JP2018523825A - 印刷された回路基板を検査するための並列検査装置用の位置決め装置、及び印刷された回路基板を検査するための並列検査装置 - Google Patents

印刷された回路基板を検査するための並列検査装置用の位置決め装置、及び印刷された回路基板を検査するための並列検査装置 Download PDF

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Publication number
JP2018523825A
JP2018523825A JP2018506102A JP2018506102A JP2018523825A JP 2018523825 A JP2018523825 A JP 2018523825A JP 2018506102 A JP2018506102 A JP 2018506102A JP 2018506102 A JP2018506102 A JP 2018506102A JP 2018523825 A JP2018523825 A JP 2018523825A
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Japan
Prior art keywords
inspection
circuit board
adapter
parallel
inspected
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Pending
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JP2018506102A
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English (en)
Japanese (ja)
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JP2018523825A5 (enExample
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デーメル，リュディガー
カッセバウム，トルステン
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Xcerra Corp
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Xcerra Corp
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Publication of JP2018523825A publication Critical patent/JP2018523825A/ja
Publication of JP2018523825A5 publication Critical patent/JP2018523825A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2815—Functional tests, e.g. boundary scans, using the normal I/O contacts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2018506102A 2015-08-07 2016-06-17 印刷された回路基板を検査するための並列検査装置用の位置決め装置、及び印刷された回路基板を検査するための並列検査装置 Pending JP2018523825A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102015113046.7A DE102015113046A1 (de) 2015-08-07 2015-08-07 Positioniereinrichtung für einen Paralleltester zum Testen von Leiterplatten und Paralleltester zum Testen von Leiterplatten
DE102015113046.7 2015-08-07
PCT/EP2016/063989 WO2017025230A1 (de) 2015-08-07 2016-06-17 Positioniereinrichtung für einen paralleltester zum testen von leiterplatten und paralleltester zum testen von leiterplatten

Publications (2)

Publication Number Publication Date
JP2018523825A true JP2018523825A (ja) 2018-08-23
JP2018523825A5 JP2018523825A5 (enExample) 2019-07-11

Family

ID=56194469

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018506102A Pending JP2018523825A (ja) 2015-08-07 2016-06-17 印刷された回路基板を検査するための並列検査装置用の位置決め装置、及び印刷された回路基板を検査するための並列検査装置

Country Status (9)

Country Link
US (1) US20180217200A1 (enExample)
EP (1) EP3332261A1 (enExample)
JP (1) JP2018523825A (enExample)
KR (1) KR102026610B1 (enExample)
CN (1) CN107923938B (enExample)
DE (1) DE102015113046A1 (enExample)
HK (1) HK1248820A1 (enExample)
TW (2) TWI631345B (enExample)
WO (1) WO2017025230A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240014236A (ko) * 2022-07-25 2024-02-01 한국서부발전 주식회사 전동식 엑추에이터 고장 진단 테스트 장치

