KR102027205B1 - 광점 결함들 및 표면 거칠기를 감소시키기 위한 반도체-온-인슐레이터 웨이퍼 제조 방법 - Google Patents

광점 결함들 및 표면 거칠기를 감소시키기 위한 반도체-온-인슐레이터 웨이퍼 제조 방법 Download PDF

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KR102027205B1
KR102027205B1 KR1020157029121A KR20157029121A KR102027205B1 KR 102027205 B1 KR102027205 B1 KR 102027205B1 KR 1020157029121 A KR1020157029121 A KR 1020157029121A KR 20157029121 A KR20157029121 A KR 20157029121A KR 102027205 B1 KR102027205 B1 KR 102027205B1
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silicon
silicon layer
dielectric layer
smoothing process
environment
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KR20150132383A (ko
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칭민 류
제프리 루이스 리버트
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글로벌웨이퍼스 씨오., 엘티디.
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    • H01L21/3247—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • H10P95/906—Thermal treatments, e.g. annealing or sintering for altering the shape of semiconductors, e.g. smoothing the surface
    • H01L21/302—
    • H01L21/3065—
    • H01L21/3226—
    • H01L21/76254—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P36/00—Gettering within semiconductor bodies
    • H10P36/03—Gettering within semiconductor bodies within silicon bodies
    • H10P36/07—Gettering within semiconductor bodies within silicon bodies of silicon-on-insulator structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/19—Preparing inhomogeneous wafers
    • H10P90/1904—Preparing vertically inhomogeneous wafers
    • H10P90/1906—Preparing SOI wafers
    • H10P90/1914—Preparing SOI wafers using bonding
    • H10P90/1916—Preparing SOI wafers using bonding with separation or delamination along an ion implanted layer, e.g. Smart-cut
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H10W10/181—Semiconductor-on-insulator [SOI] isolation regions, e.g. buried oxide regions of SOI wafers

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Recrystallisation Techniques (AREA)
KR1020157029121A 2013-03-14 2014-03-14 광점 결함들 및 표면 거칠기를 감소시키기 위한 반도체-온-인슐레이터 웨이퍼 제조 방법 Active KR102027205B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361783928P 2013-03-14 2013-03-14
US61/783,928 2013-03-14
PCT/US2014/027418 WO2014152510A1 (en) 2013-03-14 2014-03-14 Semiconductor-on-insulator wafer manufacturing method for reducing light point defects and surface roughness

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KR20150132383A KR20150132383A (ko) 2015-11-25
KR102027205B1 true KR102027205B1 (ko) 2019-10-01

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US (1) US9202711B2 (https=)
JP (1) JP6373354B2 (https=)
KR (1) KR102027205B1 (https=)
CN (1) CN105431936B (https=)
DE (1) DE112014001279B4 (https=)
TW (1) TWI598961B (https=)
WO (1) WO2014152510A1 (https=)

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US10468294B2 (en) 2016-02-19 2019-11-05 Globalwafers Co., Ltd. High resistivity silicon-on-insulator substrate comprising a charge trapping layer formed on a substrate with a rough surface
EP3758050A1 (en) 2016-03-07 2020-12-30 GlobalWafers Co., Ltd. Semiconductor on insulator structure comprising a low temperature flowable oxide layer and method of manufacture thereof
WO2017155804A1 (en) 2016-03-07 2017-09-14 Sunedison Semiconductor Limited Method of manufacturing a semiconductor on insulator structure by a pressurized bond treatment
US11114332B2 (en) 2016-03-07 2021-09-07 Globalwafers Co., Ltd. Semiconductor on insulator structure comprising a plasma nitride layer and method of manufacture thereof
WO2017155806A1 (en) 2016-03-07 2017-09-14 Sunedison Semiconductor Limited Semiconductor on insulator structure comprising a plasma oxide layer and method of manufacture thereof
CN111201341B (zh) 2016-06-08 2023-04-04 环球晶圆股份有限公司 具有经改进的机械强度的高电阻率单晶硅锭及晶片
US10269617B2 (en) 2016-06-22 2019-04-23 Globalwafers Co., Ltd. High resistivity silicon-on-insulator substrate comprising an isolation region
EP4723861A2 (en) 2016-10-26 2026-04-08 GlobalWafers Co., Ltd. High resistivity silicon-on-insulator substrate having enhanced charge trapping efficiency
CN115714130A (zh) 2016-12-05 2023-02-24 环球晶圆股份有限公司 高电阻率绝缘体上硅结构及其制造方法
CN114093764B (zh) 2016-12-28 2025-07-22 太阳能爱迪生半导体有限公司 单晶硅晶片
FR3061988B1 (fr) * 2017-01-13 2019-11-01 Soitec Procede de lissage de surface d'un substrat semiconducteur sur isolant
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WO2019125810A1 (en) 2017-12-21 2019-06-27 Globalwafers Co., Ltd. Method of treating a single crystal silicon ingot to improve the lls ring/core pattern
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Also Published As

Publication number Publication date
KR20150132383A (ko) 2015-11-25
TWI598961B (zh) 2017-09-11
CN105431936A (zh) 2016-03-23
DE112014001279B4 (de) 2019-01-24
JP2016516304A (ja) 2016-06-02
TW201448046A (zh) 2014-12-16
US20140273405A1 (en) 2014-09-18
DE112014001279T5 (de) 2015-11-26
CN105431936B (zh) 2018-07-13
WO2014152510A1 (en) 2014-09-25
JP6373354B2 (ja) 2018-08-15
US9202711B2 (en) 2015-12-01

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