JP6578295B2 - 積層構造体、ドライフィルムおよびフレキシブルプリント配線板 - Google Patents

積層構造体、ドライフィルムおよびフレキシブルプリント配線板 Download PDF

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Publication number
JP6578295B2
JP6578295B2 JP2016554131A JP2016554131A JP6578295B2 JP 6578295 B2 JP6578295 B2 JP 6578295B2 JP 2016554131 A JP2016554131 A JP 2016554131A JP 2016554131 A JP2016554131 A JP 2016554131A JP 6578295 B2 JP6578295 B2 JP 6578295B2
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Japan
Prior art keywords
laminated structure
resin layer
resin
wiring board
printed wiring
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JP2016554131A
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English (en)
Japanese (ja)
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JPWO2016060237A1 (ja
Inventor
宮部　英和
英和 宮部
亮 林
亮 林
悠斗 小田桐
悠斗 小田桐
直之 小池
直之 小池
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Ink Manufacturing Co Ltd
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Taiyo Ink Manufacturing Co Ltd
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
JP2016554131A 2014-10-16 2015-10-16 積層構造体、ドライフィルムおよびフレキシブルプリント配線板 Active JP6578295B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014211634 2014-10-16
JP2014211634 2014-10-16
PCT/JP2015/079291 WO2016060237A1 (ja) 2014-10-16 2015-10-16 積層構造体、ドライフィルムおよびフレキシブルプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2016060237A1 JPWO2016060237A1 (ja) 2017-04-27
JP6578295B2 true JP6578295B2 (ja) 2019-09-18

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JP2016554131A Active JP6578295B2 (ja) 2014-10-16 2015-10-16 積層構造体、ドライフィルムおよびフレキシブルプリント配線板

Country Status (5)

Country Link
JP (1) JP6578295B2 (zh)
KR (1) KR101998002B1 (zh)
CN (1) CN106796402B (zh)
TW (1) TWI688475B (zh)
WO (1) WO2016060237A1 (zh)

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* Cited by examiner, † Cited by third party
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CN107407876A (zh) * 2015-03-06 2017-11-28 东丽株式会社 感光性树脂组合物及电子部件
KR102372882B1 (ko) * 2016-06-29 2022-03-08 코오롱인더스트리 주식회사 드라이 필름 포토레지스트용 감광성 수지 조성물
JP7127635B2 (ja) * 2017-02-21 2022-08-30 日本ゼオン株式会社 感光性樹脂組成物
CN108693702A (zh) * 2017-03-31 2018-10-23 太阳油墨制造株式会社 固化性树脂组合物、层叠结构体、其固化物和电子部件
JP6869078B2 (ja) * 2017-03-31 2021-05-12 太陽インキ製造株式会社 硬化性樹脂組成物、積層構造体、その硬化物、および電子部品
JP6951132B2 (ja) * 2017-06-20 2021-10-20 太陽インキ製造株式会社 硬化性樹脂組成物、積層構造体、その硬化物および電子部品
JP6387444B1 (ja) * 2017-07-10 2018-09-05 太陽インキ製造株式会社 積層構造体、ドライフィルムおよびフレキシブルプリント配線板
KR102450598B1 (ko) * 2017-11-09 2022-10-07 삼성전기주식회사 지지체 부착 인쇄회로기판 및 지지체 부착 인쇄회로기판의 제조방법
JP7104682B2 (ja) * 2018-11-06 2022-07-21 イノックス・アドバンスト・マテリアルズ・カンパニー・リミテッド Ｆｐｉｃフィルム、これを含むフレキシブルプリント回路基板及びその製造方法
EP3723459A1 (en) 2019-04-10 2020-10-14 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with high passive intermodulation (pim) performance
KR20230165789A (ko) * 2021-03-31 2023-12-05 다이요 잉키 세이조 가부시키가이샤 적층 구조체, 드라이 필름, 경화물 및 전자 부품
CN117120930A (zh) * 2021-03-31 2023-11-24 太阳油墨制造株式会社 层叠结构体、干膜、固化物和电子部件

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JPS62263692A (ja) 1986-05-12 1987-11-16 ニツポン高度紙工業株式会社 耐熱性フレキシブルプリント配線板
JPS63110224A (ja) 1986-10-27 1988-05-14 Dainippon Printing Co Ltd フレキシブルオ−バ−レイフイルム
JP2004140313A (ja) * 2002-08-22 2004-05-13 Jsr Corp 二層積層膜を用いた電極パッド上へのバンプ形成方法
JP4163929B2 (ja) * 2002-10-24 2008-10-08 株式会社カネカ 接着剤層を有する感光性ドライフィルムレジストおよびその製造方法
JP2007310201A (ja) * 2006-05-19 2007-11-29 Kaneka Corp 感光性ドライフィルムレジスト及びこれを用いたプリント配線板
JP2009048170A (ja) * 2007-07-24 2009-03-05 Kaneka Corp 感光性ドライフィルムレジスト、これを用いたプリント配線板、及び、プリント配線板の製造方法
CN101464632A (zh) * 2007-12-21 2009-06-24 太阳油墨制造株式会社 光固化性热固化性树脂组合物和干膜以及使用这些的印刷线路板
JP2010032743A (ja) * 2008-07-29 2010-02-12 Kyocera Chemical Corp アルカリ現像型の感光性熱硬化型樹脂組成物及びフレキシブルプリント配線板
JP2010204174A (ja) * 2009-02-27 2010-09-16 Fujifilm Corp 感光性積層体及び感光性フィルム、並びに、プリント基板の製造方法
JP2010238704A (ja) * 2009-03-30 2010-10-21 Sanyo Chem Ind Ltd プリント配線板用層間絶縁樹脂フィルム
KR101604557B1 (ko) * 2011-06-17 2016-03-17 다이요 잉키 세이조 가부시키가이샤 광경화성 열경화성 수지 조성물
CN103797418B (zh) * 2011-06-24 2017-06-13 东京应化工业株式会社 一种负型感光性树脂组合物、图案形成方法、固化膜、绝缘膜、滤色器及显示装置
CN104010815B (zh) * 2011-12-22 2016-08-17 太阳油墨制造株式会社 干膜及使用其的印刷电路板、印刷电路板的制造方法、以及倒装芯片安装基板
CN103998986B (zh) * 2011-12-27 2016-05-25 太阳油墨制造株式会社 干膜、层叠结构体、印刷电路板以及层叠结构体的制造方法
WO2013171888A1 (ja) * 2012-05-17 2013-11-21 太陽インキ製造株式会社 アルカリ現像型の熱硬化性樹脂組成物、プリント配線板
CN107422604A (zh) * 2012-06-29 2017-12-01 太阳油墨（苏州）有限公司 碱显影型感光性树脂组合物、干膜、固化物以及印刷电路板
KR102229343B1 (ko) * 2013-04-18 2021-03-19 다이요 잉키 세이조 가부시키가이샤 적층 구조체, 플렉시블 프린트 배선판 및 그의 제조 방법
JP6549848B2 (ja) * 2014-01-17 2019-07-24 太陽インキ製造株式会社 積層構造体
JP6372108B2 (ja) * 2014-03-11 2018-08-15 味の素株式会社 配線板及びその製造方法

Also Published As

Publication number Publication date
CN106796402A (zh) 2017-05-31
CN106796402B (zh) 2020-09-08
KR101998002B1 (ko) 2019-07-08
KR20170070187A (ko) 2017-06-21
TW201630732A (zh) 2016-09-01
WO2016060237A1 (ja) 2016-04-21
JPWO2016060237A1 (ja) 2017-04-27
TWI688475B (zh) 2020-03-21

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