KR102026610B1 - 회로기판을 검사하는 병렬 테스터를 위한 위치설정장치 및 회로기판을 검사하는 병렬 테스터 - Google Patents

회로기판을 검사하는 병렬 테스터를 위한 위치설정장치 및 회로기판을 검사하는 병렬 테스터 Download PDF

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Publication number
KR102026610B1
KR102026610B1 KR1020187005630A KR20187005630A KR102026610B1 KR 102026610 B1 KR102026610 B1 KR 102026610B1 KR 1020187005630 A KR1020187005630 A KR 1020187005630A KR 20187005630 A KR20187005630 A KR 20187005630A KR 102026610 B1 KR102026610 B1 KR 102026610B1
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South Korea
Prior art keywords
circuit board
adapter
inspection
test
parallel tester
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Korean (ko)
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KR20180034582A (ko
Inventor
뤼디거 데멜
토르스텐 카스바움
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엑세라 코포레이션
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2815—Functional tests, e.g. boundary scans, using the normal I/O contacts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020187005630A 2015-08-07 2016-06-17 회로기판을 검사하는 병렬 테스터를 위한 위치설정장치 및 회로기판을 검사하는 병렬 테스터 Active KR102026610B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102015113046.7A DE102015113046A1 (de) 2015-08-07 2015-08-07 Positioniereinrichtung für einen Paralleltester zum Testen von Leiterplatten und Paralleltester zum Testen von Leiterplatten
DE102015113046.7 2015-08-07
PCT/EP2016/063989 WO2017025230A1 (de) 2015-08-07 2016-06-17 Positioniereinrichtung für einen paralleltester zum testen von leiterplatten und paralleltester zum testen von leiterplatten

Publications (2)

Publication Number Publication Date
KR20180034582A KR20180034582A (ko) 2018-04-04
KR102026610B1 true KR102026610B1 (ko) 2019-09-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187005630A Active KR102026610B1 (ko) 2015-08-07 2016-06-17 회로기판을 검사하는 병렬 테스터를 위한 위치설정장치 및 회로기판을 검사하는 병렬 테스터

Country Status (9)

Country Link
US (1) US20180217200A1 (enExample)
EP (1) EP3332261A1 (enExample)
JP (1) JP2018523825A (enExample)
KR (1) KR102026610B1 (enExample)
CN (1) CN107923938B (enExample)
DE (1) DE102015113046A1 (enExample)
HK (1) HK1248820A1 (enExample)
TW (2) TWI631345B (enExample)
WO (1) WO2017025230A1 (enExample)

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DE102017102700A1 (de) * 2017-02-10 2018-09-13 Atg Luther & Maelzer Gmbh Prüfvorrichtung und Verfahren zum Prüfen von Leiterplatten
CN107656517B (zh) * 2017-09-15 2024-05-17 郑州众智科技股份有限公司 控制器自动化检测装置
JP7160051B6 (ja) * 2017-12-28 2022-11-11 日本電産リード株式会社 検査装置及び検査方法
TWI662873B (zh) * 2018-08-09 2019-06-11 揚博科技股份有限公司 噴射驅動型電路板旋轉載具
TWI676031B (zh) * 2018-09-06 2019-11-01 致茂電子股份有限公司 滑移式電子元件測試裝置
CN109188178B (zh) * 2018-10-18 2024-11-22 昆山佰奥智能装备股份有限公司 极性检测机构
TWI827809B (zh) * 2019-04-04 2024-01-01 丹麥商卡普雷斯股份有限公司 測量測試樣本之電性的方法，以及多層測試樣本
CN110082625B (zh) * 2019-05-24 2024-07-12 深圳市鸿圆机械电器设备有限公司 探针自动检测设备及其检测方法
TWI692644B (zh) * 2019-06-18 2020-05-01 旺矽科技股份有限公司 電子元件針測裝置
KR102270760B1 (ko) * 2019-11-29 2021-06-30 에이엠티 주식회사 미세 피치를 갖는 디바이스의 테스트장치
CN111103308A (zh) * 2019-12-24 2020-05-05 瞿勇 一种电路板焊点检测仪摄像用定位装置
US11221360B1 (en) 2020-06-12 2022-01-11 Lat Enterprises, Inc. Multiple circuit board tester
DE102020117586B4 (de) * 2020-07-03 2022-03-24 Deutronic Elektronik Gmbh Vorrichtung zum Prüfen von Bauteilen elektrischer Maschinen, insbesondere Statoren und Rotoren
CN112578265B (zh) * 2020-11-25 2022-03-15 苏州市高威电子有限公司 一种中继测试治具
TW202443168A (zh) * 2020-12-22 2024-11-01 韓商泰克元股份有限公司 電子元件輸送裝置及用於處理電子元件的分類機
TWI759159B (zh) * 2021-03-26 2022-03-21 經登企業股份有限公司 磁性感測器及限位裝置
CN113466659B (zh) * 2021-06-28 2022-05-31 昆山兢美电子科技有限公司 一种印刷电路板检测用飞针测试装置
CN113532316B (zh) * 2021-07-05 2023-01-20 深圳市先地图像科技有限公司 一种能同时检测多块pcb板形位偏差的装置及检测方法
CN113655364B (zh) * 2021-07-06 2024-03-19 合肥宇隆光电科技有限公司 一种接触型pcba开路短路测试装置及其测试方法
CN113866587B (zh) * 2021-08-20 2024-05-24 苏州国科测试科技有限公司 一种飞针测试设备
TWI811770B (zh) * 2021-08-23 2023-08-11 鴻勁精密股份有限公司 輸送機構、測試裝置、檢知方法及其應用之作業機
CN115166570B (zh) * 2022-06-23 2025-05-06 深圳创华智能科技有限公司 自动测试装置
CN115078974A (zh) * 2022-07-23 2022-09-20 隋大明 一种线路板测试平台
KR102770186B1 (ko) * 2022-07-25 2025-02-20 한국서부발전 주식회사 전동식 엑추에이터 고장 진단 테스트 장치
CN115826630B (zh) * 2023-02-20 2023-05-12 中国机械总院集团江苏分院有限公司 物料盒队列位置交换的控制方法和装置
US20250189569A1 (en) * 2023-12-07 2025-06-12 Rohde & Schwarz Gmbh & Co. Kg Positioning apparatus for positioning a device under test
KR102801402B1 (ko) * 2024-01-09 2025-04-29 경남대학교 산학협력단 패널접착 및 기판검사용 프레싱 장치
CN118859024B (zh) * 2024-08-05 2025-01-14 江苏神州半导体科技有限公司 一种射频电源测试装置
CN118818267B (zh) * 2024-09-12 2024-11-19 四川弘智远大科技有限公司 一种基于机械定位的电路板的测试装置
CN119199192B (zh) * 2024-09-14 2025-11-04 四川泛华航空仪表电器有限公司 一种用于机载设备的便携式自动测试适配器及系统

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Also Published As

Publication number Publication date
DE102015113046A1 (de) 2017-02-09
HK1248820A1 (zh) 2018-10-19
TW201835579A (zh) 2018-10-01
TWI631345B (zh) 2018-08-01
US20180217200A1 (en) 2018-08-02
TWI674414B (zh) 2019-10-11
JP2018523825A (ja) 2018-08-23
KR20180034582A (ko) 2018-04-04
CN107923938B (zh) 2021-04-30
WO2017025230A1 (de) 2017-02-16
TW201712346A (zh) 2017-04-01
CN107923938A (zh) 2018-04-17
EP3332261A1 (de) 2018-06-13

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