KR101917401B1 - 유리 홀의 고밀도 어레이를 형성하는 방법 - Google Patents

유리 홀의 고밀도 어레이를 형성하는 방법 Download PDF

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Publication number
KR101917401B1
KR101917401B1 KR1020137015860A KR20137015860A KR101917401B1 KR 101917401 B1 KR101917401 B1 KR 101917401B1 KR 1020137015860 A KR1020137015860 A KR 1020137015860A KR 20137015860 A KR20137015860 A KR 20137015860A KR 101917401 B1 KR101917401 B1 KR 101917401B1
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South Korea
Prior art keywords
glass
glass piece
front surface
holes
range
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Expired - Fee Related
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Korean (ko)
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KR20130135873A (ko
Inventor
헤더 데브라 보엑
로버트 씨. 버켓
다니엘 랄프 하베이
알렉산더 믹하이로비츠 스트렐트소브
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코닝 인코포레이티드
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/386—Removing material by boring or cutting by boring of blind holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C03C15/02—Surface treatment of glass, not in the form of fibres or filaments, by etching for making a smooth surface
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1225—Basic optical elements, e.g. light-guiding paths comprising photonic band-gap structures or photonic lattices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/136—Integrated optical circuits characterised by the manufacturing method by etching

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  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Surface Treatment Of Glass (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
KR1020137015860A 2010-11-30 2011-11-30 유리 홀의 고밀도 어레이를 형성하는 방법 Expired - Fee Related KR101917401B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US41815210P 2010-11-30 2010-11-30
US61/418,152 2010-11-30
PCT/US2011/062520 WO2012075072A2 (en) 2010-11-30 2011-11-30 Methods of forming high-density arrays of holes in glass

Publications (2)

Publication Number Publication Date
KR20130135873A KR20130135873A (ko) 2013-12-11
KR101917401B1 true KR101917401B1 (ko) 2018-11-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137015860A Expired - Fee Related KR101917401B1 (ko) 2010-11-30 2011-11-30 유리 홀의 고밀도 어레이를 형성하는 방법

Country Status (7)

Country Link
US (2) US9278886B2 (https=)
EP (1) EP2646384B1 (https=)
JP (1) JP5905899B2 (https=)
KR (1) KR101917401B1 (https=)
CN (2) CN103237771B (https=)
TW (1) TWI599429B (https=)
WO (1) WO2012075072A2 (https=)

