KR101983010B1 - 변환기용 경화성 유기폴리실록산 조성물 및 그러한 변환기용 경화성 실리콘 조성물의 응용 - Google Patents

변환기용 경화성 유기폴리실록산 조성물 및 그러한 변환기용 경화성 실리콘 조성물의 응용 Download PDF

Info

Publication number
KR101983010B1
KR101983010B1 KR1020157020308A KR20157020308A KR101983010B1 KR 101983010 B1 KR101983010 B1 KR 101983010B1 KR 1020157020308 A KR1020157020308 A KR 1020157020308A KR 20157020308 A KR20157020308 A KR 20157020308A KR 101983010 B1 KR101983010 B1 KR 101983010B1
Authority
KR
South Korea
Prior art keywords
component
groups
dielectric
composition
curable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020157020308A
Other languages
English (en)
Korean (ko)
Other versions
KR20150103134A (ko
Inventor
도요히코 후지사와
히로시 후쿠이
하루히코 후루카와
피터 체셔 후프피펠드
김홍섭
에이지 키타우라
켄트 알. 라슨
와타루 니시우미
다쿠야 오가와
마사유키 오니시
고우이치 오자키
게이지 와키타
Original Assignee
다우 코닝 도레이 캄파니 리미티드
다우 실리콘즈 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다우 코닝 도레이 캄파니 리미티드, 다우 실리콘즈 코포레이션 filed Critical 다우 코닝 도레이 캄파니 리미티드
Publication of KR20150103134A publication Critical patent/KR20150103134A/ko
Application granted granted Critical
Publication of KR101983010B1 publication Critical patent/KR101983010B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/10—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances metallic oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/098—Forming organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/857—Macromolecular compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2265—Oxides; Hydroxides of metals of iron
    • C08K2003/2275—Ferroso-ferric oxide (Fe3O4)
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/02—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020157020308A 2012-12-28 2013-12-26 변환기용 경화성 유기폴리실록산 조성물 및 그러한 변환기용 경화성 실리콘 조성물의 응용 Active KR101983010B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201261746598P 2012-12-28 2012-12-28
US201261746596P 2012-12-28 2012-12-28
US201261746597P 2012-12-28 2012-12-28
US61/746,598 2012-12-28
US61/746,597 2012-12-28
US61/746,596 2012-12-28
PCT/US2013/077830 WO2014105965A1 (en) 2012-12-28 2013-12-26 Curable organopolysiloxane composition for transducers and applications of such curable silicone composition for transducers

Publications (2)

Publication Number Publication Date
KR20150103134A KR20150103134A (ko) 2015-09-09
KR101983010B1 true KR101983010B1 (ko) 2019-09-10

Family

ID=49956507

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157020308A Active KR101983010B1 (ko) 2012-12-28 2013-12-26 변환기용 경화성 유기폴리실록산 조성물 및 그러한 변환기용 경화성 실리콘 조성물의 응용

Country Status (6)

