KR101895630B1 - 기판 세정 장치 및 그것을 구비한 기판 처리 장치 - Google Patents

기판 세정 장치 및 그것을 구비한 기판 처리 장치 Download PDF

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Publication number
KR101895630B1
KR101895630B1 KR1020130024972A KR20130024972A KR101895630B1 KR 101895630 B1 KR101895630 B1 KR 101895630B1 KR 1020130024972 A KR1020130024972 A KR 1020130024972A KR 20130024972 A KR20130024972 A KR 20130024972A KR 101895630 B1 KR101895630 B1 KR 101895630B1
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KR
South Korea
Prior art keywords
substrate
cleaning
filter
air
processing
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Expired - Fee Related
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KR1020130024972A
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English (en)
Korean (ko)
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KR20130110020A (ko
Inventor
고지 니시야마
Original Assignee
가부시키가이샤 스크린 세미컨덕터 솔루션즈
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Publication of KR20130110020A publication Critical patent/KR20130110020A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/60—Cleaning only by mechanical processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
    • B01D46/0002—Casings; Housings; Frame constructions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020130024972A 2012-03-27 2013-03-08 기판 세정 장치 및 그것을 구비한 기판 처리 장치 Expired - Fee Related KR101895630B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-072455 2012-03-27
JP2012072455A JP6061484B2 (ja) 2012-03-27 2012-03-27 基板洗浄装置およびそれを備えた基板処理装置

Publications (2)

Publication Number Publication Date
KR20130110020A KR20130110020A (ko) 2013-10-08
KR101895630B1 true KR101895630B1 (ko) 2018-09-05

Family

ID=49232912

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130024972A Expired - Fee Related KR101895630B1 (ko) 2012-03-27 2013-03-08 기판 세정 장치 및 그것을 구비한 기판 처리 장치

Country Status (4)

Country Link
US (1) US9460941B2 (https=)
JP (1) JP6061484B2 (https=)
KR (1) KR101895630B1 (https=)
TW (1) TWI525675B (https=)

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* Cited by examiner, † Cited by third party
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JP5847743B2 (ja) * 2013-02-20 2016-01-27 富士フイルム株式会社 バリア性積層体およびガスバリアフィルム
JP6181438B2 (ja) * 2013-06-24 2017-08-16 株式会社荏原製作所 基板保持装置および基板洗浄装置
JP6339203B2 (ja) 2013-12-23 2018-06-06 コリア リサーチ インスティチュート オブ ケミカル テクノロジーＫｏｒｅａ Ｒｅｓｅａｒｃｈ Ｉｎｓｔｉｔｕｔｅ Ｏｆ Ｃｈｅｍｉｃａｌ Ｔｅｃｈｎｏｌｏｇｙ 無機・有機ハイブリッドペロブスカイト化合物の前駆物質
US10037902B2 (en) 2015-03-27 2018-07-31 SCREEN Holdings Co., Ltd. Substrate processing device and substrate processing method
JP6726575B2 (ja) * 2016-02-01 2020-07-22 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置、基板処理装置、基板洗浄方法および基板処理方法
US10276365B2 (en) 2016-02-01 2019-04-30 SCREEN Holdings Co., Ltd. Substrate cleaning device, substrate processing apparatus, substrate cleaning method and substrate processing method
JP6684191B2 (ja) * 2016-09-05 2020-04-22 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置およびそれを備える基板処理装置
US11698506B2 (en) * 2020-11-24 2023-07-11 Applied Materials, Inc. Carrier mechanism for cleaning and handling
JP7558043B2 (ja) 2020-11-30 2024-09-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及び基板処理方法
CN116705661B (zh) * 2023-06-27 2024-10-08 若名芯装备(苏州)有限公司 一种基板单面和侧面清洗装置以及清洗方法、清洗流水线

Citations (1)

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JP2007115795A (ja) * 2005-10-19 2007-05-10 Hitachi High-Technologies Corp 基板裏面のドライ洗浄方法とその装置

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JPS58128737A (ja) * 1982-01-27 1983-08-01 Toshiba Corp ウエハ乾燥装置
KR100248564B1 (ko) * 1992-04-07 2000-03-15 다카시마 히로시 스핀 드라이어
US5487768A (en) * 1994-01-31 1996-01-30 Zytka; Donald J. Minienvironment for material handling
JP3380663B2 (ja) 1995-11-27 2003-02-24 大日本スクリーン製造株式会社 基板処理装置
JP3794808B2 (ja) * 1998-01-12 2006-07-12 大日本スクリーン製造株式会社 基板処理装置
AU2001270205A1 (en) 2000-06-26 2002-01-08 Applied Materials, Inc. Method and apparatus for wafer cleaning
JP2002164314A (ja) * 2000-11-27 2002-06-07 Dainippon Screen Mfg Co Ltd 回転支持板およびそれを用いた基板処理装置
TW589676B (en) * 2002-01-22 2004-06-01 Toho Kasei Co Ltd Substrate drying method and apparatus
US7011715B2 (en) 2003-04-03 2006-03-14 Applied Materials, Inc. Rotational thermophoretic drying
JP4649820B2 (ja) * 2003-04-08 2011-03-16 凸版印刷株式会社 回転塗布装置への清浄な空気の供給方法
JP2006019584A (ja) 2004-07-02 2006-01-19 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4410119B2 (ja) * 2005-02-03 2010-02-03 東京エレクトロン株式会社 洗浄装置、塗布、現像装置及び洗浄方法
JP5192206B2 (ja) 2007-09-13 2013-05-08 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP4939376B2 (ja) 2007-11-13 2012-05-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
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JP5117365B2 (ja) * 2008-02-15 2013-01-16 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
JP5430873B2 (ja) * 2008-04-16 2014-03-05 株式会社Ｓｏｋｕｄｏ 基板洗浄装置およびそれを備えた基板処理装置
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KR101958874B1 (ko) 2008-06-04 2019-03-15 가부시키가이샤 에바라 세이사꾸쇼 기판처리장치, 기판처리방법, 기판 파지기구, 및 기판 파지방법
TWI550705B (zh) 2008-06-04 2016-09-21 荏原製作所股份有限公司 硏磨裝置及硏磨方法

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Publication number Publication date
US9460941B2 (en) 2016-10-04
TW201340190A (zh) 2013-10-01
KR20130110020A (ko) 2013-10-08
TWI525675B (zh) 2016-03-11
JP6061484B2 (ja) 2017-01-18
US20130255031A1 (en) 2013-10-03
JP2013206992A (ja) 2013-10-07

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