Families Citing this family (103)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI547454B (zh) * 2011-05-31 2016-09-01 康寧公司 於玻璃中高速製造微孔洞的方法
US9938186B2 (en) 2012-04-13 2018-04-10 Corning Incorporated Strengthened glass articles having etched features and methods of forming the same
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
WO2014085660A1 (en) 2012-11-29 2014-06-05 Corning Incorporated Sacrificial cover layers for laser drilling substrates and methods thereof
JP6333282B2 (ja) * 2012-11-29 2018-05-30 コーニング インコーポレイテッド レーザー損傷及びエッチングによってガラス物品を製造する方法
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
WO2015018425A1 (de) 2013-08-07 2015-02-12 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum bearbeiten eines plattenartigen werkstückes mit einer transparenten, gläsernen, glasartigen, keramischen und/oder kristallinen lage, trennvorrichtung für ein derartiges werkstück sowie produkt aus einem derartigen werkstück
US9296646B2 (en) 2013-08-29 2016-03-29 Corning Incorporated Methods for forming vias in glass substrates
US10005152B2 (en) * 2013-11-19 2018-06-26 Rofin-Sinar Technologies Llc Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
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US9517963B2 (en) * 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
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US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
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US10288792B2 (en) * 2014-01-29 2019-05-14 Corning Incorporated Laser featured glass for display illumination
JP6262039B2 (ja) 2014-03-17 2018-01-17 株式会社ディスコ 板状物の加工方法
TWI556898B (zh) * 2014-04-29 2016-11-11 Nat Inst Chung Shan Science & Technology A method and system for preparing vertical micro-guide hole on fly black laser on opaque ceramic sheet
CN106470953B (zh) 2014-04-30 2019-03-12 康宁股份有限公司 用于制造穿通玻璃通孔的接合材料的回蚀工艺
JP6301203B2 (ja) * 2014-06-02 2018-03-28 株式会社ディスコ チップの製造方法
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EP3169479B1 (en) 2014-07-14 2019-10-02 Corning Incorporated Method of and system for arresting incident crack propagation in a transparent material
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WO2016010991A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
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US20170103249A1 (en) 2015-10-09 2017-04-13 Corning Incorporated Glass-based substrate with vias and process of forming the same
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US10292275B2 (en) * 2016-04-06 2019-05-14 AGC Inc. Method of manufacturing glass substrate that has through hole, method of forming through hole in glass substrate and system for manufacturing glass substrate that has through hole
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US10366904B2 (en) 2016-09-08 2019-07-30 Corning Incorporated Articles having holes with morphology attributes and methods for fabricating the same
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WO2018074560A1 (ja) * 2016-10-20 2018-04-26 旭硝子株式会社 孔を有するガラス基板の製造方法、インターポーザの製造方法、およびガラス基板に孔を形成する方法
LT3529214T (lt) 2016-10-24 2021-02-25 Corning Incorporated Substrato apdorojimo stotis lakšto formos stiklo substratų lazeriniam mašininiam apdorojimui
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
JP2019535619A (ja) 2016-11-04 2019-12-12 コーニング インコーポレイテッド 微細穿孔板システム、用途、および微細穿孔板システムを作る方法
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
KR20190116378A (ko) * 2017-03-06 2019-10-14 엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트 전자기 방사선과 후속 에칭공정을 이용해 재료 안으로 적어도 하나의 리세스를 도입하기 위한 방법
CN106848832A (zh) * 2017-04-24 2017-06-13 西南石油大学 一种小型化单巴条端面泵浦脉冲激光器
CN111094962A (zh) 2017-04-28 2020-05-01 康宁股份有限公司 具有晶片水平堆叠和贯穿玻璃通孔(tgv)互联件的玻璃电化学传感器
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US20190024237A1 (en) 2017-07-20 2019-01-24 Corning Incorporated Methods for metalizing vias within a substrate
JP2020531392A (ja) * 2017-08-25 2020-11-05 コーニング インコーポレイテッド アフォーカルビーム調整アセンブリを用いて透明被加工物をレーザ加工するための装置及び方法
WO2019084077A1 (en) 2017-10-27 2019-05-02 Corning Incorporated PASSING GLASS BY MANUFACTURING USING PROTECTIVE MATERIAL
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
WO2019135985A1 (en) 2018-01-03 2019-07-11 Corning Incorporated Methods for making electrodes and providing electrical connections in sensors
US10917966B2 (en) 2018-01-29 2021-02-09 Corning Incorporated Articles including metallized vias
TWI675126B (zh) * 2018-02-14 2019-10-21 國立臺灣大學 針對矽晶圓之經製絨的表面上孔洞之擴孔方法
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
WO2019193862A1 (ja) * 2018-04-05 2019-10-10 パナソニックＩｐマネジメント株式会社 傷形成方法、試料分割方法、半導体素子の製造方法、半導体レーザ素子の製造方法及び半導体レーザ素子
US11152294B2 (en) 2018-04-09 2021-10-19 Corning Incorporated Hermetic metallized via with improved reliability
WO2020061437A1 (en) 2018-09-20 2020-03-26 Industrial Technology Research Institute Copper metallization for through-glass vias on thin glass
WO2020112710A1 (en) 2018-11-27 2020-06-04 Corning Incorporated 3d interposer with through glass vias - method of increasing adhesion between copper and glass surfaces and articles therefrom
KR20210124384A (ko) 2019-02-08 2021-10-14 코닝 인코포레이티드 펄스형 레이저 빔 초점 라인 및 증기 에칭을 사용하여 투명 워크피스를 레이저 가공하는 방법
WO2020171940A1 (en) 2019-02-21 2020-08-27 Corning Incorporated Glass or glass ceramic articles with copper-metallized through holes and processes for making the same
KR20210141570A (ko) 2019-03-21 2021-11-23 코닝 인코포레이티드 환형 볼텍스 레이저 빔을 사용하는 유리-기반 물체에 마이크로-홀을 형성하기 위한 시스템 및 방법
TW202103830A (zh) * 2019-03-25 2021-02-01 美商康寧公司 在玻璃中形成穿孔之方法
JP7591519B2 (ja) 2019-05-10 2024-11-28 コーニング インコーポレイテッド 窓に実装されるトランシーバー部のための透明パッケージ
US11952310B2 (en) 2019-05-10 2024-04-09 Corning Incorporated Silicate glass compositions useful for the efficient production of through glass vias
WO2021003018A1 (en) 2019-07-01 2021-01-07 Corning Incorporated Method of laser processing of transparent workpieces using curved quasi-non-diffracting laser beams
JP7205413B2 (ja) * 2019-08-07 2023-01-17 株式会社Sumco レーザマーク付きシリコンウェーハの製造方法
WO2021064255A1 (en) 2019-10-03 2021-04-08 Orvinum Ag Apparatus for creating a hole in a glass container
WO2021108079A1 (en) 2019-11-27 2021-06-03 Corning Incorporated Fabricating laminate glass with blind vias
CN112894146A (zh) * 2019-12-04 2021-06-04 大族激光科技产业集团股份有限公司 玻璃基板通孔的激光加工方法和装置
WO2022055671A1 (en) * 2020-09-09 2022-03-17 Corning Incorporated Glass substrates with blind vias having depth uniformity and methods for forming the same
WO2022075068A1 (ja) * 2020-10-06 2022-04-14 日本電気硝子株式会社 貫通孔を有するガラス基板
CN116547803A (zh) 2020-11-16 2023-08-04 康宁股份有限公司 具有玻璃通孔的3d中介层-增加铜和玻璃表面之间粘附性的方法及其制品
CN113292236A (zh) * 2021-05-21 2021-08-24 江西沃格光电股份有限公司 一种Mini-LED基板通孔的形成方法及电子设备
KR102605271B1 (ko) 2021-07-13 2023-11-27 주식회사 중우나라 유리기판의 관통홀 형성방법
WO2024118449A1 (en) * 2022-11-30 2024-06-06 Corning Incorporated Systems and methods for laser micromachining substrates using a liquid-assist medium and articles fabricated by the same
CN117263520A (zh) * 2023-08-29 2023-12-22 北方夜视技术股份有限公司 一种铅玻璃通孔微通道板、其制作方法与用途
WO2025164391A1 (ja) * 2024-01-30 2025-08-07 Ａｇｃ株式会社 ガラス基板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008156200A (ja) * 2006-02-22 2008-07-10 Nippon Sheet Glass Co Ltd レーザを用いたガラスの加工方法および加工装置
US20090013724A1 (en) 2006-02-22 2009-01-15 Nippon Sheet Glass Company, Limited Glass Processing Method Using Laser and Processing Device
US20100050692A1 (en) 2008-08-29 2010-03-04 Stephan Lvovich Logunov Laser Patterning of Glass Bodies

