KR102031014B1 - 알칼리 현상형 수지, 그것을 사용한 감광성 수지 조성물 - Google Patents

알칼리 현상형 수지, 그것을 사용한 감광성 수지 조성물 Download PDF

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KR102031014B1
KR102031014B1 KR1020157000694A KR20157000694A KR102031014B1 KR 102031014 B1 KR102031014 B1 KR 102031014B1 KR 1020157000694 A KR1020157000694 A KR 1020157000694A KR 20157000694 A KR20157000694 A KR 20157000694A KR 102031014 B1 KR102031014 B1 KR 102031014B1
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South Korea
Prior art keywords
resin
alkali
hydroxyl group
phenol
resin composition
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KR1020157000694A
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English (en)
Korean (ko)
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KR20150036042A (ko
Inventor
카즈요시 야마모토
켄지 세키네
나오후미 호리구치
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닛뽄 가야쿠 가부시키가이샤
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Publication of KR20150036042A publication Critical patent/KR20150036042A/ko
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
    • C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
    • C08G14/12—Chemically modified polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/28—Chemically modified polycondensates
    • C08G8/32—Chemically modified polycondensates by organic acids or derivatives thereof, e.g. fatty oils
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
    • C08G8/20—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with polyhydric phenols
    • C08G8/22—Resorcinol
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
    • C09D161/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C09D161/04, C09D161/18 and C09D161/20
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020157000694A 2012-07-13 2013-07-03 알칼리 현상형 수지, 그것을 사용한 감광성 수지 조성물 KR102031014B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2012-157142 2012-07-13
JP2012157142 2012-07-13
JPJP-P-2012-223382 2012-10-05
JP2012223382 2012-10-05
PCT/JP2013/004123 WO2014010204A1 (ja) 2012-07-13 2013-07-03 アルカリ現像型樹脂、それを用いた感光性樹脂組成物

Publications (2)

Publication Number Publication Date
KR20150036042A KR20150036042A (ko) 2015-04-07
KR102031014B1 true KR102031014B1 (ko) 2019-10-11

Family

ID=49915688

Family Applications (1)

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KR1020157000694A KR102031014B1 (ko) 2012-07-13 2013-07-03 알칼리 현상형 수지, 그것을 사용한 감광성 수지 조성물

Country Status (5)

Country Link
JP (1) JP6111248B2 (zh)
KR (1) KR102031014B1 (zh)
CN (1) CN104470962B (zh)
TW (1) TWI535775B (zh)
WO (1) WO2014010204A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6761224B2 (ja) * 2014-02-19 2020-09-23 味の素株式会社 プリント配線板、半導体装置及び樹脂シートセット
WO2016006264A1 (ja) * 2014-07-10 2016-01-14 太陽インキ製造株式会社 樹脂絶縁層の形成方法、樹脂絶縁層およびプリント配線板
TWI687769B (zh) * 2015-05-12 2020-03-11 日商三菱製紙股份有限公司 噴砂用感光性樹脂組成物及噴砂處理方法
JP6907531B2 (ja) * 2015-12-28 2021-07-21 荒川化学工業株式会社 印刷インキ用変性フェノール樹脂、活性エネルギー線硬化型樹脂組成物、ゲルワニス、硬化物、活性エネルギー線硬化型印刷インキ及び印刷物
TWI609382B (zh) * 2016-07-26 2017-12-21 台灣太陽油墨股份有限公司 介電材料組成物及含其之絕緣膜及電路板
JP7093406B2 (ja) 2018-08-28 2022-06-29 住友ベークライト株式会社 半導体装置
CN110753455A (zh) * 2019-10-23 2020-02-04 深南电路股份有限公司 一种抗镀干膜加工方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002128866A (ja) 2000-10-20 2002-05-09 Toshiba Chem Corp 導電性ペースト
JP2002138126A (ja) 2000-10-31 2002-05-14 Inoac Corp 弾性部材
WO2011122027A1 (ja) 2010-03-31 2011-10-06 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物

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Publication number Priority date Publication date Assignee Title
JPS6454390A (en) 1987-08-26 1989-03-01 Matsushita Electric Ind Co Ltd Driver using shape memory alloy
JP3190251B2 (ja) 1995-06-06 2001-07-23 太陽インキ製造株式会社 アルカリ現像型のフレキシブルプリント配線板用光硬化性・熱硬化性樹脂組成物
JP3659825B2 (ja) 1997-12-19 2005-06-15 太陽インキ製造株式会社 アルカリ現像可能な光硬化性・熱硬化性組成物及びそれから得られる硬化皮膜
JP3468291B2 (ja) * 2000-04-10 2003-11-17 荒川化学工業株式会社 アルコキシ基含有シラン変性フェノール樹脂、樹脂組成物、エポキシ樹脂硬化剤及び有機・無機ハイブリッド体。
JP3964326B2 (ja) 2000-09-20 2007-08-22 太陽インキ製造株式会社 カルボキシル基含有感光性樹脂、それを含有するアルカリ現像可能な光硬化性・熱硬化性組成物及びその硬化物
JP2002128865A (ja) * 2000-10-31 2002-05-09 Showa Highpolymer Co Ltd 感光性樹脂組成物
JP4889850B2 (ja) * 2000-10-31 2012-03-07 昭和電工株式会社 硬化性樹脂、感光性樹脂組成物及び硬化塗膜の形成方法
AU2003211957A1 (en) * 2002-02-19 2003-09-09 Taiyo Ink Manufacturing Co., Ltd. Curable resin and curable resin composition containing the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002128866A (ja) 2000-10-20 2002-05-09 Toshiba Chem Corp 導電性ペースト
JP2002138126A (ja) 2000-10-31 2002-05-14 Inoac Corp 弾性部材
WO2011122027A1 (ja) 2010-03-31 2011-10-06 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物

Also Published As

Publication number Publication date
TW201420668A (zh) 2014-06-01
TWI535775B (zh) 2016-06-01
WO2014010204A1 (ja) 2014-01-16
KR20150036042A (ko) 2015-04-07
CN104470962B (zh) 2017-09-12
JPWO2014010204A1 (ja) 2016-06-20
JP6111248B2 (ja) 2017-04-05
CN104470962A (zh) 2015-03-25

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