TWI525675B - 基板清潔裝置及具備其之基板處理裝置 - Google Patents

基板清潔裝置及具備其之基板處理裝置 Download PDF

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Publication number
TWI525675B
TWI525675B TW101150669A TW101150669A TWI525675B TW I525675 B TWI525675 B TW I525675B TW 101150669 A TW101150669 A TW 101150669A TW 101150669 A TW101150669 A TW 101150669A TW I525675 B TWI525675 B TW I525675B
Authority
TW
Taiwan
Prior art keywords
substrate
cleaning
air
filter
rotating member
Prior art date
Application number
TW101150669A
Other languages
English (en)
Chinese (zh)
Other versions
TW201340190A (zh
Inventor
西山耕二
Original Assignee
斯克林半導體科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 斯克林半導體科技有限公司 filed Critical 斯克林半導體科技有限公司
Publication of TW201340190A publication Critical patent/TW201340190A/zh
Application granted granted Critical
Publication of TWI525675B publication Critical patent/TWI525675B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/60—Cleaning only by mechanical processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
    • B01D46/0002—Casings; Housings; Frame constructions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW101150669A 2012-03-27 2012-12-27 基板清潔裝置及具備其之基板處理裝置 TWI525675B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012072455A JP6061484B2 (ja) 2012-03-27 2012-03-27 基板洗浄装置およびそれを備えた基板処理装置

Publications (2)

Publication Number Publication Date
TW201340190A TW201340190A (zh) 2013-10-01
TWI525675B true TWI525675B (zh) 2016-03-11

Family

ID=49232912

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101150669A TWI525675B (zh) 2012-03-27 2012-12-27 基板清潔裝置及具備其之基板處理裝置

Country Status (4)

Country Link
US (1) US9460941B2 (https=)
JP (1) JP6061484B2 (https=)
KR (1) KR101895630B1 (https=)
TW (1) TWI525675B (https=)

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* Cited by examiner, † Cited by third party
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JP5847743B2 (ja) * 2013-02-20 2016-01-27 富士フイルム株式会社 バリア性積層体およびガスバリアフィルム
JP6181438B2 (ja) * 2013-06-24 2017-08-16 株式会社荏原製作所 基板保持装置および基板洗浄装置
JP6339203B2 (ja) 2013-12-23 2018-06-06 コリア リサーチ インスティチュート オブ ケミカル テクノロジーＫｏｒｅａ Ｒｅｓｅａｒｃｈ Ｉｎｓｔｉｔｕｔｅ Ｏｆ Ｃｈｅｍｉｃａｌ Ｔｅｃｈｎｏｌｏｇｙ 無機・有機ハイブリッドペロブスカイト化合物の前駆物質
US10037902B2 (en) 2015-03-27 2018-07-31 SCREEN Holdings Co., Ltd. Substrate processing device and substrate processing method
JP6726575B2 (ja) * 2016-02-01 2020-07-22 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置、基板処理装置、基板洗浄方法および基板処理方法
US10276365B2 (en) 2016-02-01 2019-04-30 SCREEN Holdings Co., Ltd. Substrate cleaning device, substrate processing apparatus, substrate cleaning method and substrate processing method
JP6684191B2 (ja) * 2016-09-05 2020-04-22 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置およびそれを備える基板処理装置
US11698506B2 (en) * 2020-11-24 2023-07-11 Applied Materials, Inc. Carrier mechanism for cleaning and handling
JP7558043B2 (ja) 2020-11-30 2024-09-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及び基板処理方法
CN116705661B (zh) * 2023-06-27 2024-10-08 若名芯装备(苏州)有限公司 一种基板单面和侧面清洗装置以及清洗方法、清洗流水线

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KR100248564B1 (ko) * 1992-04-07 2000-03-15 다카시마 히로시 스핀 드라이어
US5487768A (en) * 1994-01-31 1996-01-30 Zytka; Donald J. Minienvironment for material handling
JP3380663B2 (ja) 1995-11-27 2003-02-24 大日本スクリーン製造株式会社 基板処理装置
JP3794808B2 (ja) * 1998-01-12 2006-07-12 大日本スクリーン製造株式会社 基板処理装置
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JP2002164314A (ja) * 2000-11-27 2002-06-07 Dainippon Screen Mfg Co Ltd 回転支持板およびそれを用いた基板処理装置
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TWI550705B (zh) 2008-06-04 2016-09-21 荏原製作所股份有限公司 硏磨裝置及硏磨方法

Also Published As

Publication number Publication date
US9460941B2 (en) 2016-10-04
TW201340190A (zh) 2013-10-01
KR20130110020A (ko) 2013-10-08
JP6061484B2 (ja) 2017-01-18
US20130255031A1 (en) 2013-10-03
KR101895630B1 (ko) 2018-09-05
JP2013206992A (ja) 2013-10-07

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