KR101905998B1 - 전해동박, 전해동박의 제조 방법, 동장적층판, 프린트 배선판, 프린트 배선판의 제조 방법 및 전자기기의 제조 방법 - Google Patents

전해동박, 전해동박의 제조 방법, 동장적층판, 프린트 배선판, 프린트 배선판의 제조 방법 및 전자기기의 제조 방법 Download PDF

Info

Publication number
KR101905998B1
KR101905998B1 KR1020160149217A KR20160149217A KR101905998B1 KR 101905998 B1 KR101905998 B1 KR 101905998B1 KR 1020160149217 A KR1020160149217 A KR 1020160149217A KR 20160149217 A KR20160149217 A KR 20160149217A KR 101905998 B1 KR101905998 B1 KR 101905998B1
Authority
KR
South Korea
Prior art keywords
layer
copper foil
electrolytic copper
less
treatment layer
Prior art date
Application number
KR1020160149217A
Other languages
English (en)
Korean (ko)
Other versions
KR20170055004A (ko
Inventor
켄지 이누카이
요스케 코바야시
카즈히코 이이다
Original Assignee
제이엑스금속주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제이엑스금속주식회사 filed Critical 제이엑스금속주식회사
Publication of KR20170055004A publication Critical patent/KR20170055004A/ko
Application granted granted Critical
Publication of KR101905998B1 publication Critical patent/KR101905998B1/ko

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1020160149217A 2015-11-10 2016-11-10 전해동박, 전해동박의 제조 방법, 동장적층판, 프린트 배선판, 프린트 배선판의 제조 방법 및 전자기기의 제조 방법 KR101905998B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015220764 2015-11-10
JPJP-P-2015-220764 2015-11-10
JP2015250475 2015-12-22
JPJP-P-2015-250475 2015-12-22

Publications (2)

Publication Number Publication Date
KR20170055004A KR20170055004A (ko) 2017-05-18
KR101905998B1 true KR101905998B1 (ko) 2018-10-08

Family

ID=59048932

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160149217A KR101905998B1 (ko) 2015-11-10 2016-11-10 전해동박, 전해동박의 제조 방법, 동장적층판, 프린트 배선판, 프린트 배선판의 제조 방법 및 전자기기의 제조 방법

Country Status (4)

Country Link
KR (1) KR101905998B1 (zh)
CN (1) CN107018623B (zh)
MY (1) MY190542A (zh)
TW (1) TWI597390B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2019208520A1 (ja) * 2018-04-27 2021-06-17 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
LU101698B1 (en) * 2020-03-18 2021-09-20 Circuit Foil Luxembourg Surface-treated copper foil for high-frequency circuit and method for producing same
US11540389B1 (en) * 2021-07-06 2022-12-27 Chang Chun Petrochemical Co., Ltd. Surface-treated copper foil and copper clad laminate
CN115413119B (zh) * 2021-07-06 2023-03-24 长春石油化学股份有限公司 表面处理铜箔及铜箔基板
US12060647B2 (en) 2021-07-06 2024-08-13 Chang Chun Petrochemical Co., Ltd. Surface-treated copper foil and copper clad laminate
CN114182308B (zh) * 2021-12-01 2023-11-10 江西省科学院能源研究所 一种用于制备电解铜箔的添加剂及电解铜箔的制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308477A (ja) * 2000-04-26 2001-11-02 Mitsui Mining & Smelting Co Ltd 表面処理銅箔、キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法並びに銅張積層板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3313277B2 (ja) * 1995-09-22 2002-08-12 古河サーキットフォイル株式会社 ファインパターン用電解銅箔とその製造方法
JP3295308B2 (ja) * 1996-06-28 2002-06-24 株式会社日鉱マテリアルズ 電解銅箔
DE112007001861B4 (de) * 2006-08-08 2022-08-11 World Properties, Inc. Schaltungsmaterial mit verbesserter Bindung, Verfahren zu dessen Herstellung und mehrschichtige Schaltung
FR2990565B1 (fr) * 2012-05-09 2016-10-28 Commissariat Energie Atomique Procede de realisation de detecteurs infrarouges
JP5885791B2 (ja) * 2013-08-20 2016-03-15 Ｊｘ金属株式会社 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、銅箔、プリント配線板、電子機器、電子機器の製造方法、並びに、プリント配線板の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308477A (ja) * 2000-04-26 2001-11-02 Mitsui Mining & Smelting Co Ltd 表面処理銅箔、キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法並びに銅張積層板

