TW200712775A - Photosensitive paste - Google Patents

Photosensitive paste

Info

Publication number
TW200712775A
TW200712775A TW095130755A TW95130755A TW200712775A TW 200712775 A TW200712775 A TW 200712775A TW 095130755 A TW095130755 A TW 095130755A TW 95130755 A TW95130755 A TW 95130755A TW 200712775 A TW200712775 A TW 200712775A
Authority
TW
Taiwan
Prior art keywords
group
carbon atoms
formula
compound
valent organic
Prior art date
Application number
TW095130755A
Other languages
Chinese (zh)
Inventor
Isao Yahagi
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of TW200712775A publication Critical patent/TW200712775A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds

Abstract

This invention provides a photosensitive paste containing the following components (A)~(E): (A) Inorganic particles (B) An alkali soluble resin of the following (a) and/ or (b): (a) A novolac resin obtained by polycondensation of phenol compound of formula (1) and an aldehyde compound of fomula (2); wherein n represents any one of 0, 1 and 2; R1 represents a mono valent organic group having a number of carbon atoms of 1~20, R1 may be the same or different when n is 2; wherein R2 represents a hydrogen atom or mono valent organic group having a number of carbon atoms of 1~20; (b) A resin of the novolac resins (a) of which a part of phenolic hydroxyl group is replaced with an OR3 group (wherein R3 represents a mono valent organic group having a number of carbon atoms of 1~20), (C) An epoxy group- containing silicone compound represented by formula (3), (wherein Q2 and Q3 are a group respectively independently represented by formula (4), and Q1 is selected from the groups represented by formula (5), (wherein T1 represents an alkylene group having a number of carbon atoms of 1~6, an alkylenoxyalkylene group having a number of carbon atoms of 1~6 or a phenylene group, m is 0 or 1, (wherein T2~T7 represent a methyl group or a phenyl group. T8 is selected from an oxygen atom, methylene group, ethenylene group, ethynylene group, phenylene group, naphthalenediyl group, and biphenyldiyl group.) (D) A compound which generates acid upon irradiation with an election ion ray (E) An organic solvent having a refractory index of 1.40~1.80 at 25 DEG C.
TW095130755A 2005-08-26 2006-08-22 Photosensitive paste TW200712775A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005245509 2005-08-26

Publications (1)

Publication Number Publication Date
TW200712775A true TW200712775A (en) 2007-04-01

Family

ID=37778415

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095130755A TW200712775A (en) 2005-08-26 2006-08-22 Photosensitive paste

Country Status (3)

Country Link
KR (1) KR20070024379A (en)
CN (1) CN1920666A (en)
TW (1) TW200712775A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008133312A1 (en) * 2007-04-25 2008-11-06 Asahi Glass Company, Limited Photosensitive composition, partition wall, black matrix, and method for producing color filter
WO2009093706A1 (en) * 2008-01-24 2009-07-30 Asahi Kasei E-Materials Corporation Photosensitive resin laminate
KR101572296B1 (en) * 2008-08-28 2015-11-26 스미또모 가가꾸 가부시키가이샤 Resin composition, gate insulating layer and organic thin film transistor
JP5418727B1 (en) * 2012-03-28 2014-02-19 東レ株式会社 Photosensitive conductive paste and method for manufacturing substrate with conductive wiring
TWI704416B (en) * 2015-08-05 2020-09-11 日商住友化學股份有限公司 Photosensitive resin composition, pattern, partition wall for inkjet, and display device

Also Published As

Publication number Publication date
KR20070024379A (en) 2007-03-02
CN1920666A (en) 2007-02-28

Similar Documents

Publication Publication Date Title
TW200712775A (en) Photosensitive paste
TW200617097A (en) Flame-retardant epoxy resin composition
ATE509053T1 (en) DIMETHYLFORMAMIDE-FREE FORMULATIONS WITH DICYANADIAMIDE AS HARDENING AGENT FOR HEAT-CURING EPOXY RESINS
JP6638170B2 (en) Photosensitive resin composition and cured product thereof
TW200630754A (en) Resist compound and radiation-sensitive composition
IL182838A0 (en) Positive photosensitive insulating resin composition and cured product thereof
MXPA05012793A (en) Silane-modified phenolic resins and applications thereof.
KR970042910A (en) Flexible epoxy adhesive with low bleeding
TW200720328A (en) A phenol novolac resin having low softing point, method for producing the same and an epoxy resin composition using the phenol novolac resin
TWI226900B (en) Curable mixtures of cyanate resins and epoxide compounds
TW200801074A (en) Polyfunctional phenylene ether oligomer, derivative thereof, resin composition containing the same, and use thereof
EP2329320A4 (en) Positive resist composition for immersion exposure and pattern forming method
DE602007001356D1 (en) Positive resist composition and method of structural molding therewith
TW200628975A (en) Photoresist composition, method for forming film pattern using the same, and method for manufacturing thin film transistor array panel using the same
JP2020509105A (en) Antimicrobial polymer coating composition and antimicrobial polymer film
JPWO2018110297A1 (en) Composition
JP6449553B2 (en) Epoxy resin composition
JP2002138096A (en) Phenol compound including phosphorus, manufacturing method therefor, and epoxy resin composition using the same
JP2013067698A (en) New epoxy resin having phosphorus atom, epoxy resin composition and cured product thereof
KR20090028693A (en) Coating system
KR101338852B1 (en) Phosphorus and nitrogen containing epoxy resin
JP2010180400A (en) Novolac resin and thermosetting resin composition
ATE353760T1 (en) PHOTOSENSITIVE LITHOGRAPHIC PRINTING PLATE
Reghunadhan et al. Recycled polyurethane as a second phase in thermoset blends and its effect on thermal degradation kinetics studies
Chino et al. Novel rapid‐cure adhesives for low temperature using thiirane compound