KR101980559B1 - 감광성 도전 페이스트 및 도전성 배선 부착 기판의 제조방법 - Google Patents

감광성 도전 페이스트 및 도전성 배선 부착 기판의 제조방법 Download PDF

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Publication number
KR101980559B1
KR101980559B1 KR1020147018565A KR20147018565A KR101980559B1 KR 101980559 B1 KR101980559 B1 KR 101980559B1 KR 1020147018565 A KR1020147018565 A KR 1020147018565A KR 20147018565 A KR20147018565 A KR 20147018565A KR 101980559 B1 KR101980559 B1 KR 101980559B1
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KR
South Korea
Prior art keywords
substrate
photosensitive
electrode
conductive paste
titanium oxide
Prior art date
Application number
KR1020147018565A
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English (en)
Korean (ko)
Other versions
KR20150002577A (ko
Inventor
타이키 하시모토
아키히코 타나카
타카노부 오모리
Original Assignee
도레이 카부시키가이샤
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Application filed by 도레이 카부시키가이샤 filed Critical 도레이 카부시키가이샤
Publication of KR20150002577A publication Critical patent/KR20150002577A/ko
Application granted granted Critical
Publication of KR101980559B1 publication Critical patent/KR101980559B1/ko

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Conductive Materials (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Electric Cables (AREA)
KR1020147018565A 2012-03-28 2013-03-13 감광성 도전 페이스트 및 도전성 배선 부착 기판의 제조방법 KR101980559B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012073339 2012-03-28
JPJP-P-2012-073339 2012-03-28
PCT/JP2013/056918 WO2013146239A1 (ja) 2012-03-28 2013-03-13 感光性導電ペーストおよび導電性配線付き基板の製造方法

Publications (2)

Publication Number Publication Date
KR20150002577A KR20150002577A (ko) 2015-01-07
KR101980559B1 true KR101980559B1 (ko) 2019-05-21

Family

ID=49259507

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147018565A KR101980559B1 (ko) 2012-03-28 2013-03-13 감광성 도전 페이스트 및 도전성 배선 부착 기판의 제조방법

Country Status (5)

Country Link
JP (1) JP5418727B1 (ja)
KR (1) KR101980559B1 (ja)
CN (1) CN104185875B (ja)
TW (1) TWI559830B (ja)
WO (1) WO2013146239A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10795469B2 (en) 2013-10-16 2020-10-06 Hitachi Chemical Company, Ltd. Laminate containing conductive fiber, photosensitive conductive film, method for producing conductive pattern, conductive pattern substrate, and touch panel
JP2015193709A (ja) * 2014-03-31 2015-11-05 太陽インキ製造株式会社 導電性樹脂組成物及び導電回路
JP7187832B2 (ja) * 2017-12-15 2022-12-13 住友金属鉱山株式会社 厚膜導体形成用粉末組成物および厚膜導体形成用ペースト
JP6814237B2 (ja) * 2018-03-23 2021-01-13 株式会社ノリタケカンパニーリミテド 感光性組成物とその利用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001089671A (ja) 1999-09-22 2001-04-03 Nippon Synthetic Chem Ind Co Ltd:The 焼成用樹脂組成物、焼成用感光性樹脂組成物及びセラミックパターン形成方法
JP2004111187A (ja) 2002-09-18 2004-04-08 Toray Ind Inc プラズマディスプレイの製造方法
JP2006216269A (ja) 2005-02-01 2006-08-17 Seiko Epson Corp 導電性組成物、パターン形成方法及び電気光学装置
JP2009086280A (ja) 2007-09-28 2009-04-23 Taiyo Ink Mfg Ltd 感光性銀ペースト、電極パターンの製造方法、電極パターンおよびプラズマディスプレイパネル
JP2011204514A (ja) 2010-03-26 2011-10-13 Toray Ind Inc 感光性導電ペーストおよび導電性配線付き基板の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW548683B (en) * 2001-10-23 2003-08-21 Toray Industries Dielectric paste and manufacturing method of plasma display
JP4369103B2 (ja) 2002-09-30 2009-11-18 太陽インキ製造株式会社 感光性導電ペースト及びそれを用いて電極形成したプラズマディスプレイパネル
JP4071171B2 (ja) * 2003-08-21 2008-04-02 太陽インキ製造株式会社 感光性導電組成物およびプラズマディスプレイパネル
TW200712775A (en) * 2005-08-26 2007-04-01 Sumitomo Chemical Co Photosensitive paste
KR20080020553A (ko) * 2006-08-31 2008-03-05 도레이 가부시끼가이샤 플라즈마 디스플레이용 부재 및 플라즈마 디스플레이용부재의 제조 방법
CN101752162B (zh) 2008-11-27 2012-07-04 太阳控股株式会社 感光性导电糊剂及使用其形成的电极和等离子体显示板
CN101436441B (zh) * 2008-12-09 2011-06-15 彩虹集团公司 一种厚膜纳米金电极浆料及其制备方法
CN102379011B (zh) * 2009-03-31 2012-12-05 东丽株式会社 感光性导电糊料和使用其的显示器的制造方法、以及显示器
CN102054882B (zh) * 2009-10-29 2012-07-18 上海宝银电子材料有限公司 晶体硅太阳能电池用正面栅极导电银浆及其制备方法
JP4970530B2 (ja) * 2009-12-28 2012-07-11 株式会社ノリタケカンパニーリミテド 太陽電池用ペースト組成物およびその製造方法ならびに太陽電池

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001089671A (ja) 1999-09-22 2001-04-03 Nippon Synthetic Chem Ind Co Ltd:The 焼成用樹脂組成物、焼成用感光性樹脂組成物及びセラミックパターン形成方法
JP2004111187A (ja) 2002-09-18 2004-04-08 Toray Ind Inc プラズマディスプレイの製造方法
JP2006216269A (ja) 2005-02-01 2006-08-17 Seiko Epson Corp 導電性組成物、パターン形成方法及び電気光学装置
JP2009086280A (ja) 2007-09-28 2009-04-23 Taiyo Ink Mfg Ltd 感光性銀ペースト、電極パターンの製造方法、電極パターンおよびプラズマディスプレイパネル
JP2011204514A (ja) 2010-03-26 2011-10-13 Toray Ind Inc 感光性導電ペーストおよび導電性配線付き基板の製造方法

Also Published As

Publication number Publication date
JPWO2013146239A1 (ja) 2015-12-10
CN104185875B (zh) 2017-07-18
CN104185875A (zh) 2014-12-03
TW201352100A (zh) 2013-12-16
JP5418727B1 (ja) 2014-02-19
TWI559830B (zh) 2016-11-21
WO2013146239A1 (ja) 2013-10-03
KR20150002577A (ko) 2015-01-07

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