Also Published As

Publication number Publication date
MY190542A (en) 2022-04-27
TWI597390B (zh) 2017-09-01
KR20170055004A (ko) 2017-05-18
CN107018623B (zh) 2020-03-06
CN107018623A (zh) 2017-08-04
TW201730381A (zh) 2017-09-01

Similar Documents

Publication Publication Date Title
KR101905998B1 (ko) 전해동박, 전해동박의 제조 방법, 동장적층판, 프린트 배선판, 프린트 배선판의 제조 방법 및 전자기기의 제조 방법
KR101851882B1 (ko) 표면 처리 동박, 캐리어가 형성된 동박, 기재, 수지 기재, 프린트 배선판, 구리 피복 적층판 및 프린트 배선판의 제조 방법
JP6640567B2 (ja) キャリア付銅箔、積層体、プリント配線板、電子機器の製造方法及びプリント配線板の製造方法
WO2018207786A1 (ja) 電解銅箔、銅張積層板、プリント配線板及びその製造方法、並びに電子機器及びその製造方法
KR101909352B1 (ko) 표면 처리 동박, 캐리어가 부착된 동박, 기재, 수지 기재, 프린트 배선판, 구리 피복 적층판 및 프린트 배선판의 제조 방법
KR20160108328A (ko) 표면 처리 동박, 캐리어가 부착된 동박, 프린트 배선판, 구리 피복 적층판, 적층체 및 프린트 배선판의 제조 방법
US10820414B2 (en) Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
KR101797333B1 (ko) 캐리어 부착 동박
KR20150126008A (ko) 캐리어 부착 동박, 그것을 사용한 구리 피복 적층판, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법
KR20180064311A (ko) 표면 처리 동박, 캐리어 부착 동박, 적층체, 프린트 배선판의 제조 방법 및 전자기기의 제조 방법
KR101822251B1 (ko) 구리박, 캐리어 부착 구리박, 구리 피복 적층체, 프린트 배선판, 반도체 패키지용 회로 형성 기판, 반도체 패키지, 전자 기기, 수지 기재, 회로의 형성 방법, 세미 애디티브 공법, 프린트 배선판의 제조 방법
KR101793799B1 (ko) 캐리어 부착 동박
JP5997080B2 (ja) キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法
JP6328821B2 (ja) 電解銅箔、電解銅箔の製造方法、銅張積層板、プリント配線板、プリント配線板の製造方法及び電子機器の製造方法
US10602620B2 (en) Laminate for printed wiring board, method of manufacturing printed wiring board, and method of manufacturing electronic device
JP6396967B2 (ja) キャリア付銅箔及びキャリア付き銅箔を用いた銅張積層板
JP6821370B2 (ja) キャリア付金属箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JP6522974B2 (ja) キャリア付銅箔、積層体、積層体の製造方法、及び、プリント配線板の製造方法
TWI691622B (zh) 電解銅箔及其製造方法、覆銅積層板、印刷配線板及其製造方法、以及電子機器及其製造方法
TWI690622B (zh) 電解銅箔及其製造方法、覆銅積層板、印刷配線板及其製造方法、以及電子機器及其製造方法
JP2017013473A (ja) キャリア付銅箔、銅張積層板、積層体、プリント配線板、コアレス基板、電子機器及びコアレス基板の製造方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application
AMND Amendment
X701 Decision to grant (after re-examination)
GRNT Written decision to grant