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5919607A (en) 1995-10-26 1999-07-06 Brown University Research Foundation Photo-encoded selective etching for glass based microtechnology applications
JP2873937B2 (ja) 1996-05-24 1999-03-24 工業技術院長 ガラスの光微細加工方法
JP3118203B2 (ja) * 1997-03-27 2000-12-18 住友重機械工業株式会社 レーザ加工方法
JP4512786B2 (ja) * 2000-11-17 2010-07-28 独立行政法人産業技術総合研究所 ガラス基板の加工方法
JP2002265233A (ja) 2001-03-05 2002-09-18 Nippon Sheet Glass Co Ltd レーザ加工用母材ガラスおよびレーザ加工用ガラス
US6754429B2 (en) 2001-07-06 2004-06-22 Corning Incorporated Method of making optical fiber devices and devices thereof
JP2003226551A (ja) 2002-02-05 2003-08-12 Nippon Sheet Glass Co Ltd 微細孔を有するガラス板およびその製造方法
CA2428187C (en) * 2002-05-08 2012-10-02 National Research Council Of Canada Method of fabricating sub-micron structures in transparent dielectric materials
US7106342B2 (en) 2002-09-27 2006-09-12 Lg Electronics Inc. Method of controlling brightness of user-selected area for image display device
US7880117B2 (en) * 2002-12-24 2011-02-01 Panasonic Corporation Method and apparatus of drilling high density submicron cavities using parallel laser beams
US6990285B2 (en) * 2003-07-31 2006-01-24 Corning Incorporated Method of making at least one hole in a transparent body and devices made by this method
JP4849890B2 (ja) * 2003-10-06 2012-01-11 Ｈｏｙａ株式会社 貫通孔を有するガラス部品およびその製造方法
JP2005144622A (ja) 2003-11-18 2005-06-09 Seiko Epson Corp 構造体の製造方法、液滴吐出ヘッド、液滴吐出装置
US7057135B2 (en) * 2004-03-04 2006-06-06 Matsushita Electric Industrial, Co. Ltd. Method of precise laser nanomachining with UV ultrafast laser pulses
JP4631044B2 (ja) * 2004-05-26 2011-02-16 国立大学法人北海道大学 レーザ加工方法および装置
KR20060000515A (ko) 2004-06-29 2006-01-06 대주전자재료 주식회사 플라즈마 디스플레이 패널 격벽용 무연 유리 조성물
US20060207976A1 (en) * 2005-01-21 2006-09-21 Bovatsek James M Laser material micromachining with green femtosecond pulses
JP2006290630A (ja) * 2005-02-23 2006-10-26 Nippon Sheet Glass Co Ltd レーザを用いたガラスの加工方法
KR100868228B1 (ko) 2007-12-04 2008-11-11 주식회사 켐트로닉스 유리 기판용 식각액 조성물
US20100119808A1 (en) * 2008-11-10 2010-05-13 Xinghua Li Method of making subsurface marks in glass
EP2392549A4 (en) * 2009-02-02 2014-02-26 Asahi Glass Co Ltd GLASS SUBSTRATE FOR A SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A GLASS SUBSTRATE FOR A SEMICONDUCTOR COMPONENT
DE102010025967B4 (de) * 2010-07-02 2015-12-10 Schott Ag Verfahren zur Erzeugung einer Vielzahl von Löchern, Vorrichtung hierzu und Glas-Interposer
US20120052302A1 (en) 2010-08-24 2012-03-01 Matusick Joseph M Method of strengthening edge of glass article
TWI547454B (zh) * 2011-05-31 2016-09-01 康寧公司 於玻璃中高速製造微孔洞的方法
EP2754524B1 (de) * 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008156200A (ja) * 2006-02-22 2008-07-10 Nippon Sheet Glass Co Ltd レーザを用いたガラスの加工方法および加工装置
US20090013724A1 (en) 2006-02-22 2009-01-15 Nippon Sheet Glass Company, Limited Glass Processing Method Using Laser and Processing Device
US20100050692A1 (en) 2008-08-29 2010-03-04 Stephan Lvovich Logunov Laser Patterning of Glass Bodies

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