Country Link
US (1) US9947858B2 (https=)
JP (1) JP6415451B2 (https=)
KR (1) KR101983010B1 (https=)
CN (1) CN104981510B (https=)
TW (1) TWI616477B (https=)
WO (1) WO2014105965A1 (https=)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014105959A1 (en) 2012-12-28 2014-07-03 Dow Corning Corporation Curable organopolysiloxane composition for transducers and applications of such curable silicone composition for transducers
WO2015056374A1 (ja) * 2013-10-17 2015-04-23 信越化学工業株式会社 シリコーンゲル組成物及びシリコーンゲル硬化物
JP6249852B2 (ja) * 2014-03-27 2017-12-20 住友理工株式会社 誘電膜の製造方法
JP6149831B2 (ja) * 2014-09-04 2017-06-21 信越化学工業株式会社 シリコーン組成物
JP6870200B2 (ja) * 2014-11-13 2021-05-12 株式会社リコー 素子、及び発電装置
JP6699119B2 (ja) * 2015-01-22 2020-05-27 株式会社リコー 素子及び発電装置
KR20180015682A (ko) * 2015-06-03 2018-02-13 코닌클리케 필립스 엔.브이. 작동 디바이스
JP6524901B2 (ja) * 2015-12-08 2019-06-05 信越化学工業株式会社 シリコーンゴム組成物及びその硬化物
JP6573994B2 (ja) * 2016-01-28 2019-09-11 富士フイルム株式会社 音響波プローブ用組成物、これを用いた音響波プローブ用シリコーン樹脂、音響波プローブおよび超音波プローブ、ならびに、音響波測定装置、超音波診断装置、光音響波測定装置および超音波内視鏡
DE102016201363A1 (de) * 2016-01-29 2017-08-03 Wacker Chemie Ag Zu Silikongel vernetzbare Siliconzusammensetzung
JP6626959B2 (ja) * 2016-03-25 2019-12-25 富士フイルム株式会社 音響波プローブ用組成物、これを用いた音響波プローブ用シリコーン樹脂、音響波プローブおよび超音波プローブ、ならびに、音響波測定装置、超音波診断装置、光音響波測定装置および超音波内視鏡
WO2018003511A1 (en) * 2016-06-29 2018-01-04 Dow Corning Toray Co., Ltd. Silicone rubber composition and composite made therefrom
WO2018035669A1 (en) * 2016-08-22 2018-03-01 Goertek. Inc Capacitive mems microphone and electronic apparatus
CN106412780B (zh) * 2016-09-05 2020-06-05 南昌欧菲生物识别技术有限公司 超声波探头及其制造方法
GB201617171D0 (en) * 2016-10-10 2016-11-23 Universitetet I Troms� - Norges Arktiske Universitet Piezoelectric films
KR102318181B1 (ko) * 2017-02-08 2021-10-27 엘켐 실리콘즈 유에스에이 코포레이션 열 관리가 개선된 이차 배터리 팩
JP6702233B2 (ja) * 2017-03-09 2020-05-27 信越化学工業株式会社 付加硬化型オルガノポリシロキサン樹脂組成物、該組成物の硬化物及び該硬化物を有する半導体装置
JP2018158977A (ja) * 2017-03-22 2018-10-11 堺化学工業株式会社 複合体粒子、樹脂組成物、誘電エラストマー及びトランスデューサー
US11535017B2 (en) 2017-04-04 2022-12-27 W. L. Gore & Associates Gmbh Dielectric composite with reinforced elastomer and integrate electrode
JP7210433B2 (ja) * 2017-04-18 2023-01-23 信越化学工業株式会社 高誘電絶縁性シリコーンゴム組成物及び電界緩和層
CN110832033A (zh) * 2017-07-21 2020-02-21 美国陶氏有机硅公司 可固化有机聚硅氧烷组合物及其固化产物
WO2019079473A1 (en) * 2017-10-19 2019-04-25 Shell Oil Company MINERAL INSULATED ELECTRIC CABLES FOR INTEGRATED COMPRESSORS DRIVEN BY ELECTRIC MOTOR
JP7077128B2 (ja) * 2018-05-10 2022-05-30 ダウ・東レ株式会社 積層体、その製造方法およびその積層体を含むトランスデューサー等
