KR101998002B1 - 적층 구조체, 드라이 필름 및 플렉시블 프린트 배선판 - Google Patents

적층 구조체, 드라이 필름 및 플렉시블 프린트 배선판 Download PDF

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Publication number
KR101998002B1
KR101998002B1 KR1020177013163A KR20177013163A KR101998002B1 KR 101998002 B1 KR101998002 B1 KR 101998002B1 KR 1020177013163 A KR1020177013163 A KR 1020177013163A KR 20177013163 A KR20177013163 A KR 20177013163A KR 101998002 B1 KR101998002 B1 KR 101998002B1
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KR
South Korea
Prior art keywords
resin layer
wiring board
resin
printed wiring
flexible printed
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KR1020177013163A
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English (en)
Korean (ko)
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KR20170070187A (ko
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히데카즈 미야베
마코토 하야시
유토 오다기리
나오유키 고이케
Original Assignee
다이요 잉키 세이조 가부시키가이샤
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Publication of KR20170070187A publication Critical patent/KR20170070187A/ko
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Publication of KR101998002B1 publication Critical patent/KR101998002B1/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
KR1020177013163A 2014-10-16 2015-10-16 적층 구조체, 드라이 필름 및 플렉시블 프린트 배선판 KR101998002B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014211634 2014-10-16
JPJP-P-2014-211634 2014-10-16
PCT/JP2015/079291 WO2016060237A1 (ja) 2014-10-16 2015-10-16 積層構造体、ドライフィルムおよびフレキシブルプリント配線板

Publications (2)

Publication Number Publication Date
KR20170070187A KR20170070187A (ko) 2017-06-21
KR101998002B1 true KR101998002B1 (ko) 2019-07-08

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KR1020177013163A KR101998002B1 (ko) 2014-10-16 2015-10-16 적층 구조체, 드라이 필름 및 플렉시블 프린트 배선판

Country Status (5)

Country Link
JP (1) JP6578295B2 (zh)
KR (1) KR101998002B1 (zh)
CN (1) CN106796402B (zh)
TW (1) TWI688475B (zh)
WO (1) WO2016060237A1 (zh)

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KR20170125352A (ko) * 2015-03-06 2017-11-14 도레이 카부시키가이샤 감광성 수지 조성물 및 전자 부품
KR102372882B1 (ko) * 2016-06-29 2022-03-08 코오롱인더스트리 주식회사 드라이 필름 포토레지스트용 감광성 수지 조성물
JP7127635B2 (ja) * 2017-02-21 2022-08-30 日本ゼオン株式会社 感光性樹脂組成物
JP6951132B2 (ja) * 2017-06-20 2021-10-20 太陽インキ製造株式会社 硬化性樹脂組成物、積層構造体、その硬化物および電子部品
CN108693702A (zh) * 2017-03-31 2018-10-23 太阳油墨制造株式会社 固化性树脂组合物、层叠结构体、其固化物和电子部件
JP6869078B2 (ja) * 2017-03-31 2021-05-12 太陽インキ製造株式会社 硬化性樹脂組成物、積層構造体、その硬化物、および電子部品
JP6387444B1 (ja) * 2017-07-10 2018-09-05 太陽インキ製造株式会社 積層構造体、ドライフィルムおよびフレキシブルプリント配線板
KR102450598B1 (ko) * 2017-11-09 2022-10-07 삼성전기주식회사 지지체 부착 인쇄회로기판 및 지지체 부착 인쇄회로기판의 제조방법
JP7104682B2 (ja) * 2018-11-06 2022-07-21 イノックス・アドバンスト・マテリアルズ・カンパニー・リミテッド Ｆｐｉｃフィルム、これを含むフレキシブルプリント回路基板及びその製造方法
EP3723459A1 (en) 2019-04-10 2020-10-14 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with high passive intermodulation (pim) performance
JPWO2022211122A1 (zh) * 2021-03-31 2022-10-06
WO2022211121A1 (ja) * 2021-03-31 2022-10-06 太陽インキ製造株式会社 積層構造体、ドライフィルム、硬化物および電子部品

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JPS62263692A (ja) 1986-05-12 1987-11-16 ニツポン高度紙工業株式会社 耐熱性フレキシブルプリント配線板
JPS63110224A (ja) 1986-10-27 1988-05-14 Dainippon Printing Co Ltd フレキシブルオ−バ−レイフイルム
JP2004140313A (ja) * 2002-08-22 2004-05-13 Jsr Corp 二層積層膜を用いた電極パッド上へのバンプ形成方法
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WO2013171888A1 (ja) * 2012-05-17 2013-11-21 太陽インキ製造株式会社 アルカリ現像型の熱硬化性樹脂組成物、プリント配線板
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WO2014171525A1 (ja) * 2013-04-18 2014-10-23 太陽インキ製造株式会社 積層構造体、フレキシブルプリント配線板及びその製造方法
JP6549848B2 (ja) * 2014-01-17 2019-07-24 太陽インキ製造株式会社 積層構造体
JP6372108B2 (ja) * 2014-03-11 2018-08-15 味の素株式会社 配線板及びその製造方法

Also Published As

Publication number Publication date
WO2016060237A1 (ja) 2016-04-21
CN106796402B (zh) 2020-09-08
KR20170070187A (ko) 2017-06-21
JPWO2016060237A1 (ja) 2017-04-27
JP6578295B2 (ja) 2019-09-18
TW201630732A (zh) 2016-09-01
CN106796402A (zh) 2017-05-31
TWI688475B (zh) 2020-03-21

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