KR101886313B1 - 전자부품실장장치 - Google Patents

전자부품실장장치 Download PDF

Info

Publication number
KR101886313B1
KR101886313B1 KR1020110133656A KR20110133656A KR101886313B1 KR 101886313 B1 KR101886313 B1 KR 101886313B1 KR 1020110133656 A KR1020110133656 A KR 1020110133656A KR 20110133656 A KR20110133656 A KR 20110133656A KR 101886313 B1 KR101886313 B1 KR 101886313B1
Authority
KR
South Korea
Prior art keywords
substrate
stage
stages
electronic component
moving
Prior art date
Application number
KR1020110133656A
Other languages
English (en)
Korean (ko)
Other versions
KR20120065952A (ko
Inventor
지로우 오바마
타다시 카토우
Original Assignee
쥬키 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쥬키 가부시키가이샤 filed Critical 쥬키 가부시키가이샤
Publication of KR20120065952A publication Critical patent/KR20120065952A/ko
Application granted granted Critical
Publication of KR101886313B1 publication Critical patent/KR101886313B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1020110133656A 2010-12-13 2011-12-13 전자부품실장장치 KR101886313B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2010-277432 2010-12-13
JP2010277432A JP5616770B2 (ja) 2010-12-13 2010-12-13 電子部品実装装置

Publications (2)

Publication Number Publication Date
KR20120065952A KR20120065952A (ko) 2012-06-21
KR101886313B1 true KR101886313B1 (ko) 2018-08-08

Family

ID=46353956

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110133656A KR101886313B1 (ko) 2010-12-13 2011-12-13 전자부품실장장치

Country Status (3)

Country Link
JP (1) JP5616770B2 (zh)
KR (1) KR101886313B1 (zh)
CN (1) CN102548384A (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101321322B1 (ko) 2011-04-22 2013-10-23 시바우라 메카트로닉스 가부시끼가이샤 기판 반송 장치 및 반송 방법
JP6106065B2 (ja) * 2013-11-05 2017-03-29 ヤマハ発動機株式会社 部品実装装置
JP2016018884A (ja) * 2014-07-08 2016-02-01 ヤマハ発動機株式会社 部品実装装置
WO2019043903A1 (ja) * 2017-09-01 2019-03-07 ヤマハ発動機株式会社 部品実装方法および部品実装装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000340992A (ja) * 1999-05-31 2000-12-08 Sanyo Electric Co Ltd 電子部品装着装置
US20020062553A1 (en) 2000-11-24 2002-05-30 Mirae Corporation Surface mounting device and method thereof
JP2002217592A (ja) * 2001-01-18 2002-08-02 Matsushita Electric Ind Co Ltd 電子部品実装装置
JP2003188593A (ja) 2001-11-21 2003-07-04 Mirae Corp 電子部品の実装方法
JP2004128244A (ja) 2002-10-03 2004-04-22 Matsushita Electric Ind Co Ltd 基板搬送下受け装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3652242B2 (ja) 2000-12-08 2005-05-25 松下電器産業株式会社 電子部品実装装置における基板搬送方法
JP4303463B2 (ja) * 2002-11-29 2009-07-29 パナソニック株式会社 基板搬送装置及び部品実装における基板搬送方法
JP4354845B2 (ja) * 2004-02-25 2009-10-28 Ｊｕｋｉ株式会社 電子部品搭載装置
US8276263B2 (en) * 2006-06-29 2012-10-02 Yamaha Hatsudoki Kabushiki Kaisha Surface mounting apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000340992A (ja) * 1999-05-31 2000-12-08 Sanyo Electric Co Ltd 電子部品装着装置
US20020062553A1 (en) 2000-11-24 2002-05-30 Mirae Corporation Surface mounting device and method thereof
JP2002198693A (ja) 2000-11-24 2002-07-12 Mirae Corp 表面実装装置及びその方法
JP2002217592A (ja) * 2001-01-18 2002-08-02 Matsushita Electric Ind Co Ltd 電子部品実装装置
JP2003188593A (ja) 2001-11-21 2003-07-04 Mirae Corp 電子部品の実装方法
JP2004128244A (ja) 2002-10-03 2004-04-22 Matsushita Electric Ind Co Ltd 基板搬送下受け装置

Also Published As

Publication number Publication date
KR20120065952A (ko) 2012-06-21
JP2012129254A (ja) 2012-07-05
CN102548384A (zh) 2012-07-04
JP5616770B2 (ja) 2014-10-29

Similar Documents

Publication Publication Date Title
KR101886313B1 (ko) 전자부품실장장치
JP6126694B2 (ja) 基板搬送装置
TW200930643A (en) Solar battery module transfer line
CN106068074B (zh) 基板输送装置及电子部件安装装置
KR101910354B1 (ko) 반도체 패키지의 트레이 자동교체장치
JP2022063292A (ja) 搬送システム及び加工システム
JP4922863B2 (ja) 表面実装装置
JP4386396B2 (ja) 部品実装システムにおける基板搬送方法及び基板搬送装置
JP5751583B2 (ja) 基板搬送装置、電子部品実装機、基板搬送方法、電子部品実装方法
JP4499661B2 (ja) 基板搬送方法および装置
KR20150022695A (ko) 기계를 위한 공정 스테이션뿐만 아니라 기계의 공정에서 움직임을 제어하기 위한 제어 디바이스 및 제어 방법
US9443717B2 (en) Conveyance system and conveyance method
JP6792631B2 (ja) 基板作業装置
JP2004238137A (ja) 搬送装置
JPH07206129A (ja) 基板搬送装置
CN114955515B (zh) 处理系统
KR102336186B1 (ko) 노광장치
JP7385534B2 (ja) 搬送装置、基板処理装置
JP5047856B2 (ja) 基板処理装置
CN106455468A (zh) 电子部件供给装置及电子部件安装装置
JPH03192015A (ja) 移載装置
JP3015800B6 (ja) 表面実装機
JPH1093294A (ja) 表面実装機
JP2023048658A (ja) 板状ワークの位置決め搬送装置
JP5847318B2 (ja) 光無線通信器を有する駆動装置

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
GRNT Written decision to grant