WO2019226958A1 (en) 2018-05-24 2019-11-28 The Research Foundation For The State University Of New York Capacitive sensor
TWI821387B (zh) * 2018-09-07 2023-11-11 日商琳得科股份有限公司 致動器
CN113330073B (zh) * 2018-12-07 2022-12-30 陶氏东丽株式会社 膜形成用固化性聚有机硅氧烷组合物以及聚有机硅氧烷固化物膜的制造方法
WO2020116440A1 (ja) * 2018-12-07 2020-06-11 ダウ・東レ株式会社 硬化性オルガノポリシロキサン組成物、その硬化物および当該硬化物を備えたトランスデューサー等
EP3892688A4 (en) 2018-12-07 2022-08-24 Dow Toray Co., Ltd. CURABLE ORGANOPOLYSILOXANE COMPOSITION FOR MAKING COATINGS AND METHOD FOR MAKING A CURED ORGANOPOLYSILOXANE PRODUCT COATING
CN110010962A (zh) * 2019-01-03 2019-07-12 深圳天元羲王材料科技有限公司 一种石墨烯固态硅胶方向性电解质制备方法
KR102530198B1 (ko) * 2019-01-08 2023-05-09 한국생산기술연구원 복합 유전체층의 제조방법 및 그를 포함하는 전기접착식 그리퍼의 제조방법
US12503598B2 (en) 2019-02-14 2025-12-23 Dow Toray Co., Ltd. Organopolysiloxane cured product film and usage, manufacturing method, and manufacturing apparatus therefor
GB201911133D0 (en) * 2019-08-05 2019-09-18 Qinetiq Ltd Materials and methods
JP7161980B2 (ja) * 2019-08-30 2022-10-27 信越ポリマー株式会社 高分子アクチュエータ用組成物、高分子アクチュエータ部材の製造方法および高分子アクチュエータ
CN110524532B (zh) * 2019-08-31 2020-12-11 三体次元信息科技（宁波）有限公司 电子型人工肌肉电致动器及其制备方法和在手指驱动装置中的应用
JP2021064690A (ja) 2019-10-11 2021-04-22 株式会社リコー 素子および素子の製造方法
JP7761358B2 (ja) * 2019-12-20 2025-10-28 ダウ・東レ株式会社 硬化性エラストマー組成物及びその硬化物、硬化物を備えたフィルム、フィルムを備えた積層体及びその製造方法、硬化物を有する電子部品又は表示装置、硬化性エラストマー組成物の設計方法、並びにトランスデューサーデバイスの設計方法
KR102290115B1 (ko) * 2020-01-22 2021-08-17 한국생산기술연구원 복합 유전체층의 제조방법 및 그를 포함하는 전기접착식 그리퍼의 제조방법
WO2021151510A1 (en) 2020-01-31 2021-08-05 Wacker Chemie Ag Process for curing polyorganyloxysiloxane compositions by radiation
WO2023282270A1 (ja) * 2021-07-05 2023-01-12 ダウ・東レ株式会社 トランスデューサー用オルガノポリシロキサン組成物、その硬化物フィルムからなる積層体、その用途、およびその製造方法
TWI773424B (zh) * 2021-07-08 2022-08-01 碁達科技股份有限公司 熱介面組成物、熱介面材料及其製備方法
CN114573819B (zh) * 2022-03-31 2023-10-17 中国科学院化学研究所 一种高介电低模量的硅橡胶介电弹性体及其制备方法
US20260022275A1 (en) * 2022-09-29 2026-01-22 Dow Toray Co., Ltd. Hot melt type organopolysiloxane composition for forming electrode layer, multilayer body comprising electrode layer, use of same and method for producing same
US20260024679A1 (en) * 2022-09-29 2026-01-22 Dow Toray Co., Ltd. Electrode-layer-forming curable organopolysiloxane composition, laminate equipped with electrode layer, use thereof, and method for producing same
CN119836451A (zh) * 2022-09-29 2025-04-15 陶氏东丽株式会社 电极层形成性固化性有机聚硅氧烷组合物、具备电极层的层叠体、其用途以及其制造方法
WO2025104868A1 (ja) * 2023-11-16 2025-05-22 株式会社タイカ シリコーン樹脂組成物およびその硬化物