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017102700A1 (de) * 2017-02-10 2018-09-13 Atg Luther & Maelzer Gmbh Prüfvorrichtung und Verfahren zum Prüfen von Leiterplatten
CN107656517B (zh) * 2017-09-15 2024-05-17 郑州众智科技股份有限公司 控制器自动化检测装置
JP7160051B6 (ja) * 2017-12-28 2022-11-11 日本電産リード株式会社 検査装置及び検査方法
TWI662873B (zh) * 2018-08-09 2019-06-11 揚博科技股份有限公司 噴射驅動型電路板旋轉載具
TWI676031B (zh) * 2018-09-06 2019-11-01 致茂電子股份有限公司 滑移式電子元件測試裝置
CN109188178B (zh) * 2018-10-18 2024-11-22 昆山佰奥智能装备股份有限公司 极性检测机构
TWI827809B (zh) * 2019-04-04 2024-01-01 丹麥商卡普雷斯股份有限公司 測量測試樣本之電性的方法，以及多層測試樣本
CN110082625B (zh) * 2019-05-24 2024-07-12 深圳市鸿圆机械电器设备有限公司 探针自动检测设备及其检测方法
TWI692644B (zh) * 2019-06-18 2020-05-01 旺矽科技股份有限公司 電子元件針測裝置
KR102270760B1 (ko) * 2019-11-29 2021-06-30 에이엠티 주식회사 미세 피치를 갖는 디바이스의 테스트장치
CN111103308A (zh) * 2019-12-24 2020-05-05 瞿勇 一种电路板焊点检测仪摄像用定位装置
US11221360B1 (en) 2020-06-12 2022-01-11 Lat Enterprises, Inc. Multiple circuit board tester
DE102020117586B4 (de) * 2020-07-03 2022-03-24 Deutronic Elektronik Gmbh Vorrichtung zum Prüfen von Bauteilen elektrischer Maschinen, insbesondere Statoren und Rotoren
CN112578265B (zh) * 2020-11-25 2022-03-15 苏州市高威电子有限公司 一种中继测试治具
TW202443168A (zh) * 2020-12-22 2024-11-01 韓商泰克元股份有限公司 電子元件輸送裝置及用於處理電子元件的分類機
TWI759159B (zh) * 2021-03-26 2022-03-21 經登企業股份有限公司 磁性感測器及限位裝置
CN113466659B (zh) * 2021-06-28 2022-05-31 昆山兢美电子科技有限公司 一种印刷电路板检测用飞针测试装置
CN113532316B (zh) * 2021-07-05 2023-01-20 深圳市先地图像科技有限公司 一种能同时检测多块pcb板形位偏差的装置及检测方法
CN113655364B (zh) * 2021-07-06 2024-03-19 合肥宇隆光电科技有限公司 一种接触型pcba开路短路测试装置及其测试方法
CN113866587B (zh) * 2021-08-20 2024-05-24 苏州国科测试科技有限公司 一种飞针测试设备
TWI811770B (zh) * 2021-08-23 2023-08-11 鴻勁精密股份有限公司 輸送機構、測試裝置、檢知方法及其應用之作業機
CN115166570B (zh) * 2022-06-23 2025-05-06 深圳创华智能科技有限公司 自动测试装置
CN115078974A (zh) * 2022-07-23 2022-09-20 隋大明 一种线路板测试平台
CN115826630B (zh) * 2023-02-20 2023-05-12 中国机械总院集团江苏分院有限公司 物料盒队列位置交换的控制方法和装置
US20250189569A1 (en) * 2023-12-07 2025-06-12 Rohde & Schwarz Gmbh & Co. Kg Positioning apparatus for positioning a device under test
KR102801402B1 (ko) * 2024-01-09 2025-04-29 경남대학교 산학협력단 패널접착 및 기판검사용 프레싱 장치
CN118859024B (zh) * 2024-08-05 2025-01-14 江苏神州半导体科技有限公司 一种射频电源测试装置
CN118818267B (zh) * 2024-09-12 2024-11-19 四川弘智远大科技有限公司 一种基于机械定位的电路板的测试装置
CN119199192B (zh) * 2024-09-14 2025-11-04 四川泛华航空仪表电器有限公司 一种用于机载设备的便携式自动测试适配器及系统

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59120969A (ja) * 1982-12-28 1984-07-12 Fujitsu Ltd 部品テスト用フイクスチユア装置
JPS63299243A (ja) * 1987-05-29 1988-12-06 Tokyo Electron Ltd プロ−ブカ−ドアダプタ
JPS63301537A (ja) * 1987-05-30 1988-12-08 Tokyo Electron Ltd ウエハプロ−バ
JPH03239400A (ja) * 1990-02-16 1991-10-24 Hitachi Ltd プリント基板用自動調整検査装置及び直交型ロボット並びにｃｉｍ
JPH06118115A (ja) * 1992-09-30 1994-04-28 Nitto Seiko Co Ltd 両面基板検査装置
JPH10332764A (ja) * 1997-05-30 1998-12-18 U H T Kk Ｂｇａ、ｃｓｐ等におけるｉｃチップ実装基板の導通検査システム
JP2003090862A (ja) * 2001-09-17 2003-03-28 Murata Mfg Co Ltd ヘッド位置決め装置
JP2004061264A (ja) * 2002-07-29 2004-02-26 Fuji Photo Film Co Ltd インサーキットテスタ及びプリント基板テスト方法
US20100301890A1 (en) * 2009-05-27 2010-12-02 Star Technologies Inc. Probing apparatus with multiaxial stages for testing semiconductor devices

