23
CN108428655B (zh) 2022-07-22
TW201842615A (zh) 2018-12-01
JP6802726B2 (ja) 2020-12-16
US20180231952A1 (en) 2018-08-16

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