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010018719A (ja) 2008-07-11 2010-01-28 Adeka Corp ケイ素含有硬化性組成物
US20100255319A1 (en) 2008-10-16 2010-10-07 Paul Sankar K Organosilicon copolymer composites, method of manufacture, and articles formed therefrom
US20110186792A1 (en) 2010-02-01 2011-08-04 Nitto Denko Corporation Silicone resin composition
WO2011125753A1 (ja) * 2010-04-02 2011-10-13 株式会社カネカ 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ、半導体部品及び発光ダイオード

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4032502A (en) 1975-10-10 1977-06-28 Dow Corning Corporation Organosiloxane compositions for liquid injection
US4663414A (en) 1985-05-14 1987-05-05 Stauffer Chemical Company Phospho-boro-silanol interlayer dielectric films and preparation
JPH0520924A (ja) 1991-07-08 1993-01-29 Olympus Optical Co Ltd 有機誘電体ペーストおよびその製造方法
JPH09268257A (ja) 1996-03-29 1997-10-14 Toray Dow Corning Silicone Co Ltd フルオロシリコーンゴム組成物およびその接着方法
SG118142A1 (en) 2001-07-06 2006-01-27 Toray Industries Resin composition adhesive film for semiconductor device and laminated film with metallic foil and semiconductor device using the same
JP4730724B2 (ja) 2002-09-26 2011-07-20 日立化成工業株式会社 ボラジン系樹脂の製造方法
WO2004030070A1 (ja) 2002-09-26 2004-04-08 Hitachi Chemical Co., Ltd. ボラジン系樹脂及びその製造方法、ボラジン系樹脂組成物、絶縁被膜及びその形成方法、絶縁被膜を備えた電子部品
US20050038188A1 (en) 2003-08-14 2005-02-17 Dongchan Ahn Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance
US7834527B2 (en) 2005-05-05 2010-11-16 SmartMotion Technologies, Inc. Dielectric elastomer fiber transducers
US20070295390A1 (en) * 2006-05-05 2007-12-27 Nanosolar, Inc. Individually encapsulated solar cells and solar cell strings having a substantially inorganic protective layer
JP5278038B2 (ja) 2008-02-26 2013-09-04 日本精工株式会社 エラストマートランスデューサー
JP5469874B2 (ja) 2008-09-05 2014-04-16 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物、光半導体素子封止剤および光半導体装置
JP5374984B2 (ja) 2008-09-12 2013-12-25 豊田合成株式会社 誘電アクチュエータ
JP4835880B2 (ja) 2009-03-12 2011-12-14 信越化学工業株式会社 液状硬化性フロロシリコーン組成物の製造方法
JP5170471B2 (ja) 2010-09-02 2013-03-27 信越化学工業株式会社 低ガス透過性シリコーン樹脂組成物及び光半導体装置
WO2012032437A1 (en) 2010-09-09 2012-03-15 Koninklijke Philips Electronics N.V. Electroactive polymer actuator
WO2014105959A1 (en) 2012-12-28 2014-07-03 Dow Corning Corporation Curable organopolysiloxane composition for transducers and applications of such curable silicone composition for transducers

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010018719A (ja) 2008-07-11 2010-01-28 Adeka Corp ケイ素含有硬化性組成物
US20100255319A1 (en) 2008-10-16 2010-10-07 Paul Sankar K Organosilicon copolymer composites, method of manufacture, and articles formed therefrom
US20110186792A1 (en) 2010-02-01 2011-08-04 Nitto Denko Corporation Silicone resin composition
WO2011125753A1 (ja) * 2010-04-02 2011-10-13 株式会社カネカ 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ、半導体部品及び発光ダイオード

Also Published As

Publication number Publication date
KR20150103134A (ko) 2015-09-09
CN104981510B (zh) 2017-12-15
TW201430027A (zh) 2014-08-01
TWI616477B (zh) 2018-03-01
CN104981510A (zh) 2015-10-14
US9947858B2 (en) 2018-04-17
WO2014105965A1 (en) 2014-07-03
US20150380636A1 (en) 2015-12-31
JP6415451B2 (ja) 2018-10-31
JP2016505693A (ja) 2016-02-25

Similar Documents

Publication Publication Date Title
KR101983010B1 (ko) 변환기용 경화성 유기폴리실록산 조성물 및 그러한 변환기용 경화성 실리콘 조성물의 응용
KR101868780B1 (ko) 변환기용 경화성 유기폴리실록산 조성물 및 그러한 변환기용 경화성 실리콘 조성물의 응용
WO2014105970A1 (en) Transducers and production method thereof
KR102561358B1 (ko) 플루오로알킬기 함유 경화성 오가노폴리실록산 조성물, 이의 경화물 및 당해 경화물을 구비한 트랜스듀서 등
WO2015098072A1 (en) Curable organopolysiloxane composition, member for transducers
WO2014105979A1 (en) Production method of curable organopolysiloxane composition for transducers
WO2014105974A1 (en) Curable organopolysiloxane composition for transducers and applications of such curable silicone composition for transducers
JP7534060B2 (ja) 硬化性オルガノポリシロキサン組成物、その硬化物および当該硬化物を備えたトランスデューサー等
WO2014105963A2 (en) Curable organopolysiloxane composition for transducers and applications of such curable silicone composition for transducers
KR20220119083A (ko) 경화성 엘라스토머 조성물 및 그의 경화물, 경화물을 구비한 필름, 필름을 구비한 적층체 및 그의 제조 방법, 경화물을 갖는 전자 부품 또는 표시 장치, 경화성 엘라스토머 조성물의 설계 방법, 및 트랜스듀서 디바이스의 설계 방법
WO2014105955A1 (en) Curable organopolysiloxane composition for transducers and applications of such curable silicone composition for transducers
TWI914297B (zh) 固化性有機聚矽氧烷組成物、其固化物以及具備該固化物之換能器等
KR20250081900A (ko) 트랜스듀서용 경화성 오가노폴리실록산 조성물, 그의 경화물 및 당해 경화물을 구비한 트랜스듀서 등

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 7

R18 Changes to party contact information recorded

Free format text: ST27 STATUS EVENT CODE: A-5-5-R10-R18-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000