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4463310A (en) * 1980-07-11 1984-07-31 Rca Corporation Apparatus for detecting the presence of components on a printed circuit board
JPS63124969A (ja) 1986-11-14 1988-05-28 Kyoei Sangyo Kk プリント配線板検査機用オフグリツドアダプタ
GB8700754D0 (en) * 1987-01-14 1987-02-18 Int Computers Ltd Test apparatus for printed circuit boards
US5408189A (en) 1990-05-25 1995-04-18 Everett Charles Technologies, Inc. Test fixture alignment system for printed circuit boards
JPH0438480A (ja) 1990-06-03 1992-02-07 Kyoei Sangyo Kk プリント配線板検査機用アダプタ上下タイプ
JPH05196681A (ja) * 1991-06-26 1993-08-06 Digital Equip Corp <Dec> 連続移動する電気回路の相互接続試験方法及び装置
DE9416526U1 (de) 1994-05-20 1995-06-08 Luther & Maelzer Gmbh, 31515 Wunstorf Vorrichtung zum Prüfen von elektrischen Leiterplatten unter Verwendung eines Prüfadapters mit Prüfstiften
DE4438316A1 (de) * 1994-05-20 1995-11-23 Luther & Maelzer Gmbh System und Verfahren zum Prüfen der korrekten Position einer Kontaktinseln und Leiterbahnen aufweisenden Leiterplatte in einer Prüfvorrichtung
DE29616272U1 (de) 1996-09-18 1998-01-29 atg test systems GmbH, 97877 Wertheim Adapter zum Prüfen von elektrischen Leiterplatten
US6154863A (en) 1996-10-28 2000-11-28 Atg Test Systems Gmbh Apparatus and method for testing non-componented printed circuit boards
IT1290345B1 (it) * 1997-02-18 1998-10-22 Circuit Line Spa Metodo e dispositivo per la correzione dell'errore di allineamento fra aghi di test e punti di test nella fase di test elettrico di
JPH1116964A (ja) * 1997-06-27 1999-01-22 Micronics Japan Co Ltd プローバ
JP3313085B2 (ja) * 1998-06-02 2002-08-12 日本電産リード株式会社 基板検査装置及び基板検査装置における基板と検査ヘッドとの相対位置調整方法
EP0962777A3 (en) * 1998-06-02 2002-12-11 Nihon Densan Read Kabushiki Kaisha, (Nidec-Read Corporation) Printed circuit board testing apparatus
DE19949504C1 (de) * 1999-10-14 2001-06-28 Dornier Gmbh Linearführung
DE20005123U1 (de) * 2000-03-20 2001-08-02 atg test systems GmbH & Co. KG Reicholzheim, 97877 Wertheim Vorrichtung zum Prüfen von Leiterplatten
DE10043728C2 (de) * 2000-09-05 2003-12-04 Atg Test Systems Gmbh Verfahren zum Prüfen von Leiterplatten und Verwendung einer Vorrichtung zum Ausführen des Verfahrens
CN2533473Y (zh) * 2002-02-06 2003-01-29 台康资讯股份有限公司 电路板pci介面自动测试机
US7009381B2 (en) * 2002-03-21 2006-03-07 Agilent Technologies, Inc. Adapter method and apparatus for interfacing a tester with a device under test
DE10392404T5 (de) * 2002-03-22 2005-04-14 Electro Scientific Industries, Inc., Portland Messkopfausrichtungsvorrichtung
DE10220343B4 (de) * 2002-05-07 2007-04-05 Atg Test Systems Gmbh & Co. Kg Reicholzheim Vorrichtung und Verfahren zum Prüfen von Leiterplatten und Prüfsonde
CN2548164Y (zh) * 2002-05-21 2003-04-30 华为技术有限公司 印刷电路板通用加载夹具
DE20214629U1 (de) * 2002-09-20 2002-11-21 esmo AG, 83022 Rosenheim Verschiebbare Befestigungsplatte
DE10260238B4 (de) * 2002-12-20 2007-04-05 Atg Test Systems Gmbh & Co.Kg Adapter zum Testen einer oder mehrerer Leiteranordnungen und Verfahren
US6864698B2 (en) * 2003-03-24 2005-03-08 Teradyne, Inc. Hybrid cooling system for automatic test equipment
CN100394190C (zh) * 2003-12-03 2008-06-11 联能科技（深圳）有限公司 可变密度印刷电路板测试装置
US7019549B2 (en) * 2004-04-23 2006-03-28 Intersection Technologies Corporation Apparatus and method for electrical contact testing of substrates
CN1715942A (zh) * 2004-06-30 2006-01-04 华泰电子股份有限公司 电子产品的测试装置及方法
CN2757135Y (zh) * 2004-12-07 2006-02-08 环隆电气股份有限公司 电路板的测试治具
CN101000362A (zh) * 2006-01-10 2007-07-18 英业达股份有限公司 电路板测试台
US7642802B2 (en) * 2006-09-29 2010-01-05 Teradyne, Inc. Method and apparatus for cooling non-native instrument in automatic test equipment
EP2114634A4 (en) * 2007-02-23 2010-11-17 Intest Corp TESTING HEAD MANIPULATOR
TW201008787A (en) * 2008-08-19 2010-03-01 Silverbrook Res Pty Ltd Diagnostic probe assembly for printhead integrated circuitry
CN201419914Y (zh) * 2009-04-02 2010-03-10 鸿富锦精密工业（深圳）有限公司 电路板供给装置及应用其之电路板测试系统
DE102009016181A1 (de) * 2009-04-03 2010-10-14 Atg Luther & Maelzer Gmbh Kontaktierungseinheit für eine Testvorrichtung zum Testen von Leiterplatten
EP2341353A1 (en) * 2010-01-05 2011-07-06 Research In Motion Limited Self-aligning test fixture for printed circuit board
CN201852912U (zh) * 2010-09-03 2011-06-01 界鸿科技股份有限公司 电子元件测试机构
DE102013102564A1 (de) * 2013-03-13 2014-09-18 Dtg International Gmbh Traverseneinheit für eine Prüfvorrichtung für Leiterplatten, sowie Prüfvorrichtung damit
JP6338085B2 (ja) * 2014-03-20 2018-06-06 日本電産リード株式会社 可撓性基板検査装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59120969A (ja) * 1982-12-28 1984-07-12 Fujitsu Ltd 部品テスト用フイクスチユア装置
JPS63299243A (ja) * 1987-05-29 1988-12-06 Tokyo Electron Ltd プロ−ブカ−ドアダプタ
JPS63301537A (ja) * 1987-05-30 1988-12-08 Tokyo Electron Ltd ウエハプロ−バ
JPH03239400A (ja) * 1990-02-16 1991-10-24 Hitachi Ltd プリント基板用自動調整検査装置及び直交型ロボット並びにｃｉｍ
JPH06118115A (ja) * 1992-09-30 1994-04-28 Nitto Seiko Co Ltd 両面基板検査装置
JPH10332764A (ja) * 1997-05-30 1998-12-18 U H T Kk Ｂｇａ、ｃｓｐ等におけるｉｃチップ実装基板の導通検査システム
JP2003090862A (ja) * 2001-09-17 2003-03-28 Murata Mfg Co Ltd ヘッド位置決め装置
JP2004061264A (ja) * 2002-07-29 2004-02-26 Fuji Photo Film Co Ltd インサーキットテスタ及びプリント基板テスト方法
US20100301890A1 (en) * 2009-05-27 2010-12-02 Star Technologies Inc. Probing apparatus with multiaxial stages for testing semiconductor devices

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240014236A (ko) * 2022-07-25 2024-02-01 한국서부발전 주식회사 전동식 엑추에이터 고장 진단 테스트 장치
KR102770186B1 (ko) 2022-07-25 2025-02-20 한국서부발전 주식회사 전동식 엑추에이터 고장 진단 테스트 장치

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Publication number Publication date
DE102015113046A1 (de) 2017-02-09
KR102026610B1 (ko) 2019-09-30
HK1248820A1 (zh) 2018-10-19
TW201835579A (zh) 2018-10-01
TWI631345B (zh) 2018-08-01
US20180217200A1 (en) 2018-08-02
TWI674414B (zh) 2019-10-11
KR20180034582A (ko) 2018-04-04
CN107923938B (zh) 2021-04-30
WO2017025230A1 (de) 2017-02-16
TW201712346A (zh) 2017-04-01
CN107923938A (zh) 2018-04-17
EP3332261A1 (de) 2018-06-13

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